Abstract: An apparatus includes a developer container to and from which a replenishment container is attachable and detachable and which includes an accommodating portion and a replenishment port, a transfer portion configured to transfer a developer image on an image bearing member onto a recording material, a supporting tray including a supporting surface configured to support the recording material thereon, and a discharge portion configured to discharge the recording material, onto which the developer image has been transferred, on the supporting surface, wherein the supporting surface has an opening portion opening such that the replenishment port is exposed through the supporting surface, and wherein an opening/closing member configured to be movable between a closed position where the opening/closing member covers the replenishment port and serves as a part of the supporting surface and an open position where the replenishment port is exposed is provided.

Abstract: A direct-fluid-supply writing implement has a pentip, an ink occlusion body connected to a rear end of the pentip, an ink tank that directly stores ink and is arranged at a rear of the ink occlusion body, a plurality of communication tubes that connects the ink tank to the ink occlusion body and a partition wall provided between the ink occlusion body and the ink tank. Forward end portions of the communication tubes are protruded forward from a front face of the partition wall, and are located inside the ink occlusion body. At least one of the communication tubes is provided such that a rear end of the communication tube is protruded backward from a rear face of the partition wall and is located inside the ink tank.

Abstract: A direct-fluid-supply writing implement has a pentip, an ink occluding element connected to a rear end of the pentip, the ink occluding element including a high-density portion, and a low density portion continuously connected to a rear of the high density portion, an ink tank disposed at rear of the ink occluding element and adapted to directly store ink and pluralities of communicating tubes connecting the ink tank with the ink occluding element, the respective communicating tubes including an opened front end, wherein the front end of the communicating tube and the rear end of the pentip connect with the high-density portion.

Abstract: A direct-fluid-supply writing implement has a pentip, an ink occlusion body connected to a rear end of the pentip, an ink tank that directly stores ink and is arranged at a rear of the ink occlusion body, a plurality of communication tubes that connects the ink tank to the ink occlusion body and a partition wall provided between the ink occlusion body and the ink tank. Forward end portions of the communication tubes are protruded forward from a front face of the partition wall, and are located inside the ink occlusion body. At least one of the communication tubes is provided such that a rear end of the communication tube is protruded backward from a rear face of the partition wall and is located inside the ink tank.

Abstract: A direct-fluid-supply writing implement has a pentip, an ink occluding element connected to a rear end of the pentip, the ink occluding element including a high-density portion, and a low density portion continuously connected to a rear of the high density portion, an ink tank disposed at rear of the ink occluding element and adapted to directly store ink and pluralities of communicating tubes connecting the ink tank with the ink occluding element, the respective communicating tubes including an opened front end, wherein the front end of the communicating tube and the rear end of the pentip connect with the high-density portion.

Abstract: A dresser 44 of a wafer polishing apparatus according to this invention includes a grinding wheel head 444 that is idly supported in such a manner as to be capable of moving up and down relative to a dresser main body 441, and an air bag 449 interposed between the dresser main body and the grinding wheel head. The air pressure inside the air bag can be regulated so that the force pushing the grinding wheel head to the polishing cloth can be regulated. A washing tank 46 for washing the grinding wheel head of the dresser is disposed adjacent to the platen 41, and a brush table 463 having a brush 462 implanted thereto is detachably provided to the bottom part of the washing tank 46.

Abstract: In a wafer polishing apparatus 1 according to this invention, waiting units 43 having upper-lower two-stage wafer placement tables each for temporarily keeping a wafer from a load/unload unit 3 to a polishing head 42 or vice versa are provided to a polishing unit 4, and the upper/lower stage wafer placement tables can move individually. A spindle-washing unit 44 for washing polishing heads is disposed inside a lower space below the waiting units.

Abstract: A wafer polishing apparatus according to this invention has a polishing unit that includes three platens and two polishing heads. Injection ports are disposed between the platens. The two polishing heads can linearly move between the platens. In a two-step polishing process, while the polishing head holds a wafer after polishing by a platen, the wafer is transferred to a center platen which provides different polishing characteristics. In this instance, washing water from the injection ports washes away slurry, etc, adhering to the wafer. The wafer is then carried to the center platen beyond a waiting unit and is subjected to further polishing.

