Patents by Inventor Takanori SHIMAZAKI

Takanori SHIMAZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER ALLOY, JOINT PORTION, JOINING MATERIAL, SOLDER PASTE, JOINT STRUCTURE, AND ELECTRONIC CONTROL DEVICE
    Publication number: 20240066638
    Abstract: A solder alloy includes 45 mass % or more and 63 mass % or less of Bi, 0.1 mass % or more and less than 0.7 mass % of Sb, 0.05 mass % or more and 1 mass % or less of In, and a balance including Sn.
    Type: Application
    Filed: June 28, 2023
    Publication date: February 29, 2024
    Applicant: TAMURA CORPORATION
    Inventors: Takanori SHIMAZAKI, Daisuke MARUYAMA, Genki OCHI, Masaya ARAI
  • Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device
    Patent number: 11724341
    Abstract: A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: August 15, 2023
    Assignee: TAMURA CORPORATION
    Inventors: Yurika Munekawa, Takeshi Nakano, Masaya Arai, Takanori Shimazaki, Tsukasa Katsuyama
  • Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device
    Patent number: 11691226
    Abstract: A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: July 4, 2023
    Assignee: TAMURA CORPORATION
    Inventors: Yurika Munekawa, Takeshi Nakano, Masaya Arai, Takanori Shimazaki, Tsukasa Katsuyama
  • LEAD-FREE SOLDER ALLOY, SOLDER JOINING MATERIAL, ELECTRONIC CIRCUIT MOUNTING SUBSTRATE, AND ELECTRONIC CONTROL DEVICE
    Publication number: 20210001433
    Abstract: A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.
    Type: Application
    Filed: September 16, 2020
    Publication date: January 7, 2021
    Applicant: TAMURA CORPORATION
    Inventors: Yurika MUNEKAWA, Takeshi NAKANO, Masaya ARAI, Takanori SHIMAZAKI, Tsukasa KATSUYAMA
  • LEAD-FREE SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
    Publication number: 20190210161
    Abstract: A lead-free solder alloy includes 1 mass % or more and 4 mass % or less of Ag, 0.1 mass % or more and 1 mass % or less of Cu, 1.5 mass % or more and 5 mass % or less of Sb, 1 mass % or more and 6 mass % or less of In, and Sn.
    Type: Application
    Filed: March 18, 2019
    Publication date: July 11, 2019
    Applicant: TAMURA CORPORATION
    Inventors: Masaya ARAI, Tsukasa KATSUYAMA, Yurika MUNEKAWA, Takanori SHIMAZAKI