Patents by Inventor Takao Enomoto

Takao Enomoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6687216
    Abstract: A cartridge includes upper and lower half segments butting against each other and containing a disk, a shutter provided on one side of the cartridge half segments for exposing or alternatively enclosing the disk, and a torsion spring attached to the shutter for biasing the shutter in a closing direction. An insertion opening is formed in a side portion of the cartridge for permitting insertion of the torsion spring therethrough from outside, and a protective wall is provided upright between the insertion opening and the disk to define a space by the wall and the upper half segment. The space is so sized as to permit the torsion spring to pass therethrough while leaving a small clearance, with legs thereof directed laterally.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: February 3, 2004
    Assignees: Sanyo Electric Co., Ltd., Hitachi Maxell Co., Ltd., Olympus Optical Co., Ltd.
    Inventors: Hiroshi Nakashima, Noriaki Kitani, Takao Enomoto, Hiroyoshi Takagi, Hikaru Mizutani, Kenji Ohta, Toshiyuki Toyofuku
  • Patent number: 6625877
    Abstract: An apparatus for supporting an electric-component mounter including a substrate supporting device which supports a circuit substrate, an electric-component supplying device which supplies a plurality of electric components to be mounted on the circuit substrate, a mounting device which receives the electric components from the electric-component supplying device and mounts the electric components on the circuit substrate supported by the substrate supporting device, and a base member which supports the substrate supporting device, the electric-component supplying device, and the mounting device, the apparatus including at least one elastic member which is provided between the base member and a surface of a floor which supports the base member, and at least one damper which damps vibration of the base member and the floor surface relative to each other, the vibration resulting from elastic deformation of the elastic member.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: September 30, 2003
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventors: Shinsuke Suhara, Takao Enomoto
  • Patent number: 6161811
    Abstract: An apparatus for supporting an electric-component mounter including a substrate supporting device which supports a circuit substrate, an electric-component supplying device which supplies a plurality of electric components to be mounted on the circuit substrate, a mounting device which receives the electric components from the electric-component supplying device and mounts the electric components on the circuit substrate supported by the substrate supporting device, and a base member which supports the substrate supporting device, the electric-component supplying device, and the mounting device, the apparatus including at least one elastic member which is provided between the base member and a surface of a floor which supports the base member, and at least one damper which damps vibration of the base member and the floor surface relative to each other, the vibration resulting from elastic deformation of the elastic member.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: December 19, 2000
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventors: Shinsuke Suhara, Takao Enomoto
  • Patent number: 6086683
    Abstract: Ag and Cu are added to a base material of a Sn/Pb/Bi composition. Since Bi is contained in greater quantities in Sn/Pb, the alloy has a low melting point (120 to 150.degree. C.) and is surely melted at reflow temperatures from 170 to 200.degree. C. Preferably, the addition amount of Ag is from 0.1 to 5 wt % and the addition amount of Cu is from 0.05 to 1.0 wt %. A low-melting alloy having all the required performances and excellent with view points of cost and safety and a cream solder using a powder of the alloy can be obtained.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: July 11, 2000
    Assignees: Toshiba Corp., Alpha Metals of Japan Ltd.
    Inventors: Tadahiro Toki, Masayoshi Yamaguchi, Koichi Aono, Hirofumi Sakamoto, Yasuhide Ogasawara, Masuo Hotta, Akihiro Kiyosue, Takao Enomoto
  • Patent number: 5930984
    Abstract: A band seal is formed between a body and a cap of a capsule by fitting the cap on the body, and applying a gelatin-base sealant at least one time in the form of a band spanning the cap and the body. Band sealing is carried out by at least one of the following steps (A) to (E): the step (A) of applying the sealant at a temperature of 30-40.degree. C. at least when the sealant is first applied, the step (B) of applying the sealant at a viscosity of 50-200 centipoises at 50.degree. C. at least when the sealant is first applied, the step (C) of after the sealant is applied, blowing cold air at a temperature of up to 10.degree. C. to the band seal to cool the band seal below 10.degree. C., the step (D) of reducing the joint distance between the body and the cap shorter than the standard capsule length, and the step (E) of applying the sealant to only an edge adjacent portion of the cap surface when the sealant is first applied. The invention prevents bubbles from generating in the band seal.
    Type: Grant
    Filed: August 28, 1997
    Date of Patent: August 3, 1999
    Assignee: Shionogi & Co., Ltd.
    Inventors: Yoshihiro Furuya, Takao Enomoto, Koji Sato, Taiichi Mizuta
  • Patent number: D435854
    Type: Grant
    Filed: January 6, 1999
    Date of Patent: January 2, 2001
    Assignees: Hitachi Maxell, Ltd., Sanyo Electric Co.,Ltd., Olympus Optical Co., Ltd.
    Inventors: Hiroyoshi Takagi, Hikaru Mizutani, Kenji Ohta, Noriaki Kitani, Takao Enomoto, Hiroshi Nakashima, Yasushi Kojima, Toshiyuki Toyofuku