Patents by Inventor Takao Takeuchi

Takao Takeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6923875
    Abstract: According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: August 2, 2005
    Assignee: Harima Chemicals, Inc.
    Inventors: Kazuki Ikeda, Hiroshi Tanaka, Hisao Irie, Keigo Obata, Takao Takeuchi, Naoya Inoue
  • Patent number: 6852210
    Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: February 8, 2005
    Assignees: Daiwa Fine Chemicals Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Keigo Obata, Dong-Hyun Kim, Takao Takeuchi, Seiichiro Nakao, Shinji Inazawa, Ayao Kariya, Masatoshi Majima, Shigeyoshi Nakayama
  • Publication number: 20030159761
    Abstract: According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.
    Type: Application
    Filed: January 15, 2003
    Publication date: August 28, 2003
    Applicant: HARIMA CHEMICALS, INC.
    Inventors: Kazuki Ikeda, Hiroshi Tanaka, Hisao Irie, Keigo Obata, Takao Takeuchi, Naoya Inoue
  • Patent number: 6607653
    Abstract: The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating bath containing tin and copper, the bath being capable of preventing deposition of copper on a tin anode by substitution, having low dependence of plated coating composition on current density, high bath stability and resistance to turbidness.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: August 19, 2003
    Assignees: Daiwa Fine Chemicals Co., Ltd., Ishihara Chemical Co., Ltd.
    Inventors: Kiyotaka Tsuji, Keigo Obata, Takao Takeuchi, Hidemi Nawafune, Tetsuji Nishikawa
  • Patent number: 6570096
    Abstract: This invention provides a production method of Nb3Al superconducting multifilamentary wire based on rapid-heating, quenching and transformation method, capable of producing a high-performance Nb3Al superconducting multifilamentary wire by improving critical temperature thereof, upper critical field and critical current density. Upon a first stage heat treatment of beating a composite, in which bcc phase Nb—Al supersaturated solid solution is dispersed in Nb matrix, the bcc phase Nb—Al supersaturated solid solution ordered in temperature rise process is made disordered at an initial phase thereof and a non-reacting portion located adjacent is heated using a reaction heat generated when transforming this disordered bcc phase to A15 phase. Then, disordering of the bcc phase is promoted while propagating a high-temperature transformation region so as to automatically progress high-temperature beat treatment.
    Type: Grant
    Filed: May 25, 2001
    Date of Patent: May 27, 2003
    Assignee: National Institute for Materials Science
    Inventors: Takao Takeuchi, Nobuya Banno, Toshihisa Asano, Hitoshi Wada
  • Publication number: 20020079226
    Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
    Type: Application
    Filed: January 7, 2002
    Publication date: June 27, 2002
    Applicant: DAIWA FINE CHEMICALS CO., LTD.
    Inventors: Keigo Obata, Dong-Hyun Kim, Takao Takeuchi, Seiichiro Nakao, Shinji Inazawa, Ayao Kariya, Masatoshi Majima, Shigeyoshi Nakayama
  • Publication number: 20020037815
    Abstract: This invention provides a production method of Nb3Al superconducting multifilamentary wire based on rapid-heating, quenching and transformation method, capable of producing a high-performance Nb3Al superconducting multifilamentary wire by improving critical temperature thereof, upper critical field and critical current density.
    Type: Application
    Filed: May 25, 2001
    Publication date: March 28, 2002
    Inventors: Takao Takeuchi, Nobuya Banno, Toshihisa Asano, Hitoshi Wada
  • Patent number: 6338787
    Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: January 15, 2002
    Assignees: Daiwa Fine Chemicals Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Keigo Obata, Dong-Hyun Kim, Takao Takeuchi, Seiichiro Nakao, Shinji Inazawa, Ayao Kariya, Masatoshi Majima, Shigeyoshi Nakayama
  • Patent number: 6235093
    Abstract: An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited, and at least one mercapto compound or sulfide compound or a salt thereof as a reducing agent. The reducing agent is typically mercaptoacetic acid, 2-mercaptopropionic acid, 2-aminoethanethiol, 2-mercaptoethanol, glucose cysteine, 1-thioglycerol, sodium mercaptopropanesulfonate, N-acetylmethionine, thiosalicylic acid, 2-thiazoline-2-thiol, 2,5-dimercapto-1,3,4-thiadiazole, 2-benzothiazolethiol, or 2-benzimidazolethiol. They may be used singly or in combination.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: May 22, 2001
    Assignee: Daiwa Fine Chemicals Co., Ltd.
