Abstract: The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.

Abstract: The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).

Abstract: A polishing apparatus has a turntable and a top ring for gripping a semiconductor wafer to be polished by an abrasive cloth on the turntable. The polishing apparatus incorporates a loading and unloading unit having a supply holder for holding and supplying a semiconductor wafer to be polished to the top ring at a transfer position, and a reception holder for receiving a polished semiconductor wafer from the top ring at the transfer position. The reception holder and the supply holder are mounted on respective opposite ends of a support block which is angularly movable in a vertical plane by a turning mechanism for moving the supply holder and the reception holder alternatively to the transfer position.