Abstract: A bare chip testing socket is provided which includes a base plate having electrodes formed thereon to have the same pattern as a semiconductor chip having a large number of electrodes; a pin assembly, arranged between the semiconductor chip and the base plate, having a large number of testing pins for respectively connecting the electrodes of the semiconductor chip to the electrodes of the base plate; and pressing means for pressing the semiconductor chip to press the electrodes of the semiconductor chip against the test pins of the pin assembly; and methods for manufacturing a pin assembly and pipe assembly constructing the bare chip testing socket are provided.

Abstract: A resistance welding process for aluminum and aluminum alloy materials for enabling the remarkable improvement of the electrode life comprises the steps of preparing an insert material having the overall thickness of 0.02 to 1 mm including a sheet-like core material consisting of iron, steel, copper or copper alloy and coated layers each having the thickness of 1 to 100 .mu.m, consisting of any one of Ni, Ni alloy, Ti, Ti alloy, Nb, Nb alloy, Mo, Mo alloy, W, W alloy, Cr, Cr alloy, Co and Co alloy and formed on both surfaces of the core material, or an insert material consisting of Ti foil or Ni foil; interposing the insert material between each of upper and under electrodes and each portion of overlapped materials to be welded consisting of aluminum or aluminum alloy; pressurizing the materials to be welded by the upper and under electrodes to join the materials to be welded together. The coated layers on both surfaces of the core material may consist of the same metal or different metals from each other.

Abstract: A manufacturing method for a supermicro-connector, comprising: a step of fixing a plurality of conductor wires, arranged substantially parallel to one another, by means of an elastic insulator interposed between the conductor wires, thereby making a composite structure formed of the conductor wires and the insulator; a step of cutting the composite structure along a plane extending at right angles to the conductor wires, thereby making a plurality of composite chips; a step of removing the insulator from at least one cut surface of each of the composite chips by dissolution by means of an agent, thereby exposing the respective end portions of the conductor wires for a predetermined length; and a step of forming solder bumps individually on the respective exposed end portions of the conductor wires.