Patents by Inventor Takanori Tabuchi

Takanori Tabuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8399381
    Abstract: The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: March 19, 2013
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasushi Tanaka, Yukari Kajiwara, Makoto Noguchi, Takeshi Kajiwara, Takanori Tabuchi
  • Patent number: 7816526
    Abstract: The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: October 19, 2010
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasushi Tanaka, Yukari Kajiwara, Makoto Noguchi, Takeshi Kajiwara, Takanori Tabuchi
  • Publication number: 20100160163
    Abstract: The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.
    Type: Application
    Filed: February 26, 2010
    Publication date: June 24, 2010
    Inventors: Yasushi Tanaka, Yukari Kajiwara, Makoto Noguchi, Takeshi Kajiwara, Takanori Tabuchi
  • Patent number: 7307165
    Abstract: A process for easily and inexpensively producing an imidazo[1,2-b]pyridazin-3-ylsulfonamide derivative which has a substituent bonded to the 6-position carbon atom and is represented by the formula (II): (wherein R represents lower alkyl, lower cycloalkyl optionally substituted by lower alkyl, lower alkenyl, or lower alkynyl), the process comprising reacting an imidazo[1,2-b]pyridazine compound represented by the formula (I): (wherein X represents halogeno or lower alkyl optionally substituted by halogeno; Y represents hydrogen or SO2N?CH—NR1R2; and Z represents halogeno or OSO2R3) with an organometallic compound in the presence of a transition metal catalyst. The derivative is useful as an intermediate for herbicides.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: December 11, 2007
    Assignee: Sumitomo Chemical Takeda Agro Company, Limited
    Inventors: Takanori Tabuchi, Tetsuhiro Yamamoto, Takeshi Kajiwara
  • Patent number: 7196426
    Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: March 27, 2007
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
  • Patent number: 7164198
    Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: January 16, 2007
    Assignee: Shinko Electric Industres, Co., Ltd.
    Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
  • Patent number: 6988312
    Abstract: The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the c
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: January 24, 2006
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Jyunichi Nakamura, Shunichiro Matsumoto, Tadashi Kodaira, Hironari Aratani, Takanori Tabuchi, Takeshi Chino, Kiyotaka Shimada
  • Publication number: 20050171108
    Abstract: A process for easily and inexpensively producing an imidazo[1,2-b]pyridazin-3-ylsulfonamide derivative which has a substituent bonded to the 6-position carbon atom and is represented by the formula (II): (wherein R represents lower alkyl, lower cycloalkyl optionally substituted by lower alkyl, lower alkenyl, or lower alkynyl), the process comprising reacting an imidazo[1,2-b]pyridazine compound represented by the formula (I): (wherein X represents halogeno or lower alkyl optionally substituted by halogeno; Y represents hydrogen or SO2N?CH—NR1R2; and Z represents halogeno or OSO2R3) with an organometallic compound in the presence of a transition metal catalyst. The derivative is useful as an intermediate for herbicides.
    Type: Application
    Filed: July 16, 2003
    Publication date: August 4, 2005
    Inventors: Takanori Tabuchi, Tetsuhiro Yamamoto, Takeshi Kajiwara
  • Publication number: 20050087860
    Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
    Type: Application
    Filed: November 24, 2004
    Publication date: April 28, 2005
    Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
  • Publication number: 20050032650
    Abstract: The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.
    Type: Application
    Filed: January 15, 2003
    Publication date: February 10, 2005
    Inventors: Yasushi Tanaka, Yukari Kajiwara, Makoto Noguchi, Takeshi Kajiwara, Takanori Tabuchi
  • Patent number: 6759739
    Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: July 6, 2004
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
  • Publication number: 20040074088
    Abstract: The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the c
    Type: Application
    Filed: November 14, 2003
    Publication date: April 22, 2004
    Inventors: Jyunichi Nakamura, Shunichiro Matsumoto, Tadashi Kodaira, Hironari Aratani, Takanori Tabuchi, Takeshi Chino, Kiyotaka Shimada
  • Publication number: 20040046244
    Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
    Type: Application
    Filed: August 28, 2003
    Publication date: March 11, 2004
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
  • Publication number: 20040023938
    Abstract: The present invention relates to microbicides for agricultural or horticultural use containing sulfonamide derivative of, for example, a formula (I): 1
    Type: Application
    Filed: March 19, 2003
    Publication date: February 5, 2004
    Inventors: Takanori Tabuchi, Tetsuhiro Yamamoto, Masaharu Nakayama
  • Patent number: 6586617
    Abstract: The present invention relates to microbicides for agricultural or horticultural use containing a sulfonamide derivative.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: July 1, 2003
    Assignee: Sumitomo Chemical Takeda Agro Company, Limited
    Inventors: Takanori Tabuchi, Tetsuhiro Yamamoto, Masaharu Nakayama
  • Publication number: 20030080409
    Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
    Type: Application
    Filed: October 28, 2002
    Publication date: May 1, 2003
    Inventors: Jyunichi Nakamura, Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino
  • Patent number: 5364989
    Abstract: Methods for the production of 1,1,1-trihalogeno-2-nitroethanes from 1,1-dihalogenoethylene by using nitric acid or its salt and hydrogen chloride or hydrogen bromide or its salt, and for the production of .alpha.-unsaturated amines from the 1,1,1-trihalogeno-2-nitroethanes which are useful as insecticides.
    Type: Grant
    Filed: July 6, 1992
    Date of Patent: November 15, 1994
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Isao Aoki, Takanori Tabuchi, Isao Minamida