Patents by Inventor Takao Haranosono

Takao Haranosono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packag
    Patent number: 5724233
    Abstract: A chip-on chip type semiconductor device is provided in which semiconductor chips provided in a package cannot be displaced during a transfer molding process so as to eliminate a short circuit. At least two lead frames are provided in and extend from the package so that the first semiconductor chip and the second semiconductor chip can be electrically connected to external devices. A die stage is provided between the first semiconductor chip and the second semiconductor chip. A bonding wire is provided for wiring between the first semiconductor chip and the lead frames, and TAB leads connect the second semiconductor chip to the lead frames. The lead frames may extend between the first and second semiconductor devices instead of the die stage. The lead frames may include one having a portion extending in a direction perpendicular to the longitudinal direction of the lead frames between the first and second semiconductor chips.
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: March 3, 1998
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Tosiyuki Honda, Takao Haranosono
  • Semiconductor device having a plurality of semiconductor chips
    Patent number: 5579208
    Abstract: A chip-on chip type semiconductor device is provided in which semiconductor chips provided in a package cannot be displaced during a transfer molding process so as to eliminate a short circuit. At least two lead frames are provided in and extend from the package so that the first semiconductor chip and the second semiconductor chip can be electrically connected to external devices. A die stage is provided between the first semiconductor chip and the second semiconductor chip. A bonding wire is provided for wiring between the first semiconductor chip and the lead frames, and TAB leads connect the second semiconductor chip to the lead frames. The lead frames may extend between the first and second semiconductor devices instead of the die stage. The lead frames may include one having a portion extending in a direction perpendicular to the longitudinal direction of the lead frames between the first and second semiconductor chips.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: November 26, 1996
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Tosiyuki Honda, Takao Haranosono
  • Semiconductor device having a plurality of semiconductor chips
    Patent number: 5471369
    Abstract: A chip-on chip type semiconductor device is provided in which semiconductor chips provided in a package cannot be displaced during a transfer molding process so as to eliminate a short circuit. At least two lead frames are provided in and extend from the package so that the first semiconductor chip and the second semiconductor chip can be electrically connected to external devices. A die stage is provided between the first semiconductor chip and the second semiconductor chip. A bonding wire is provided for wiring between the first semiconductor chip and the lead frames, and TAB leads connect the second semiconductor chip to the lead frames. The lead frames may extend between the first and second semiconductor devices instead of the die stage. The lead frames may include one having a portion extending in a direction perpendicular to the longitudinal direction of the lead frames between the first and second semiconductor chips.
    Type: Grant
    Filed: March 17, 1994
    Date of Patent: November 28, 1995
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Tosiyuki Honda, Takao Haranosono