Patents by Inventor Takanorr Aono

Takanorr Aono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor-device inspecting apparatus and a method for manufacturing the same
    Patent number: 6774654
    Abstract: A semiconductor inspecting apparatus having a plurality of electrical connection boards arranged in the inspecting apparatus and a plurality of probes respectively provided on a plurality of beams formed on a first board of said plurality of electrical connection boards, the probes being adapted to be individually brought into contact with a plurality of electrode pads of a semiconductor device for inspection, so as to inspect the semiconductor device while establishing electrical connection therebetween. A one-end supported beam is used as each of the beams, and each of the probes is formed at a portion shifted in a rectangular direction to a center line of a longitudinal direction of the one-end supported beam.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: August 10, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Masatoshi Kanamaru, Yoshishige Endo, Takanorr Aono, Ryuji Kohno, Toshio Miyatake, Hideyuki Aoki, Naoto Ban
  • SEMICONDUCTOR-DEVICE INSPECTING APPARATUS AND A METHOD FOR MANUFACTURING THE SAME
    Publication number: 20030102880
    Abstract: A semiconductor inspecting apparatus having a plurality of electrical connection boards arranged in the inspecting apparatus and a plurality of probes respectively provided on a plurality of beams formed on a first board of said plurality of electrical connection boards, the probes being adapted to be individually brought into contact with a plurality of electrode pads of a semiconductor device for inspection, so as to inspect the semiconductor device while establishing electrical connection therebetween. A one-end supported beam is used as each of the beams, and each of the probes is formed at a portion shifted in a rectangular direction to a center line of a longitudinal direction of the one-end supported beam.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 5, 2003
    Inventors: Masatoshi Kanamaru, Yoshishige Endo, Takanorr Aono, Ryuji Kohno, Toshio Miyatake, Hideyuki Aoki, Naoto Ban
  • Semiconductor-device inspecting apparatus and a method for manufacturing the same
    Patent number: 6496023
    Abstract: A structure is provided such that a plural cantilevers are formed on a first board formed of silicon, probes are respectively formed on the individual cantilevers at positions each offset perpendicularly to a longitudinal center line of the cantilever, and wiring connected continuously from each probe to a secondary electrode pad portion through an insulating layer. A structure is alternatively adopted such that by using a both-ends supported beam formed of silicon as the beam, each probe is formed at a position offset toward a supported portion side of the both-ends supported beam.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: December 17, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Masatoshi Kanamaru, Yoshishige Endo, Takanorr Aono, Ryuji Kohno, Toshio Miyatake, Hideyuki Aoki, Naoto Ban