Abstract: Disclosed herein is an image processing device including: an acquisition section adapted to acquire coded data and control the output or recording of the coded data; a generation section adapted to generate image data; a coding section adapted to generate the coded data by coding the generated image data in response to an output request from the acquisition section; an output section adapted to output the generated coded data to the acquisition section; and a control section adapted to determine, based on the generated coded data, the sizes of vertical and horizontal synchronizing signals used to output the coded data to the acquisition section, notify the determined sizes to the acquisition section, and control the output section to output the coded data according to the vertical and horizontal synchronizing signals of the determined sizes after the notification.

Abstract: Disclosed herein is an image processing device including: an acquisition section adapted to acquire coded data and control the output or recording of the coded data; a generation section adapted to generate image data; a coding section adapted to generate the coded data by coding the generated image data in response to an output request from the acquisition section; an output section adapted to output the generated coded data to the acquisition section; and a control section adapted to determine, based on the generated coded data, the sizes of vertical and horizontal synchronizing signals used to output the coded data to the acquisition section, notify the determined sizes to the acquisition section, and control the output section to output the coded data according to the vertical and horizontal synchronizing signals of the determined sizes after the notification.

Abstract: This invention provides a cleaning method of silicon wafer for obtaining a silicon wafer in which micro roughness thereof under spatial frequency of 20/?m is 0.3 to 1.5 nm3 in terms of power spectrum density, by passing a process of oxidizing the silicon wafer with ozonized water and a process of cleaning said oxidized silicon wafer with hydrofluoric acid. Consequently, it is possible to remove surface adhering pollutant such as particles and metallic foreign matter with the surface structure of silicon wafer flattened up to atomic level by annealing maintained.

Abstract: This invention provides a cleaning method of silicon wafer for obtaining a silicon wafer in which micro roughness thereof under spatial frequency of 20/&mgr;m is 0.3 to 1.5 nm3 in terms of power spectrum density, by passing a process of oxidizing the silicon wafer with ozonized water and a process of cleaning said oxidized silicon wafer with hydrofluoric acid. Consequently, it is possible to remove surface adhering pollutant such as particles and metallic foreign matter with the surface structure of silicon wafer flattened up to atomic level by annealing maintained.

Abstract: A control device for regulating the amount of collected fuel and purge air which is delivered to the combustion chamber of an internal combustion engine in addition to its usual mixture of combustion air and fuel includes a valve element which is connected for operation in accordance with the pressure conditions of the fuel intake pipe and carburetor of the internal combustion engine to provide a flow rate of the collected fuel and purge air which is proportional to the flow rate of the usual fuel and air mixture. The device includes a valve body having a diaphragm dividing the interior and which carries a needle valve on one side which is adapted to seat in a valve seat of a line connected to the engine inlet. This same side of the diaphragm is also connected to a line which is adapted to receive accumulated or collected vapors, for example, from the fuel tank or the crank case.