Patents by Inventor Takanori Tabuchi
Takanori Tabuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8399381Abstract: The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.Type: GrantFiled: February 26, 2010Date of Patent: March 19, 2013Assignee: Sumitomo Chemical Company, LimitedInventors: Yasushi Tanaka, Yukari Kajiwara, Makoto Noguchi, Takeshi Kajiwara, Takanori Tabuchi
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Patent number: 7816526Abstract: The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.Type: GrantFiled: January 15, 2003Date of Patent: October 19, 2010Assignee: Sumitomo Chemical Company, LimitedInventors: Yasushi Tanaka, Yukari Kajiwara, Makoto Noguchi, Takeshi Kajiwara, Takanori Tabuchi
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Publication number: 20100160163Abstract: The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.Type: ApplicationFiled: February 26, 2010Publication date: June 24, 2010Inventors: Yasushi Tanaka, Yukari Kajiwara, Makoto Noguchi, Takeshi Kajiwara, Takanori Tabuchi
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Patent number: 7307165Abstract: A process for easily and inexpensively producing an imidazo[1,2-b]pyridazin-3-ylsulfonamide derivative which has a substituent bonded to the 6-position carbon atom and is represented by the formula (II): (wherein R represents lower alkyl, lower cycloalkyl optionally substituted by lower alkyl, lower alkenyl, or lower alkynyl), the process comprising reacting an imidazo[1,2-b]pyridazine compound represented by the formula (I): (wherein X represents halogeno or lower alkyl optionally substituted by halogeno; Y represents hydrogen or SO2N?CH—NR1R2; and Z represents halogeno or OSO2R3) with an organometallic compound in the presence of a transition metal catalyst. The derivative is useful as an intermediate for herbicides.Type: GrantFiled: July 16, 2003Date of Patent: December 11, 2007Assignee: Sumitomo Chemical Takeda Agro Company, LimitedInventors: Takanori Tabuchi, Tetsuhiro Yamamoto, Takeshi Kajiwara
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Patent number: 7196426Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: GrantFiled: November 24, 2004Date of Patent: March 27, 2007Assignee: Shinko Electric Industries Co., Ltd.Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Patent number: 7164198Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: GrantFiled: August 28, 2003Date of Patent: January 16, 2007Assignee: Shinko Electric Industres, Co., Ltd.Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Patent number: 6988312Abstract: The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the cType: GrantFiled: October 29, 2002Date of Patent: January 24, 2006Assignee: Shinko Electric Industries Co., Ltd.Inventors: Jyunichi Nakamura, Shunichiro Matsumoto, Tadashi Kodaira, Hironari Aratani, Takanori Tabuchi, Takeshi Chino, Kiyotaka Shimada
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Publication number: 20050171108Abstract: A process for easily and inexpensively producing an imidazo[1,2-b]pyridazin-3-ylsulfonamide derivative which has a substituent bonded to the 6-position carbon atom and is represented by the formula (II): (wherein R represents lower alkyl, lower cycloalkyl optionally substituted by lower alkyl, lower alkenyl, or lower alkynyl), the process comprising reacting an imidazo[1,2-b]pyridazine compound represented by the formula (I): (wherein X represents halogeno or lower alkyl optionally substituted by halogeno; Y represents hydrogen or SO2N?CH—NR1R2; and Z represents halogeno or OSO2R3) with an organometallic compound in the presence of a transition metal catalyst. The derivative is useful as an intermediate for herbicides.Type: ApplicationFiled: July 16, 2003Publication date: August 4, 2005Inventors: Takanori Tabuchi, Tetsuhiro Yamamoto, Takeshi Kajiwara
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Publication number: 20050087860Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: ApplicationFiled: November 24, 2004Publication date: April 28, 2005Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Publication number: 20050032650Abstract: The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.Type: ApplicationFiled: January 15, 2003Publication date: February 10, 2005Inventors: Yasushi Tanaka, Yukari Kajiwara, Makoto Noguchi, Takeshi Kajiwara, Takanori Tabuchi
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Patent number: 6759739Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: GrantFiled: October 28, 2002Date of Patent: July 6, 2004Assignee: Shinko Electric Industries Co., Ltd.Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Publication number: 20040074088Abstract: The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the cType: ApplicationFiled: November 14, 2003Publication date: April 22, 2004Inventors: Jyunichi Nakamura, Shunichiro Matsumoto, Tadashi Kodaira, Hironari Aratani, Takanori Tabuchi, Takeshi Chino, Kiyotaka Shimada
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Publication number: 20040046244Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: ApplicationFiled: August 28, 2003Publication date: March 11, 2004Applicant: Shinko Electric Industries Co., Ltd.Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Publication number: 20040023938Abstract: The present invention relates to microbicides for agricultural or horticultural use containing sulfonamide derivative of, for example, a formula (I): 1Type: ApplicationFiled: March 19, 2003Publication date: February 5, 2004Inventors: Takanori Tabuchi, Tetsuhiro Yamamoto, Masaharu Nakayama
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Patent number: 6586617Abstract: The present invention relates to microbicides for agricultural or horticultural use containing a sulfonamide derivative.Type: GrantFiled: December 18, 2001Date of Patent: July 1, 2003Assignee: Sumitomo Chemical Takeda Agro Company, LimitedInventors: Takanori Tabuchi, Tetsuhiro Yamamoto, Masaharu Nakayama
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Publication number: 20030080409Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.Type: ApplicationFiled: October 28, 2002Publication date: May 1, 2003Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
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Patent number: 5364989Abstract: Methods for the production of 1,1,1-trihalogeno-2-nitroethanes from 1,1-dihalogenoethylene by using nitric acid or its salt and hydrogen chloride or hydrogen bromide or its salt, and for the production of .alpha.-unsaturated amines from the 1,1,1-trihalogeno-2-nitroethanes which are useful as insecticides.Type: GrantFiled: July 6, 1992Date of Patent: November 15, 1994Assignee: Takeda Chemical Industries, Ltd.Inventors: Isao Aoki, Takanori Tabuchi, Isao Minamida