Abstract: Through hole (3) for product, through holes (7a, 7b) for laminate recognition marks, through holes (8a, 8b) for an X-ray recognition marks are formed on prepreg sheet (1) having mold release films (2a, 2b) attached to the front and back surfaces thereof. By masking through holes (7a, 7b) for laminate recognition mark, conductive paste (4) is filled in through hole (3) for product and through holes (8a, 8b) for X-ray recognition marks. Thereafter, mold release films (2a, 2b) are removed so as to manufacture a circuit board. Since conductive paste (4) is not filled in through holes (7a, 7b) for laminate recognition marks, a recognition mark with high laminating accuracy can be easily obtained, and a high density and high quality circuit formation substrate having improved laminating accuracy can be obtained.