Abstract: An aluminum alloy fin material for heat exchanger use excellent in buckling resistance which, even if the fin material is reduced to a final sheet thickness of 30 to 80 ?m, is excellent in formability at the time of corrugation, has a suitable strength before brazing enabling easy fin formation, exhibits a suitable self corrosion resistance and sacrificial anode effect, and is high in strength as a material for forming working fluid passages is provided. By mass %, Si: 1.3% to 1.6%, Fe: 0.30% to 0.70%, Mn: 1.8% to 2.3%, Zn: 0.5% to 2.0%, and Ti: 0.002% to 0.10% are contained, as impurities, Mg is limited to 0.05% or less and Cu is limited to 0.06% or less, and the balance is unavoidable impurities and Al, a final sheet thickness is 30 to 80 ?m, a tensile strength is 260 MPa or less, a solidus temperature is 615° C. or more, and further a tensile strength when measured after brazing heating then cooling, is 170 MPa or more and a spontaneous potential is ?780 mV to ?700 mV.

Abstract: An aluminum alloy fin material for heat exchanger use having a 35 to 50 ?m thickness, a small springback at the time of corrugation, a suitable strength before brazing enabling easy fin formation, a high strength after brazing, and excellent erosion resistance, self corrosion resistance, and sacrificial anodic effect and a method of production of the same are provided. A fin material containing, by mass %, Si: 0.9 to 1.2%, Fe: 0.8 to 1.1%, Mn: 1.1 to 1.4%, and Zn: 0.9 to 1.1%, further limiting the impurity Mg to 0.05% or less, Cu to 0.03% or less, and ([Si]+[Fe]+2[Mn])/3 to 1.4% to 1.6%, and having a balance of unavoidable impurities and Al. A method of production prescribing hot rolling, cold rolling, intermediate annealing, and final cold rolling.

Abstract: A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500?R?surface pressure (N/mm2)×2000+12000.

Abstract: There is provided a liquid-cooled integrated substrate 1 in which a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramic substrate 10, one surface of a plate-like metal base plate 20 made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate 10, and a liquid-cooling type radiator 30 composed of a porous pipe composed of an extrusion material is bonded to another flat surface of the metal base plate 20 by brazing, wherein a relation between a thickness t1 of the metal circuit board 15 and a thickness t2 of the metal base plate 20 satisfies t2/t1?2 where the thickness t1 of the metal circuit board 15 is 0.4 to 3 mm and the thickness t2 of the metal base plate 20 is 0.8 to 6 mm.

Abstract: An aluminum alloy fin material for heat exchanger use having a 35 to 50 ?m thickness, a small springback at the time of corrugation, a suitable strength before brazing enabling easy fin formation, a high strength after brazing, and excellent erosion resistance, self corrosion resistance, and sacrificial anodic effect and a method of production of the same are provided. A fin material containing, by mass %, Si: 0.9 to 1.2%, Fe: 0.8 to 1.1%, Mn: 1.1 to 1.4%, and Zn: 0.9 to 1.1%, further limiting the impurity Mg to 0.05% or less, Cu to 0.03% or less, and ([Si]+[Fe]+2[Mn])/3 to 1.4% to 1.6%, and having a balance of unavoidable impurities and Al. A method of production prescribing hot rolling, cold rolling, intermediate annealing, and final cold rolling.

Abstract: A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500?R?surface pressure (N/mm2)×2000+12000.

Abstract: There is provide a liquid-cooled integrated substrate which has reduced material cost and processing cost, is reduced in warpage (shape deformation) as an integrated substrate, and has excellent strength and heat radiation performance, and a manufacturing method of the liquid-cooled integrated substrate. There is provided a liquid-cooled integrated substrate 1 in which a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramic substrate 10, one surface of a plate-like metal base plate 20 made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate 10, and a liquid-cooling type radiator 30 composed of an extrusion material is bonded to another surface of the metal base plate 20, wherein a relation between a thickness t1 of the metal circuit board 15 and a thickness t2 of the metal base plate 20 satisfies t2/t1?2 where the thickness t1 of the metal circuit board 15 is 0.4 to 3 mm and the thickness t2 of the metal base plate 20 is 0.