Abstract: A first device transmits a first random number to a second device through a first quantum channel, and receives a second random number from the second device through a second quantum channel. The first device generates a first encryption key based on the first random number and the second random number. The second device transmits the second random number to the first device through the second quantum channel, and receives the first random number from the first device through the first quantum channel. The second device generates a second encryption key based on the first random number and the second random number.

Abstract: A first device transmits a first random number to a second device through a first quantum channel, and receives a second random number from the second device through a second quantum channel. The first device generates a first encryption key based on the first random number and the second random number. The second device transmits the second random number to the first device through the second quantum channel, and receives the first random number from the first device through the first quantum channel. The second device generates a second encryption key based on the first random number and the second random number.

Abstract: In order to achieve the dispersion of a processing load between communication devices that perform information transmission, an information communication system according to an exemplary aspect of the present invention includes a first transmission system configured to transmit information in a direction from a first communication device to a second communication device; and a second transmission system configured to transmit information in a direction opposite to the direction of the first transmission system, wherein part of transmission information is received as received information in each of the first transmission system and the second transmission system.

Abstract: In order to achieve the dispersion of a processing load between communication devices that perform information transmission, an information communication system according to an exemplary aspect of the present invention includes a first transmission system configured to transmit information in a direction from a first communication device to a second communication device; and a second transmission system configured to transmit information in a direction opposite to the direction of the first transmission system, wherein part of transmission information is received as received information in each of the first transmission system and the second transmission system.

Abstract: A machining apparatus includes a transfer mechanism portion and a grinding wheel unit. The transfer mechanism portion transfers a tapered roller having a large end face directed outward in a radial direction by causing the tapered roller to revolve about a vertical line while causing the tapered roller to rotate. The grinding wheel unit is substantially C-shaped, and has a grinding wheel surface that comes in sliding contact with the large end face of the transferred tapered roller on an inner peripheral side thereof. The grinding wheel unit has a substantially C-shaped seat fixed to an apparatus main body, and a grinding wheel body that is separate from the seat and is detachably mounted to the seat. The grinding wheel body is substantially C-shaped, and has the grinding wheel surface on an inner peripheral side thereof. The grinding wheel body is constituted by segments disposed along a circumferential direction.

Abstract: A semiconductor apparatus is provided. The semiconductor apparatus includes: a base having a main surface on which a terminal is disposed; a first semiconductor device retained on the main surface of the base and having a top surface on which an electrode is disposed and a bottom surface facing the main surface of the base; a connection member connecting the terminal and the electrode; an encapsulant disposed on the main surface of the base and covering the terminal, the first semiconductor device and the connection member; and a heat dissipating member disposed on the encapsulant and having a space that opens in a direction extending perpendicular to the main surface of the base. The encapsulant is disposed in the space and, in a side view of the base, a peak of the connection member is located inside the space.

Abstract: A semiconductor device includes a semiconductor substrate, an electrode arranged on a first surface of the semiconductor substrate, a circuit formed on a second surface, of the semiconductor substrate, on an opposite side from the first surface, a conductor connecting the circuit and the electrode, a first lead arranged on an outer periphery of the semiconductor substrate, a connection member connecting the electrode and the first lead, and a sealing material sealing the semiconductor substrate, the first lead, and the connection member, where the second surface of the semiconductor substrate is exposed from the sealing material.

Abstract: A semiconductor apparatus is provided. The semiconductor apparatus includes: a base having a main surface on which a terminal is disposed; a first semiconductor device retained on the main surface of the base and having a top surface on which an electrode is disposed and a bottom surface facing the main surface of the base; a connection member connecting the terminal and the electrode; an encapsulant disposed on the main surface of the base and covering the terminal, the first semiconductor device and the connection member; and a heat dissipating member disposed on the encapsulant and having a space that opens in a direction extending perpendicular to the main surface of the base. The encapsulant is disposed in the space and, in a side view of the base, a peak of the connection member is located inside the space.

Abstract: A machining apparatus includes a transfer mechanism portion and a grinding wheel unit. The transfer mechanism portion transfers a tapered roller having a large end face directed outward in a radial direction by causing the tapered roller to revolve about a vertical line while causing the tapered roller to rotate. The grinding wheel unit is substantially C-shaped, and has a grinding wheel surface that comes in sliding contact with the large end face of the transferred tapered roller on an inner peripheral side thereof. The grinding wheel unit has a substantially C-shaped seat fixed to an apparatus main body, and a grinding wheel body that is separate from the seat and is detachably mounted to the seat. The grinding wheel body is substantially C-shaped, and has the grinding wheel surface on an inner peripheral side thereof. The grinding wheel body is constituted by segments disposed along a circumferential direction.

