Abstract: There is provided a micro actuator displacing a micro portion by use of an electrostatic force, the micro actuator comprising a first stationary part; a displacement part spaced apart from the first stationary part by a predetermined distance in a confronting manner, the displacememt part being displaceable relative to the first stationary part; a second stationary part; the lock parts being displaceable relative to the second stationary part; wherein the displacement part is displaced by application of a voltage between the first stationary part and the displacement part, the lock parts being displaced by application of a voltage between the second stationary part and the lock parts, and wherein the lock parts clamp the displacement part with no voltage applied, the lock parts releasing the displacement part with a voltage applied.

Abstract: A centering apparatus for centering a disk about a center member such as a shaft or hub includes a plurality of pairs of actuator units. The actuator units of each of the pairs faces each other through the disk. Each of the actuator units has a member which moves linearly and can come into contact with the disk.

Abstract: An apparatus for assembling a semiconductor device including a stage having a substrate support surface for supporting a substrate, and a support member for carrying a semiconductor element to a position on or near the substrate supported by the stage. A microscope unit having a coaxial illuminating unit is arranged inclined to the substrate support surface of the stage, and a counter illuminating unit is arranged inclined on the opposite side from the microscope unit with respect to a normal to the substrate support surface of the stage. A camera is arranged at an image forming position of the microscope unit 1 and an image processing unit is connected to the camera. The substrate has a positioning mark, and the camera acquires an image of the positioning mark and an image of a reflection of the positioning mark reflected by the side surface of the semiconductor element.

Abstract: A method for producing an optical module assembly includes the steps of illuminating an optical surface of an optical device included in an optical module, acquiring an image of the optical surface of the optical module, obtaining a position of an end surface of the optical fiber with respect to the optical surface of the optical device based upon the image of the optical surface, and positioning the end surface of said optical fiber at the position thus obtained. An apparatus for carrying out the method is also disclosed.