Patents by Inventor Takao Funamoto

Takao Funamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8584923
    Abstract: An endless hot rolling material shear-joining method capable of threading hot rolling materials in a finish rolling process without strip breakage by controlling joining conditions for the hot rolling materials in an endless hot rolling process for high carbon steel, and an endless hot rolling plant therefor are disclosed. The shear-joining method for endless hot rolling materials of high carbon steel includes shear-joining high carbon steel metal bars comprising, in terms of weight %, 0.30% to 1.20% C, inevitable impurities, and balance Fe, or comprising 0.15% to 1.5% C containing at least one of Cr, Ni, Mo, V, Ti, W, B, Nb, and Sb, inevitable impurities, and balance Fe, such that a joined surface of the joined metal bars is formed to be inclined in a thickness direction of the metal bars, in a hot rolling plant by a joiner adapted to join the metal bars after overlapping tail part of a leading one of the metal bar and top part of a trailing metal bar.
    Type: Grant
    Filed: November 20, 2006
    Date of Patent: November 19, 2013
    Assignees: POSCO, Mitsubishi-Hitachi Metals
    Inventors: Jong-Sub Lee, Youn-Hee Kang, Chun-Soo Won, Jong-Bong Lee, Sang-Wook Ha, Kenji Horii, Toshihiro Usugi, Hideaki Furumoto, Shigenori Shirogane, Takao Funamoto
  • Publication number: 20110174869
    Abstract: An endless hot rolling material shear-joining method capable of threading hot rolling materials in a finish rolling process without strip breakage by controlling joining conditions for the hot rolling materials in an endless hot rolling process for high carbon steel, and an endless hot rolling plant therefor are disclosed. The shear-joining method for endless hot rolling materials of high carbon steel includes shear-joining high carbon steel metal bars comprising, in terms of weight %, 0.30% to 1.20% C, inevitable impurities, and balance Fe, or comprising 0.15% to 1.5% C containing at least one of Cr, Ni, Mo, V, Ti, W, B, Nb, and Sb, inevitable impurities, and balance Fe, such that a joined surface of the joined metal bars is formed to be inclined in a thickness direction of the metal bars, in a hot rolling plant by a joiner adapted to join the metal bars after overlapping tail part of a leading one of the metal bar and top part of a trailing metal bar.
    Type: Application
    Filed: November 20, 2006
    Publication date: July 21, 2011
    Applicants: POSCO, MITSUBISHI-HITACHI METALS MACHINERY, INC.
    Inventors: Jong-Sub Lee, Youn-Hee Kang, Chun-Soo Won, Jong-Bong Lee, Sang-Wook Ha, Kenji Horii, Toshihiro Usugi, Hideaki Furumoto, Shigenori Shirogane, Takao Funamoto
  • Patent number: 6955287
    Abstract: An upper shearing blade equipped with a protrusion of a triangle-columnar shape and a lower shearing blade equipped with a protrusion of the same shape are applied onto the overlapped portion of metal plates to be bonded, and then pressed into the metal plates in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates are not completely cut off. The operating loci of the upper, shearing blade and the lower shearing blade are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: October 18, 2005
    Assignees: Hitachi, Ltd., Pohang Iron and Steel Co., Ltd., Research Institution of Industrial Science and Technology
    Inventors: Kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee Kim
  • Publication number: 20010017312
    Abstract: An upper shearing blade 3 equipped with a protrusion 30 of a triangle-columnar shape and a lower shearing blade 4 equipped with a protrusion 40 of the same shape are applied onto the overlapped portion of metal plates 1 and 2 to be bonded, and then pressed into the metal plates 1 and 2 in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates 1 and 2 are not completely cut off. The operating loci of the upper shearing blade 3 and the lower shearing blade 4 are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates 1 and 2 are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.
    Type: Application
    Filed: December 14, 2000
    Publication date: August 30, 2001
    Applicant: HITACHI, LTD., POHANG IRON & STEEL CO., LTD.
    Inventors: kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee kim
  • Patent number: 6225598
    Abstract: In a method for high frequency pulse welding and an apparatus therefor, a highly directive arc can be obtained by eliminating the effect of the inductance of the welding cable, which tends to make the high frequency electromagnetic pinch force large. In a method and an apparatus for high frequency pulse arc welding which is performed by generating an arc between an inconsumable electrode or a consumable electrode arranged near a portion of a base metal to be welded and the base metal with main pulse current, when the main pulse current is shifted from ON to OFF, a reverse pulse current having a polarity opposite to the polarity of the main pulse is supplied between the electrode and the base metal to improve the stiffness (directivity) of the arc by making the rising and falling edges of the pulses steeper. A rail-car and a nuclear power plant obtained by the method are also provided.