    Inventors: Yoshiaki Okuhama, Takao Takeuchi, Keigo Obata, Yasuhito Kohashi, Hidemi Nawafune
  • Patent number: 6183545
    Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: February 6, 2001
    Assignee: Daiwa Fine Chemicals Co., Ltd.
    Inventors: Yoshiaki Okuhama, Takao Takeuchi, Masakazu Yoshimoto, Shigeru Takatani, Emiko Tanaka, Masayuki Nishino, Yuji Kato, Yasuhito Kohashi, Kyoko Kuba, Tetsuya Kondo, Keiji Shiomi, Keigo Obata, Mitsuo Komatsu, Hidemi Nawafune
  • Patent number: 5678411
    Abstract: A self-contained liquefied gas supply system has a tank for storing a liquefied gas, a primary pump for delivering the liquefied gas from the tank, a secondary pump for pressurizing the liquefied gas delivered from the primary pump, a vaporizer for vaporizing the liquefied gas discharged from the secondary pump into a vaporized gas, an expander for actuating the secondary pump with the vaporized gas produced by the vaporizer, and a back-pressure line connected to an outlet of the expander. A bypass pipe is connected between the primary pump and the vaporizer in bypassing relation to the secondary pump for supplying the liquefied gas from the primary pump to the vaporizer. A joint line is connected between the back-pressure line and a substantially atmospheric pressure line, the joint line having a first flow regulating valve for regulating a rate of flow of a gas from the back-pressure line to the substantially atmospheric pressure line.
    Type: Grant
    Filed: April 23, 1996
    Date of Patent: October 21, 1997
    Assignee: Ebara Corporation
    Inventors: Masao Matsumura, Takao Takeuchi, Tadahiko Kishikawa
  • Patent number: 5649425
    Abstract: A turboexpander pump unit has a vertical or horizontal shaft, a pump connected to an end of the shaft for pressurizing a liquid fluid to a pressure higher than a predetermined delivery pressure, a heat exchanger for heating and converting the liquid fluid pressurized by the pump into a high-pressure gas, and an expander turbine connected to an opposite end of the shaft and actuatable by a thermal energy reduction produced when the high-pressure gas from the heat exchanger is lowered to the predetermined delivery pressure, for delivering the liquid fluid continuously under a predetermined pressure to an external installation. The pump having at least two outlet ports for discharging the liquid fluid at respective different pressures. One of the two outlet ports is connected to the heat exchanger, and the other to a liquid delivery line.
    Type: Grant
    Filed: February 21, 1995
    Date of Patent: July 22, 1997
    Assignee: Ebara Corporation
    Inventors: Masao Matsumura, Takao Takeuchi, Seigo Katsuta
  • Patent number: 5618404
    Abstract: An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode and a plurality of cathodes in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive .alpha. particle counts of less than 0.1 CPH/cm.sup.2.
    Type: Grant
    Filed: May 16, 1995
    Date of Patent: April 8, 1997
    Assignee: Daiwa Fine Chemicals Co., Ltd.
    Inventors: Yoshiaki Okuhama, Seishi Masaki, Takao Takeuchi, Yoshiharu Matsuda, Masakazu Yoshimoto
  • Patent number: 5233603
    Abstract: A packet switch for high-speed synchronous multiplexing of voice and picture communications collectively. The packet switch uses among other things an input multiplexer, and output demultiplexer, and a single buffer memory divided into memory areas connected to multiple input and output lines. The subdivided buffer is controlled by counters rather than a more complicated address exchanger. A second embodiment eliminates the need for an output demultiplexer because of individual read/write control of the buffer units. A third embodiment includes a bidirectional bus between an input buffer and an output buffer. A fourth embodiment uses a more economical unidirectional bus. The unidirectional bus can be limited to a part of an input packet to permit Large Scale Integration (LSI). In the LSI configuration, address filters may be replaced with a centralized address controller, and the buffer can consist of FiFo memory units or RAM units.
