Abstract: In a vehicle molding attached to a vehicle body part, a clip, to attach a molding body onto a body-part edge portion, is provided with an insertion part, into which the body-part edge portion is inserted; an engaging portion configured to engage with an engagement-receiving portion, provided on the body-part edge portion in a state where the edge portion is inserted into the insertion part, whereby a relative movement is restricted in a removal direction; and a biaser which elastically deforms upon abutting against the body-part edge portion that is inserted into the insertion part, the biaser applying a force that engages the engaging portion with the engagement-receiving portion by a restorative force of the elastic deformation of the biaser. Accordingly, the vehicle molding can be securely and reliably attached at a proper position while having a simple structure.

Abstract: A microparticle detection system includes a stage unit including a mounting surface on which a fluid device having a flow path through which a sample containing microparticles is movable is capable of being mounted, an emission unit configured to emit illumination light to the flow path, an imaging unit configured to image scattered light generated from microparticles in the sample when illumination light is emitted, an identification unit configured to identify the microparticles included in the image for each of the microparticles on the basis of the image captured by the imaging unit, a particle size determination unit configured to determine a particle size of the microparticle for each of the microparticles identified by the identification unit, a zeta potential determination unit configured to determine a zeta potential of the microparticle for each of the microparticles identified by the identification unit, and a correlation unit configured to associate the particle size for each of the microparticles

Abstract: A photoelectric conversion device, comprising a semiconductor substrate on which a plurality of pixels are arrayed, and an insulating member which is transparent and configured to cover the semiconductor substrate, wherein the insulating member includes at least three portions whose thickness are different from each other so as to increase types of wavelengths of light that are to be ripple reduction targets.

Abstract: In an optical module including an optical axis adjustment mechanism, the reliability of fixation of a movable portion is enhanced while an adhesive is prevented from flowing out to an unintended portion. An optical module includes an element portion, a manipulation lever, a bank, a support spring, and a reservoir portion. The bank includes a lever-opposing portion having a step face facing a longitudinal side face of the manipulation lever. The support spring is connected at both ends to the element portion and the bank. The reservoir portion is surrounded in a bay shape, in a plan view, by the manipulation lever, the element portion, the support spring, and the bank and stores the adhesive fixing the lever to the substrate. The reservoir portion includes, in the vicinity of a handle of the manipulation lever, an outflow blocking portion blocking the outflow of the adhesive before curing.

Abstract: An optical device includes a first substrate, having first and second surfaces, and a second substrate having a third surface. The first substrate includes: a laser unit, having an active layer and emitting light into the first substrate from the active layer; a reflecting mirror, having a plane obliquely intersecting an optical axis of light emitted from the laser unit, and being formed on the first surface so as to reflect the light toward the second surface; and a convex lens, being formed in a region on the second surface, the region including an optical axis of the light reflected by the reflecting mirror. The second substrate is provided with a grating coupler and an optical waveguide on the third surface, the optical waveguide having light incident on the grating coupler propagating therethrough.

Abstract: An optical module includes: a photonic device emitting or receiving a light wave; an optical waveguide for transmitting the light wave; a lens focusing the light wave; a mirror for changing a traveling direction of the light wave to optically couple the photonic device with the optical waveguide; a manipulation lever for manipulating an orientation of the mirror; a support spring for supporting the mirror; and a substrate integrated with the mirror, the manipulation lever, and the support spring. The support spring couples the mirror with the substrate so as to allow the mirror to change the orientation thereof with movement or rotation along at least two axes. The manipulation lever extends from the mirror in a direction in which the manipulation lever avoids approaching the optical waveguide.

Abstract: An optical module includes a semiconductor optical device in which an active layer located at one side, an electrode located at the same side, and a mirror that reflects light toward the side opposite the electrode are monolithically integrated, a sub-mount having one surface on which a first wiring pattern is formed, a substrate in which an optical waveguide and a grating coupler are formed in a surface layer of the substrate, a spacer having an upper surface on which a second wiring pattern is formed, and a wire. The sub-mount is mounted on the spacer. The first wiring pattern on the sub-mount faces part of the second wiring pattern on the spacer and is electrically connected thereto. The second wiring pattern on the spacer includes a pad being disposed in a region exposed from the sub-mount and being bonded to the wire.

Abstract: A stamp-face platemaking device transports a medium holder inserted into a plate insertion portion to a printing unit. The medium holder holds a stamp face material in a plate-like member, and has a predetermined pattern in a side end portion thereof. An optical sensor detects the top end portion of the medium holder on a sensor scanning line in the inserting direction, and the pattern start point and the pattern end point of the predetermined pattern. At least one of the horizontal and vertical sizes of the stamp face material is set based on the positions of two of the detected end portions. When the pattern end point is detected, platemaking with the stamp face material is started.

Abstract: A photoelectric conversion device, comprising a semiconductor substrate on which a plurality of pixels are arrayed, and an insulating member which is transparent and configured to cover the semiconductor substrate, wherein the insulating member includes at least three portions whose thickness are different from each other so as to increase types of wavelengths of light that are to be ripple reduction targets.

Abstract: A photoelectric conversion apparatus includes a semiconductor substrate having one principle surface including recessed portions, and insulation bodies in the recessed portions. The semiconductor substrate includes photoelectric conversion elements each of which includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, and a third semiconductor region of the second conductivity type which has at least a portion disposed nearer to the principle surface relative to the second semiconductor region. The second semiconductor region has a polarity of signal charge. The second semiconductor region is in contact with the first and third semiconductor regions. Signal charge paths are disposed between the recessed portions in a cross section perpendicular to the principle surface. At least one of the second and third semiconductor regions is positioned in directions of at least two of the signal charge paths.