    Type: Grant
    Filed: July 9, 1998
    Date of Patent: May 1, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Masayasu Nihei, Jin Onuki, Takao Funamoto, Izumi Sakurai, Akira Onuma
  • Patent number: 6213381
    Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a moving mechanism is provided for relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing glade. A method for bonding is characterized by bonding metal plates by using the above apparatus.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: April 10, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Takao Funamoto, Gen Nagakubo, Takashi Mashiko, Fuminori Ishikawa, Tadashi Nishino, Yusutsugu Yoshimura, Toshiyuki Kajiwara, Kenichi Yasuda, Mitsuo Nihei, Yoshio Takakura, Hironori Shimogama
  • Patent number: 6077615
    Abstract: A Co-base alloy including, by weight, 0.03-0.10% C, not more than 1.0% Si, not more than 1.0% Mn, 20-30% Cr, 15-23% Ni, 3-10% W, 5-10% Ta and 0.05-0.7% Zr, is used as a welding material. A gas turbine nozzle has a crack repaired with a multi-layer weld using the Co-base alloy and a gas turbine for power generation employs the nozzle.
    Type: Grant
    Filed: December 16, 1997
    Date of Patent: June 20, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Masami Yada, Takao Funamoto, Takamitsu Nakazaki, Kei Kobayashi, Norio Yokoba, Nobuyuki Iizuka, Kazuhiko Kumata
  • Patent number: 5938954
    Abstract: A submerged laser beam irradiation equipment provides a high quality submerged laser beam processing of a submerged workpiece using only a small amount of a gas. The submerged laser beam irradiation equipment has: a focus lens for focusing a laser beam; a mirror tube which houses the lens; a first nozzle operating to cover the front end of the mirror tube in an irradiating direction of the laser beam; a skirt portion provided at the front end of the first nozzle for preventing water intrusion thereinto; and a shutter mechanism operable to open and close and provided between said skirt portion and said mirror tube for preventing water intrusion into said mirror tube.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: August 17, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Tsutomu Onuma, Toshimi Matsumoto, Akira Onuma, Mitsuo Nakamura, Choichi Asano, Yasumasa Tamai, Hiroo Koide, Masayuki Kurihara, Takao Funamoto, Fuminori Ishikawa
  • Patent number: 5884832
    Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: March 23, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Takao Funamoto, Gen Nagakubo, Takashi Mashiko, Fuminori Ishikawa, Tadashi Nishino, Yusutsugu Yoshimura, Toshiyuki Kajiwara, Kenichi Yasuda, Mitsuo Nihei, Yoshio Takakura, Hironori Shimogama
  • Patent number: 5234154
    Abstract: A trailing end of a preceding bar is arranged slantingly by an angle .theta. relative to a succeeding bar such that the lower edge of the leading end face of the succeeding bar is vertically shifted from the lower edge of the trailing end face of the preceding bar with the leading end face of the succeeding bar abutting against the trailing end face of the preceding bar. After that, the succeeding bar is vertically depressed by applying a predetermined force. Since the trailing end face is inclined by .theta. relative to the leading end face, the depression causes a relative slide between surfaces of both the end faces and, at the same time, a pressure P is also produced by the wedge effect, the pressure P causing a compression force and a plastic deformation between both the end faces.
    Type: Grant
    Filed: April 27, 1992
    Date of Patent: August 10, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Toshiyuki Kajiwara, Tadashi Nishino, Tadayuki Watanabe, Yasutsugu Yoshimura, Takao Funamoto
  • Patent number: 5231366
    Abstract: A superconducting magnetic field generating apparatus, and coil, a superconducting wire, a method of producing a coil and a method of connecting a superconducting wire which are suitable for such a superconducting magnetic field generating apparatus are disclosed. The superconducting magnetic field generating apparatus has a coil of a wound superconducting wire which is composed of superconducting wires with the end portions thereof connected with each other. Each of the superconducting wires is composed of a plurality of superconducting material wires embedded in a stabilizing member. The group of superconducting material wires is embedded at the connecting portion in a state in which the superconducting material wires are densely gathered to the central portion of the stabilizing member and the superconducting material wires are directly in contact with each other.
    Type: Grant
    Filed: March 4, 1991
    Date of Patent: July 27, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Haramaki, Mituo Nakamura, Takao Funamoto, Masahiko Sakamoto, Teruhiro Takizawa, Takeshi Yamagiwa
  • Patent number: 5051397
    Abstract: The present invention provides a method for joining of high-temperature oxide superconductors per se or a high-temperature oxide superconductor and other conductive material through a very simple process. According to this method, the joining is carried out by using an alloy comprising 0.1%-90% by weight of at least one divalent metallic element and the balance as a brazing material and heating and melting the brazing material. The resulting joined body has a joint low in resistance. The divalent metallic element of the alloy is preferably an element of Group IIA or IIB of the Periodic Table or a transition metal.
