Patents by Inventor Takao OKANO

Takao OKANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145146
    Abstract: A magnetostrictive film includes rich regions having a mesh pattern in a cross section perpendicular to a film thickness direction of the magnetostrictive film. The rich regions are richer in a specific element contributing to ferromagnetism than surroundings of the rich regions.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Applicant: TDK CORPORATION
    Inventors: Mutsuko NAKANO, Yasuhisa OKANO, Takao NOGUCHI, Wakako OKAWA, Yoshitomo TANAKA
  • Patent number: 10192671
    Abstract: A multilayer body 12 is obtained by stacking a plurality of insulator layers in which an inner conductor and a via hole conductor are formed. Outer electrodes 42a through 42e connected to the inner conductor layers are formed on the opposite side surfaces of the multilayer body 12. While the two outer electrodes 42a and 42b are formed so as to extend from one principal surface to the other principal surface of the multilayer body 12, the other outer electrodes 42c through 42e are formed so as to extend from one principal surface to an exposed portion of the inner conductor on the multilayer body 12, or formed so as not to reach the other principal surface. In addition, the widths of the outer electrodes 42a through 42e may differ from one another.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: January 29, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yosuke Matsushita, Takao Okano, Hiroyuki Sasaki, Kenichiro Kikuchi
  • Patent number: 10178774
    Abstract: In an electronic component, a peripheral portion of an external terminal electrode is thicker than a center portion thereof, and at least a portion of the peripheral portion is buried in a component main body. A surface of the external terminal electrode and a principal surface of the component main body are located on the same plane. An electrically insulating coating layer is arranged along the principal surface of the component main body so as to cover at least a portion of the peripheral portion of the external terminal electrode. An end portion of the coating layer is in contact with a thickest portion of the peripheral portion of the external terminal electrode in the principal surface of the component main body. The coating layer and the surface of the external terminal electrode are located on the same plane.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: January 8, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kunio Iwakoshi, Syuichi Onodera, Takao Okano, Yoshihito Otsubo
  • Publication number: 20150042439
    Abstract: A multilayer body 12 is obtained by stacking a plurality of insulator layers in which an inner conductor and a via hole conductor are formed. Outer electrodes 42a through 42e connected to the inner conductor layers are formed on the opposite side surfaces of the multilayer body 12. While the two outer electrodes 42a and 42b are formed so as to extend from one principal surface to the other principal surface of the multilayer body 12, the other outer electrodes 42c through 42e are formed so as to extend from one principal surface to an exposed portion of the inner conductor on the multilayer body 12, or formed so as not to reach the other principal surface. In addition, the widths of the outer electrodes 42a through 42e may differ from one another.
    Type: Application
    Filed: October 28, 2014
    Publication date: February 12, 2015
    Inventors: Yosuke Matsushita, Takao Okano, Hiroyuki Sasaki, Kenichiro Kikuchi
  • Publication number: 20140057080
    Abstract: In an electronic component, a peripheral portion of an external terminal electrode is thicker than a center portion thereof, and at least a portion of the peripheral portion is buried in a component main body. A surface of the external terminal electrode and a principal surface of the component main body are located on the same plane. An electrically insulating coating layer is arranged along the principal surface of the component main body so as to cover at least a portion of the peripheral portion of the external terminal electrode. An end portion of the coating layer is in contact with a thickest portion of the peripheral portion of the external terminal electrode in the principal surface of the component main body. The coating layer and the surface of the external terminal electrode are located on the same plane.
    Type: Application
    Filed: October 31, 2013
    Publication date: February 27, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kunio IWAKOSHI, Syuichi ONODERA, Takao OKANO, Yoshihito OTSUBO