Abstract: Disclosed herein is a device that includes a plurality of semiconductor chips mounted on a module substrate. Each of the semiconductor chips includes a reset terminal to which a reset signal is supplied, and an internal circuit that is initialized based on the reset signal. The module substrate includes a reset signal line connected commonly to the reset terminals of the semiconductor chips, and an anti-resonance element connected to the reset signal line.

Abstract: Disclosed herein is a device that includes a plurality of semiconductor chips mounted on a module substrate. Each of the semiconductor chips includes a reset terminal to which a reset signal is supplied, and an internal circuit that is initialized based on the reset signal. The module substrate includes a reset signal line connected commonly to the reset terminals of the semiconductor chips, and an anti-resonance element connected to the reset signal line.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: Disclosed are a photosensitive resin composition comprising a photosensitive resin (A), a photopolymerization initiator (B), and a flame retardant (C), in which a content of halogen atoms or antimony atoms in the flame retardant is 5% or less by weight; a photosensitive element using this; a method of manufacturing a resist pattern; a resist pattern; and a resist pattern laminated substrate.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastormer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photosensitive resin composition comprising (A) a photosensitive resin having one or more carboxyl groups, (B) a special epoxy curing agent, and (C) a photopolymerization initiator is excellent in adhesiveness, heat resistance, resistance to PCT and developability and suitable as a solder resist composition.

Abstract: A ring oscillator has first inverters and second inverters connected in such a manner as to form a loop; the first inverters are powered through a current controller controlling the first inverters in such a manner as to decelerate the logical operation when the power voltage is increased in magnitude; the second inverters are directly powered with the power voltages so that each second inverter accelerates the logical operation when the power voltage is increased in magnitude; and the second inverters cancel the increment of the pulse period introduced by the first inverters due to increase of the power voltage for keeping the pulse period constant.

Abstract: A photosensitive resin composition comprising (A) a resin having an amide bond, an oxyalkylene group and a carboxyl group, (B) a photopolymerizable compound having an ethylenically unsaturated group and (C) a photopolymerization initiator has an alkali developability, good sensitivity and photocurability, an efficient pattern formability by photolithography, a good application workability to a film and is capable of producing cured products having good folding endurance, solder reflow heat resistance, solvent resistance, bondability and nonflammability and suitable for producing a photosensitive element, a photosensitive laminate and a flexible printed circuit board.

Abstract: Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.

Abstract: A coating composition for coating a metal plate, and containing (i) 100 parts by weight of a polyester-melamine resin composed of (a) a polyester resin having a glass transition temperature of 5.degree. to 40.degree. C. and a number average molecular weight of 15,000 to 30,000 and (b) a melamine resin at a weight ratio (a)/(b) of 75/25 to 55/45 and (ii) 1 to 2 parts by weight of an amine-blocked derivative of a long-chain alkylbenzenesulfonic acid.

Abstract: A copolymer emulsion comprising (I) a copolymer obtained by copolymerizing (A) a dicyclopentadiene derivative, (B), an .alpha.,.beta.-unsaturated monomer having one or more OH groups, (C) an .alpha.,.beta.-unsaturated monomer copolymerizable with the components (A) and (B), followed by the reaction of the resulting copolymer with (D) a partial allyl ether of polyhydric alcohol having one or more terminal isocyanate groups, and (II) water can be cross-linked and cured at normal temperatures to give coating films particularly excellent in hardness, water resistance, corrosion resistance and solvent resistance.

Abstract: A water-dispersed resin composition obtained by dispersing in water a neutralized resin prepared by neutralizing a part or whole of the carboxyl groups in an alkyd resin produced by reacting (A) an oil or fatty acid, (B) tris(2-hydroxyethyl)isocyanurate and/or tris(hydroxymethyl)isocyanurate, (C) a polyhydric alcohol, (D) a monobasic acid, (E) a polybasic acid and (F) polyethylene glycol, wherein individual components (A) to (F) are formulated in terms of the ratio of the number of hydroxyl groups/the number of carboxyl groups in the range of 1.0/1 to 1.6/1 and said alkyd resin has an acid value of 30 or less, is excellent in drying properties and in film properties such as gloss, water resistance, etc.

Abstract: A water-dispersible epoxy modified alkyd resin produced by reacting (A) 0-50 parts by weight of oil or oil fatty acid, (B) 10-50 parts by weight of polyhydric alcohol, (C) 0-25 parts by weight of monobasic acid having 6 to 18 carbon atoms, (D) 15-70 parts by weight of polybasic acid having 4 to 10 carbon atoms or its anhydride, (E) 5-25 parts by weight of polyoxyalkylene glycol having a molecular weight of 600 to 20,000, and (F) an epoxy compound, wherein the ratio of the hydroxyl groups to the carboxyl groups in the components (A) through (E) is 0.625-1.8 and the amount of the component (F) is 3-50 parts by weight per 100 parts by weight of the total weight of the components (A) through (E), can provide water-dispersible coatings having improved drying characteristics and water resistance as well as corrosion resistance.