Abstract: The variation between different product lots is reduced for plating growth dimensions of plated films to serve as external electrodes. The correlation is grasped in advance among the surface resistance value of a ceramic body, the applying charge amount for electrolytic plating, an actual plating growth dimension obtained when the ceramic body with the surface resistance value is subjected to plating with the foregoing applying charge amount. The surface resistance value is measured for the ceramic body on which plated films to serve as external electrodes are to be formed by applying electrolytic plating, and the applying charge amount required for plating is determined by applying the surface resistance value and a designed value for an intended plating growth dimension to the correlation mentioned above. Thereafter, in order to form the plated films, the ceramic body is subjected to electrolytic plating, with the applying charge amount determined.

Abstract: An electronic component capable of suppressing variations in dimension of plating growth of a plating film serving as an external electrode. The external electrodes include plating films formed so as to extend from each of end surfaces to side surfaces of an electronic component body by electrolytic plating. Underlying main electrodes in which the degree of plating growth is relatively high, and underlying sub-electrodes in which the degree of plating growth is relatively low, are formed as a seed electrode serving as a starting point of plating growth for forming a plating film.

Abstract: An electronic component capable of suppressing variations in dimension of plating growth of a plating film serving as an external electrode. The external electrodes include plating films formed so as to extend from each of end surfaces to side surfaces of an electronic component body by electrolytic plating. Underlying main electrodes in which the degree of plating growth is relatively high, and underlying sub-electrodes in which the degree of plating growth is relatively low, are formed as a seed electrode serving as a starting point of plating growth for forming a plating film.

Abstract: The variation between different product lots is reduced for plating growth dimensions of plated films to serve as external electrodes. The correlation is grasped in advance among the surface resistance value of a ceramic body, the applying charge amount for electrolytic plating, an actual plating growth dimension obtained when the ceramic body with the surface resistance value is subjected to plating with the foregoing applying charge amount. The surface resistance value is measured for the ceramic body on which plated films to serve as external electrodes are to be formed by applying electrolytic plating, and the applying charge amount required for plating is determined by applying the surface resistance value and a designed value for an intended plating growth dimension to the correlation mentioned above. Thereafter, in order to form the plated films, the ceramic body is subjected to electrolytic plating, with the applying charge amount determined.