Patents by Inventor Takanori Miya

Takanori Miya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220251298
    Abstract: An embodiment of the present invention relates to an organic electronics material which includes a charge-transporting polymer comprising a structural unit represented by formula (1), at least one structural unit selected from the group consisting of structural units represented by formula (2-1) and structural units represented by formula (2-2), a structural unit represented by formula (3), and at least one structural unit selected from the group consisting of structural units represented by formula (4-1) and structural units represented by formula (4-2).
    Type: Application
    Filed: April 26, 2019
    Publication date: August 11, 2022
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kazuyuki KAMO, Iori FUKUSHIMA, Kenichi ISHITSUKA, Takanori MIYA
  • Publication number: 20220216415
    Abstract: An embodiment of the present invention pertains to an organic electronics material containing a charge-transporting polymer which includes: a structural unit represented by formula (1); at least one structural unit selected from the group consisting of a structural unit represented by formula (2-1) and a structural unit represented by formula (2-2); and a structural unit which is represented by formula (3) an of which an amount is 85-100 mol % with respect to the total amount of monovalent structural units.
    Type: Application
    Filed: April 26, 2019
    Publication date: July 7, 2022
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kazuyuki KAMO, Iori FUKUSHIMA, Kenichi ISHITSUKA, Takanori MIYA
  • Patent number: 7994804
    Abstract: The electronic component tester includes: a socket configured to supply power to connection terminals for operating an electronic component; an electronic component mount member on which the electronic component is to be mounted; and a temperature adjusting member which is configured to come into contact with the electronic component mount member to keep the electronic component at a predetermined temperature. The electronic component mount member includes a heat transfer plate on which the electronic component is to be mounted and which is configured to come into contact with the temperature adjusting member, and an electronic component cover for covering the electronic component. The heat transfer plate includes through holes.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: August 9, 2011
    Assignee: Panasonic Corporation
    Inventors: Takanori Miya, Isao Hayami, Shoichi Tanaka
  • Publication number: 20100127712
    Abstract: The electronic component tester includes: a socket configured to supply power to connection terminals for operating an electronic component; an electronic component mount member on which the electronic component is to be mounted; and a temperature adjusting member which is configured to come into contact with the electronic component mount member to keep the electronic component at a predetermined temperature. The electronic component mount member includes a heat transfer plate on which the electronic component is to be mounted and which is configured to come into contact with the temperature adjusting member, and an electronic component cover for covering the electronic component. The heat transfer plate includes through holes.
    Type: Application
    Filed: October 15, 2009
    Publication date: May 27, 2010
    Inventors: Takanori Miya, Isao Hayami, Shoichi Tanaka