Patents by Inventor Takao KUMADA

Takao KUMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFER
    Publication number: 20140284660
    Abstract: A method for manufacturing a semiconductor wafer includes the steps of forming, on a first principal surface of a substrate, a compound semiconductor layer different in kind from the substrate, and removing, by etching, a part of the compound semiconductor layer. The part of the compound semiconductor layer is formed on an outer peripheral portion of the first principal surface of the substrate.
    Type: Application
    Filed: July 10, 2013
    Publication date: September 25, 2014
    Inventors: Ryohei MAKINO, Takao KUMADA, Masaharu EDO, Keishi TAKAKI