Abstract: A transport robot (2) includes a main body (20), and a plurality of rotating bodies (30) provided on the main body (20) and rotatable about a rotation axis along a direction in which a pair of rails (102L, 102R) extends. The plurality of rotating bodies (30) include a first rotating body (30) having at least one arm (L1, L2) that is configured to abut on one (102L) of the pair of rails (102L, 102R) on a first side which is one side in a traveling direction of the transport robot (2) with respect to the main body (20); and a second rotating body (30) having at least one arm (R1, R2) that is configured to abut on the other (102R) of the pair of rails (102L, 102R) on a second side which is the other side in the traveling direction of the transport robot (2) with respect to the main body (20).

Abstract: A polishing apparatus and method capable of polishing stably regardless of variation between polishing objects, change of a polishing means with lapse of time etc. The apparatus includes polishing pad 1, polishing table 3 with the polishing pad 1 adhered thereto, table motor 8 for driving the polishing table 3, conditioning means 5 for conditioning the polishing pad 1 at the same time of polishing and conditioning control system 12 for setting a conditioning condition during polishing. According to a polishing method of the present invention, a conditioning condition of the polishing pad 1 can be set so as to make a torque current 10, which is proportional to a friction force exerted between the polishing pad 1 and the wafer 2, constant, and thereby polishing speed can be stabilized.

Abstract: A polishing apparatus and method capable of polishing stably irrelevant of disorder such as the change of a polishing object, change of a polishing device with lapse of time. A polishing apparatus includes polishing pad 1, polishing table 3 with the polishing pad adhered thereto, table motor 8 for driving the polishing table 3, conditioning device 5 of the polishing pad 1 and conditioning control system 12 for setting conditioning conditions. According to a polishing method of the present invention, conditioning conditions of the polishing pad 1 are set on based on a frictional force exerted between the polishing pad 1 and a substrate or on torque current 10.