Abstract: The heat dissipation capability of a mounted semiconductor element can be improved, and the flexibility of circuit design of the semiconductor element and a circuit board and the productivity of the semiconductor element during a mounting step can be improved. A semiconductor element 1 and a circuit board 3 are arranged so that while the first main surfaces 1a and 3a of the semiconductor element 1 and the circuit board 3 face in the same direction and side surfaces 1c and 3c of the semiconductor element 1 and the circuit board 3 face each other, the connection electrode 2 and the electrode pad 4 are connected together. The first main surfaces 1a and 3a of the semiconductor element 1 and the circuit board 3 are covered with an encapsulation resin 7.

Abstract: A resin molding mold 20 with a cavity 21 has a resin injection port 29a from which a molding resin 25 is injected toward the cavity 21, and an air release port 30a from which air from the cavity 21 is released during resin injection. Not only the resin injection port 29a but also the air release port 30a is formed in a top surface portion 21a of the cavity 21. Thus, even if a resin burr remains in the resin injection port 29a or the air release port 30a, it can be prevented from adhering to an external terminal 4A provided on a front surface portion 2a of the substrate 2.

Abstract: A semiconductor device includes: an element mounting member including a first electrode; a semiconductor element mounted on the element mounting member and including a second electrode; and an interposer element mounted on the element mounting member with a first side of the interposer element facing one of a side of the semiconductor element. The interposer element is one of a triangle and a trapezoid in plan view, and includes: a first interposer electrode electrically connected to the second electrode via a first wire; a second interposer electrode electrically connected to the first electrode; and an internal interconnection electrically connecting the first interposer electrode and the second interposer electrode to each other.

Abstract: An object of the present invention is to provide a storing tray and a storing device whereby an object such as an electronic component to be stored can be picked up in a preferred manner and a plurality of stored objects can be flipped and transferred at once. Another object is to form the storing tray as a soft tray. The storing tray includes a storing part on its main surface, the storing part including a storing base for placing therein an object such as an electronic component, a plurality of convex portions formed along the outer periphery of the storing base to protrude upward more than the storing base, and concave portions formed along the outer periphery of the storing base between the plurality of convex portions to be recessed downward more than the storing base. The storing tray has an uneven back surface opposite in shape to the main surface.

Abstract: A semiconductor device includes: an element mounting member including a first electrode; a semiconductor element mounted on the element mounting member and including a second electrode; and an interposer element mounted on the element mounting member with a first side of the interposer element facing one of a side of the semiconductor element. The interposer element is one of a triangle and a trapezoid in plan view, and includes: a first interposer electrode electrically connected to the second electrode via a first wire; a second interposer electrode electrically connected to the first electrode; and an internal interconnection electrically connecting the first interposer electrode and the second interposer electrode to each other.

Abstract: A production equipment includes a substrate 2 placed inside and having a plurality of semiconductor elements 3 mounted thereon, and a resin molding mold 20 having a cavity 21. The mold 20 has resin injection ports 29a and air release ports 30a. Each of the resin injection ports 29a is formed in a top surface portion of the cavity in the mold in association with the corresponding semiconductor element 3. Each of the air release ports 30a is formed around each of the resin injection ports 29a.

Abstract: A production equipment includes a substrate 2 placed inside and having a plurality of semiconductor elements 3 mounted thereon, and a resin molding mold 20 having a cavity 21. The mold 20 has resin injection ports 29a and air release ports 30a. Each of the resin injection ports 29a is formed in a top surface portion of the cavity in the mold in association with the corresponding semiconductor element 3. Each of the air release ports 30a is formed around each of the resin injection ports 29a.

Abstract: A resin molding mold 20 with a cavity 21 has a resin injection port 29a from which a molding resin 25 is injected toward the cavity 21, and an air release port 30a from which air from the cavity 21 is released during resin injection. Not only the resin injection port 29a but also the air release port 30a is formed in a top surface portion 21a of the cavity 21. Thus, even if a resin burr remains in the resin injection port 29a or the air release port 30a, it can be prevented from adhering to an external terminal 4A provided on a front surface portion 2a of the substrate 2.

Abstract: A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: An electronic circuit device, includes: internal terminals; a board on which wirings to the internal terminals are formed; an electronic component that is mounted on the board and is connected with the internal terminals; and an encapsulation resin with which the electronic component and the internal terminals are encapsulated. A part of the wiring forms a ring-shaped portion, and the ring-shaped portion has a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections. The plurality of ring-constituting sections are connected to the respective internal terminals, and a coating region of the encapsulation resin is surrounded with the ring-shaped portion. The applied area of the encapsulation resin can be controlled to be constant without using a special element for controlling the flow of the encapsulation resin.