Patents by Inventor Takao HIJIKATA

Takao HIJIKATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11647894
    Abstract: One of two connector receiving parts of a processor for endoscope has a shutter mechanism configured to open a shutter by an external force, the shutter having a gap through which a connector-side connection end section passes, and being configured to partition a recessed space of the connector receiving part with respect to an outside. In addition, the processor for endoscope includes a lock mechanism configured to make the shutter into the locked state during a period when another connection end section on the connector side and a processor-side connection end section are connected, and release the locked state of the shutter when the connection between the other connection end section on the connector side and the processor-side connection end section is released.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: May 16, 2023
    Assignee: HOYA CORPORATION
    Inventors: Takao Hijikata, Yuya Masukawa, Toru Mukumoto, Motoharu Endo
  • Publication number: 20210378488
    Abstract: One of two connector receiving parts of a processor for endoscope has a shutter mechanism configured to open a shutter by an external force, the shutter having a gap through which a connector-side connection end section passes, and being configured to partition a recessed space of the connector receiving part with respect to an outside. In addition, the processor for endoscope includes a lock mechanism configured to make the shutter into the locked state during a period when another connection end section on the connector side and a processor-side connection end section are connected, and release the locked state of the shutter when the connection between the other connection end section on the connector side and the processor-side connection end section is released.
    Type: Application
    Filed: February 26, 2020
    Publication date: December 9, 2021
    Inventors: Takao HIJIKATA, Yuya MASUKAWA, Toru MUKUMOTO, Motoharu ENDO