Abstract: The present invention provides a wafer polishing apparatus capable of controlling the polishing quantity accurately.

Abstract: Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.

Abstract: A CMP machine of the invention includes first and second polishing bases 14 and 15, first and second wafer holding heads 31 and 32, a wafer loading unit 41, a wafer unloading unit 42, first and second head rotating mechanism rotating the first and second wafer holding heads so as to position then above the first and second polishing bases, wafer loading unit, or wafer unloading unit, a first transportation mechanism transporting an unpolished wafer to the wafer loading unit, and a second transportation mechanism, transporting a polished wafer from the wafer unloading unit. The first and second polishing bases are located mutually adjacently, the wafer loading unit and wafer unloading unit are located mutually adjacently, the first polishing base and wafer loading unit are located diagonally, the second polishing base and wafer unloading unit are located diagonally.

Abstract: Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.

Abstract: According to the present invention, a floating mechanism of a load stage floats positioned wafers in concave parts, and then, the chucks hold the wafers by suction. Therefore, the chucks can easily hold the centered wafers.

Abstract: In a wafer polishing apparatus 1 according to this invention, waiting units 43 having upper-lower two-stage wafer placement tables each for temporarily keeping a wafer from a load/unload unit 3 to a polishing head 42 or vice versa are provided to a polishing unit 4, and the upper/lower stage wafer placement tables can move individually. A spindle-washing unit 44 for washing polishing heads is disposed inside a lower space below the waiting units.

Abstract: A dresser 44 of a wafer polishing apparatus according to this invention includes a grinding wheel head 444 that is idly supported in such a manner as to be capable of moving up and down relative to a dresser main body 441, and an air bag 449 interposed between the dresser main body and the grinding wheel head. The air pressure inside the air bag can be regulated so that the force pushing the grinding wheel head to the polishing cloth can be regulated. A washing tank 46 for washing the grinding wheel head of the dresser is disposed adjacent to the platen 41, and a brush table 463 having a brush 462 implanted thereto is detachably provided to the bottom part of the washing tank 46.

Abstract: In a wafer polishing apparatus 1 according to this invention, a polishing unit 4 includes three platens 41 and two polishing heads 42, and injection ports 45 of washing water are disposed at the boundaries between right and left platens 41a and a platen 41b at the center, respectively. The two polishing heads can linearly move between the platens. In two-step polishing, while the polishing head holds the wafer 10 after polishing by the platens on both sides, the wafer is transferred to the center platen having different polishing characteristics. In this instance, washing water from the injection ports washes away slurry, etc, adhering to the wafer. The wafer is then carried to the center platen beyond a waiting unit 43 and is subjected to a next polishing work.

Abstract: The polishing apparatus comprises a turn table, which polishes a semiconductor wafer, and a holding and pressing part, which holds and presses the semiconductor wafer against a polishing surface of the turn table. The holding and pressing part transmits a force from an air bag to the semiconductor wafer via a pressurized fluid layer to thereby press the semiconductor wafer against the polishing surface via the pressurized fluid layer, so that the semiconductor wafer can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer.

Abstract: A rubber sheet is arranged between a head body and a retainer ring of a wafer holding head. Two O-rings air-tightly close a space between the periphery of the rubber sheet, which is located above the retainer ring, and the head body. When a pump supplies the compressed air to the space, the periphery of the rubber sheet is elastically deformed to press the retainer ring under uniform pressure.

Abstract: The first air guide groove is formed at the bottom of a carrier along the inner circumference of a circle whose radius corresponds to the maximum radius of a wafer. The air is supplied to the outer periphery of the wafer through the first air guide groove to form a pressure air layer between the carrier and the wafer. The formation of the pressure air layer makes the air pressure applied to the wafer uniform on the entire surface of the wafer, and thus, the wafer can be polished under a uniform pressure force. The second air guide groove is formed along the inner circumference of a circle whose radius corresponds to the minimum radius of the wafer, and therefore, the wafer with an orientation flat or notch can be polished under a uniform pressure force.

Abstract: Sensors detect a stock removal of a wafer during polishing, and a CPU calculates the stock removal in accordance with information from the sensors. The CPU compares the actual stock removal detected by the sensors and a model stock removal stored in RAM, and determines timings for dressing and replacing said polishing pad in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display.