Abstract: To provide a box pallet side wall that is excellent in beauty and is easily cleaned as well compared to a conventional box pallet side wall, and in which weight saving and high strengthening is possible compared to the conventional one. This box pallet side wall forms a hollow structure having an enclosed space therein. Thus, compared to a conventional box pallet side wall having a solid structure, when the box pallet side wall and the conventional one have the same weight, the geometrical moment of inertia of the box pallet side wall is increased. Since cell configuration ribs for reinforcing an outer main plate and an inner main plate are housed in the box pallet side wall and not exposed outside, irregularity on an outer surface of the box pallet side wall can be decreased compared to the conventional one.

Abstract: To provide a box pallet side wall that is excellent in beauty and is easily cleaned as well compared to a conventional box pallet side wall, and in which weight saving and high strengthening is possible compared to the conventional one. This box pallet side wall forms a hollow structure having an enclosed space therein. Thus, compared to a conventional box pallet side wall having a solid structure, when the box pallet side wall and the conventional one have the same weight, the geometrical moment of inertia of the box pallet side wall is increased. Since cell configuration ribs for reinforcing an outer main plate and an inner main plate are housed in the box pallet side wall and not exposed outside, irregularity on an outer surface of the box pallet side wall can be decreased compared to the conventional one.

Abstract: A semiconductor packaging method without an interposer is revealed. A mother chip is a two-layer structure consisting of a semiconductor layer and an organic layer where a redistribution layer is embedded into the organic layer with a plurality of first terminals and a plurality of second terminals disposed on the redistribution layer and exposed from the organic layer. The mother chip is flip-chip mounted on the substrate. The active surface of the daughter chip is in contact with the organic layer with the bonding pads of the daughter chip bonded to the first terminals. Furthermore, a plurality of electrically connecting components electrically connect the second terminals to the substrate. In the multi-chip stacked package, the interposer can be eliminated with a thinner overall package thickness as well as controlled package warpage.

Abstract: A semiconductor device with TSV and its fabrication method are revealed. The semiconductor device primarily comprises a chip and a flexible metal wire inside. A redistributed trace layer and a passivation layer are formed on the active surface of the chip. A through hole penetrates the chip from the active surface to the back surface, in which an insulation layer is disposed. The flexible metal wire has a first terminal and a second terminal where the first terminal is bonded to a redistributed pad of the redistributed trace layer and the second terminal passes through the through hole and protrudes from the back surface of the chip. Therefore, the flexible metal wire passing through the chip has two protruded integral terminals to achieve high stress resistance TSV with lower costs for good electrical connections of vertical stacking chips.

Abstract: A semiconductor device with TSV and its fabrication method are revealed. The semiconductor device primarily comprises a chip and a flexible metal wire inside. A redistributed trace layer and a passivation layer are formed on the active surface of the chip. A through hole penetrates the chip from the active surface to the back surface, in which an insulation layer is disposed. The flexible metal wire has a first terminal and a second terminal where the first terminal is bonded to a redistributed pad of the redistributed trace layer and the second terminal passes through the through hole and protrudes from the back surface of the chip. Therefore, the flexible metal wire passing through the chip has two protruded integral terminals to achieve high stress resistance TSV with lower costs for good electrical connections of vertical stacking chips.

Abstract: A micro BGA package comprises a first chip, a second chip, a single-layer PCB, a plurality of bonding wires, an encapsulant and a plurality of solder balls. The second chip is smaller than the first chip in size and stacked on the active surface of the first surface by facing the same direction with the first chip without covering the bonding pads of the first chip. The single-layer PCB is disposed on the second chip and smaller than the second chip in size. The single-layer PCB has a single-layer wiring pattern including a plurality of wire-connecting pads and a plurality of ball pads. By wire-bonding method, the first and second chips are electrically connected to the wire-connecting pads. The encapsulant is formed around the first chip, the second chip and the single-layer PCB to seal the bonding wires but exposes the rear surface of the first chip and the solder balls. The solder balls are disposed on the ball pads.

Abstract: A SIP package with a small dimension integrates one or more small size chips. The small size chips are disposed on a back side of a carrying chip and are encapsulated by an encapsulant. The SIP package further includes a substrate having a slot, an encapsulant and a plurality of bonding wires. The carrying chip is disposed on the substrate and the bonding pads of the carrying chip are aligned within the slot. A back side pattern is formed on the back side of the carrying chip. The chip-attached area of the small size chips is smaller than half of that of the back side of the carrying chip. Besides, the back side pattern is connected with a plurality of transfer fingers or a plurality of PTHs at the periphery of the back side for electrically connecting the small size chips to the substrate. Accordingly, the bonding wires used for connecting the small size chips can be shortened and regulated to achieve miniaturization of SIP package without increasing package size and thickness.

Abstract: The invention has an object of enhancing the service capacity and the operability of a network and simplifying the maintenance and control of the network by adopting a size automatic change mode after a path is set and providing arbitrary pathsize at arbitrary time. To achieve the object, the following means is provided. The service capacity and the operability of a network are enhanced and the maintenance and control of the network are simplified by adopting a size automatic change mode that the size of an input path signal conforms to information written to line overhead H1 and H2 bytes and an output path signal is transmitted with the pathsize the same as the size of the input path signal. A case that receiving path size changes exceeding a band and the fault of a path is caused occurs by providing both modes of fixing pathsize and automating pathsize to a user, flexibly corresponding to various service and automatically changing pathsize.

Abstract: A method for managing a network system via a managed object (MO), wherein a system administrator inputs to a network element connected to a maintenance terminal, a system ID for a network element under network management. The network element to be managed receives the system ID and sends back its own address to the network element connected to the maintenance terminal. The network element connected to the maintenance terminal, when receiving the address, sends a MO generator Protocol Data Unit (PDU) to the network element to be managed, and then allows the network element to be managed to generate a MO therein. The network element connected to the maintenance terminal also receives the MO generator PDU from the network element to be managed, and generates the MO for the network element to be managed on its own network element.

Abstract: The invention has an object of enhancing the service capacity and the operability of a network and simplifying the maintenance and control of the network by adopting a size automatic change mode after a path is set and providing arbitrary pathsize at arbitrary time. To achieve the object, the following means is provided. The service capacity and the operability of a network are enhanced and the maintenance and control of the network are simplified by adopting a size automatic change mode that the size of an input path signal conforms to information written to line overhead H1 and H2 bytes and an output path signal is transmitted with the pathsize the same as the size of the input path signal. A case that receiving path size changes exceeding a band and the fault of a path is caused occurs by providing both modes of fixing pathsize and automating pathsize to a user, flexibly corresponding to various service and automatically changing pathsize.

Abstract: A window molding member for automobiles includes at least one upper segment and at least one side segment to extend along upper and side edges of a window plate, respectively, which are integrally and continuously connected with each other. The molding member comprises a main body having a section with a longitudinally variable width, which is engageable with the outer surface of the window plate with a cushion element therebetween. The cushion element may have a longitudinally variable thickness to form a weir along the side segment for preventing rain water on the window plate from flowing across the side segment to preserve driver's sight through a side window.

Abstract: A window molding member for automobiles includes at least one upper segment and at least one side segment to extend along upper and side edges of a window plate, respectively, which are integrally and continuously connected with each other. The molding member comprises a main body having a section with a longitudinally variable width, which is engageable with the outer surface of the window plate with a cushion element therebetween. The cushion element may have a longitudinally variable thickness to form a weir along the side segment for preventing rain water on the window plate from flowing across the side segment to preserve driver's sight through a side window.