Abstract: A method for manufacturing a bottle including forming the bottle (10) that is formed in a bottomed tubular shape and has a bottom wall section (19) provided with a contact part (18) positioned at an outer circumferential edge thereof and a deformable tube part that is of a multilevel topped tubular shape, is provided upright at the contact part (18), and blocks an inside of the contact part (18); the method having a primary blow molding process of performing biaxial stretch blow molding on a preform to obtain a primary intermediate molded article; a heat treatment process of heating the primary intermediate molded article to be forcibly shrunken and molded into a secondary intermediate molded article; and a secondary blow molding process of performing blow molding on the secondary intermediate molded article to obtain the bottle (10).

Abstract: An optical module includes: a photonic device emitting or receiving a light wave; an optical waveguide for transmitting the light wave; a lens focusing the light wave; a mirror for changing a traveling direction of the light wave to optically couple the photonic device with the optical waveguide; a manipulation lever for manipulating an orientation of the mirror; a support spring for supporting the mirror; and a substrate integrated with the mirror, the manipulation lever, and the support spring. The support spring couples the mirror with the substrate so as to allow the mirror to change the orientation thereof with movement or rotation along at least two axes. The manipulation lever extends from the mirror in a direction in which the manipulation lever avoids approaching the optical waveguide.

Abstract: An optical module includes a semiconductor laser with an active layer disproportionately positioned closer to the first surface. The semiconductor laser includes a reflector for reflecting the light outgoing from the active layer in a direction along the first surface toward another direction. The active layer and the reflector are monolithically integrated in the semiconductor laser. The optical module includes a carrier formed from a light transmissive material and having a third surface and a fourth surface opposite to each other. The semiconductor laser is mounted on the carrier so as for the light to enter the third surface. The carrier has a lens integrally on the fourth surface. The optical module includes a substrate having an optical waveguide and an optical coupler for guiding the light to the optical waveguide. The optical waveguide and the optical coupler are integrated in the substrate.

Abstract: In a vehicle molding attached to a vehicle body part, a clip, to attach a molding body onto a body-part edge portion, is provided with an insertion part, into which the body-part edge portion is inserted; an engaging portion configured to engage with an engagement-receiving portion, provided on the body-part edge portion in a state where the edge portion is inserted into the insertion part, whereby a relative movement is restricted in a removal direction; and a biaser which elastically deforms upon abutting against the body-part edge portion that is inserted into the insertion part, the biaser applying a force that engages the engaging portion with the engagement-receiving portion by a restorative force of the elastic deformation of the biaser. Accordingly, the vehicle molding can be securely and reliably attached at a proper position while having a simple structure.

Abstract: In an optical module including an optical axis adjustment mechanism, the reliability of fixation of a movable portion is enhanced while an adhesive to fix the movable portion is prevented from flowing out to an unintended portion. An optical module includes: an element portion; a manipulation lever; a bank including a lever-opposing portion including a step face facing a longitudinal side face of the manipulation lever; a support spring connected at both ends to the element portion and the bank; a reservoir portion surrounded in a bay shape, in a plan view, by the manipulation lever, the element portion, the support spring, and the bank; and an adhesive stored in the reservoir portion and fixing the lever to the substrate. The reservoir portion includes, in the vicinity of a handle of the manipulation lever, an outflow blocking portion blocking the outflow of the adhesive before curing.

Abstract: An aspect of the disclosure relates to a semiconductor device including a semiconductor element, a connection terminal configured to output a signal based on an output of the semiconductor element, a protection circuit connected to the connection terminal, and a voltage limiting element connected to the connection terminal, wherein the protection circuit is connected to a first power supply line having a first potential and a second power supply line having a second potential lower than the first potential, and wherein a potential supplied to the voltage limiting element is higher than the second potential and lower than the first potential.

Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.

Abstract: Provided is a method of producing an amine adduct of a conductive composite, including: adding an amine compound to a conductive polymer dispersion liquid which contains water and a conductive composite containing a ? conjugated conductive polymer and a polyanion at a mass ratio of the ? conjugated conductive polymer to the polyanion of 1:3 to 1:7.5 to precipitate an amine adduct of the conductive composite.

Abstract: An optical module includes a semiconductor optical device in which an active layer located at one side, an electrode located at the same side, and a mirror that reflects light toward the side opposite the electrode are monolithically integrated, a sub-mount having one surface on which a first wiring pattern is formed, a substrate in which an optical waveguide and a grating coupler are formed in a surface layer of the substrate, a spacer having an upper surface on which a second wiring pattern is formed, and a wire. The sub-mount is mounted on the spacer. The first wiring pattern on the sub-mount faces part of the second wiring pattern on the spacer and is electrically connected thereto. The second wiring pattern on the spacer includes a pad being disposed in a region exposed from the sub-mount and being bonded to the wire.

Abstract: A photoelectric conversion apparatus includes a semiconductor substrate having one principle surface including recessed portions, and insulation bodies in the recessed portions. The semiconductor substrate includes photoelectric conversion elements each of which includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, and a third semiconductor region of the second conductivity type which has at least a portion disposed nearer to the principle surface relative to the second semiconductor region. The second semiconductor region has a polarity of signal charge. The second semiconductor region is in contact with the first and third semiconductor regions. Signal charge paths are disposed between the recessed portions in a cross section perpendicular to the principle surface. At least one of the second and third semiconductor regions is positioned in directions of at least two of the signal charge paths.