    Type: Grant
    Filed: November 20, 1989
    Date of Patent: September 24, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Chie Sato, Masahiko Sakamoto, Hisanori Okamura, Takao Funamoto, Masahiro Ogihara
  • Patent number: 5035579
    Abstract: A water turbine runner has a plurality of vanes, each made of a rolled steel plates which contains, by weight, 0.01 to 0.10% of C, 0.10 to 1.0% of Si, 0.10 to 2% of Mn, 2 to 7% of Ni, 10 to 15% of Cr and 0.10 to 4% of Mo, 71.9 to 87.7% of Fe, and which has a metallic structure mixture containing, by volume, martensite and 10 to 35% of residual austenite. Each of the vanes is made of a plurality of plate pieces, cut out from the rolled steel plate, press-formed in a shape of a part of the vane and joined by welding into the complete vane.
    Type: Grant
    Filed: November 15, 1989
    Date of Patent: July 30, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Masami Yada, Takao Funamoto, Michio Kitamura, Junzo Komatsu, Masakazu Midorikawa, Tsugio Yoshikawa
  • Patent number: 4996589
    Abstract: A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solder, at the same time, the cooling plate is connected to the wiring substrate through a skirt (5) which is connected to the cooling plate and also connected to the wiring substrate by a low melting solder.
    Type: Grant
    Filed: October 17, 1988
    Date of Patent: February 26, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Ryoichi Kajiwara, Takao Funamoto, Mituo Kato, Hiroshi Wachi, Tomohiko Shida
  • Patent number: 4902867
    Abstract: A high heat resisting wire (5) is made of amide-imide-coated wire, and a conductive terminal (4) is made of Cu or Cu alloy such as brass P-containing solder, BAg-1, BAg-2 are used as joining assistant (4). A high heat resisting wire (5) is made of an amide-imide-coated wire and a conductive terminal (3) is made of soft steel or SUS steel, a silver-solder is used as joining assistant (4). A metallic joining conductive layer (8) is formed between a Cu core wire (7) of the insulated wire (5) and the conductive terminal (3 ) with the joining assistant (4). The insulated wire (5) is joined to the conductive terminal (3) and a joined body having high joining strength can be obtained.
    Type: Grant
    Filed: October 6, 1988
    Date of Patent: February 20, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Haramaki, Mitsuo Nakamura, Satoshi Kokura, Takao Funamoto, Katsuyoshi Terakado
  • Patent number: 4809058
    Abstract: An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof.
    Type: Grant
    Filed: December 15, 1986
    Date of Patent: February 28, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Takao Funamoto, Ryoichi Kajiwara, Mituo Katou, Takeshi Matsuzaka, Tomohiko Shida, Hiroshi Wachi, Kazuya Takahashi, Masatoshi Watanabe, Minoru Yamada, Keiichirou Nakanishi, Katuo Sugawara
  • Patent number: 4740866
    Abstract: A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion and is combined with a semiconductor chip through the electrical insulating layer; and a bellows which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.
    Type: Grant
    Filed: March 25, 1986
    Date of Patent: April 26, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Ryoichi Kajiwara, Takao Funamoto, Mitsuo Katoo, Tomohiko Shida, Takeshi Matsuzaka, Hiroshi Wachi, Kazuya Takahashi
  • Patent number: 4691856
    Abstract: Disclosed is a diffusion bonding method which can be applied to superalloys and comprises forming in advance an alloy layer containing an additional element or elements having a higher diffusion speed than that of the principal constituent element of a base metal and a lower melting point than that of the base metal on the joint surface of the base metal consisting of a heat-resistant superalloy based on Co, Ni, Fe, Ti or the like, and bringing the joint surfaces into contact so as to diffuse B.
    Type: Grant
    Filed: June 28, 1985
    Date of Patent: September 8, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Haramaki, Takao Funamoto, Satoshi Kokura, Masahisa Inagaki, Ryutaro Jimbou, Toshimi Sasaki, Kousei Nagayama
  • Patent number: 4645119
    Abstract: A heat exchanger and a method of manufacturing a heat exchanger by brazing metal members mainly made of Al or Al alloy is disclosed. The heat exchanger has a plurality of brazed metal members, at least one of the brazed metal members being made of brazing sheet clad with a brazing material. The brazed portions of the metal members or the whole surface of the heat exchanger are coated with a corrosion-resistant fluoride flux consisting essentially of 25-40% KF, 38-54% AlF3 and 3-30% ZnF2 by weight which forms a corrosion-inhibiting metallic film.
    Type: Grant
    Filed: July 5, 1984
    Date of Patent: February 24, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Haramaki, Katsuhiko Shiota, Satoshi Kokura, Takao Funamoto, Akira Tomita