    Type: Grant
    Filed: October 8, 1991
    Date of Patent: August 3, 1993
    Assignee: NEC Corporation
    Inventors: Takao Takeuchi, Hiroshi Suzuki, Susumu Iwasaki, Hiroshi Nagano, Toshio Suzuki
  • Patent number: 4917965
    Abstract: A long, linear composite article which is characterized in that a large number of composite filaments are present as spaced from one another in a continuous layer composed of copper, a copper alloy, niobium, tantalum or vanadium, each of said composite filaments having a structure that at least one strand of a linear body is surrounded by an aluminum alloy or niobium, said linear body being composed substantially of extremely fine, filamentary superconducting Nb.sub.3 Al compound having an average diameter of from about 0.03 .mu.m to about 1 .mu.m. The said composite article can be prepared by drawing a composite material composed of (a) an aluminum alloy and (b) niobium, together with copper or a copper alloy once or plural times repeatedly, until the average diameter of the aluminum alloy of (a) becomes about 1 .mu.m or less, and heat-treating the resultant linear composite material.
    Type: Grant
    Filed: February 24, 1989
    Date of Patent: April 17, 1990
    Assignee: National Research Institute for Metals
    Inventors: Kiyoshi Inoue, Takao Takeuchi, Yasuo Iijima, Michio Kosuge
  • Patent number: 4569041
    Abstract: In an integrated circuit/packet switching network comprising a plurality of nodes and one or more common access loops for inter-node network, an integrated circuit/packet switching system comprises a fixed time cycle frame format allotted to the loop or loops. Each of the nodes functions in accordance with the frame format to assemble one or more composite packets for each destination node from a plurality of circuit- and packet-switched calls designated to said each destination node and to send the assembled composite packet or packets on the loop or loops for each frame cycle time. Each node also functions in accordance with the frame format to extract self-designated composite packets among composite packets on the loop or loops and to disassemble the extracted composite packets into the constituent circuit- and packet-switched calls.
    Type: Grant
    Filed: March 14, 1984
    Date of Patent: February 4, 1986
    Assignee: NEC Corporation
    Inventors: Takao Takeuchi, Takehiko Yamaguchi
  • Patent number: 4385942
    Abstract: In a method for producing an Nb.sub.3 Sn superconductor which comprises elongating a composite composed of a core portion of an alloy containing niobium and a matrix portion of a copper-tin alloy, a copper-tin-aluminum alloy or a copper-tin-gallium alloy and heat-treating the elongated composite to form an Nb.sub.3 Sn layer between the core portion and the matrix portion; the improvement wherein the core portion of the composite is made of a niobium-titanium alloy containing 0.1 to 10 atomic percent of titanium.
    Type: Grant
    Filed: September 16, 1981
    Date of Patent: May 31, 1983
    Assignee: National Research Institute for Metals
    Inventors: Kyoji Tachikawa, Toshihisa Asano, Takao Takeuchi
  • Patent number: 4341572
    Abstract: In a method for producing a Nb.sub.3 Sn superconductor which comprises drawing a composite having a core of a Nb-Hf alloy containing 0.1 to 30 atomic % of Hf and a sheath containing Cu and Sn, and heat-treating the composite to form a Nb.sub.3 Sn layer between the core and the sheath; the improvement wherein the sheath is formed of pure Cu, a Cu-Sn alloy containing not more than 6 atomic % of Sn, a Cu-Ga alloy containing not more than 20 atomic % of Ga, a Cu-Al alloy containing not more than 20 atomic % of Al, a Cu-Ga-Sn alloy containing not more than 6 atomic % of Sn and not more than 20 atomic % of Ga, or a Cu-Al-Sn alloy containing not more than 6 atomic % of Sn and not more than 20 atomic % of Al; and after the drawing, a Sn film is coated on the surface of the sheath, and then the product having a Sn film coated thereon is heat-treated.
    Type: Grant
    Filed: November 10, 1980
    Date of Patent: July 27, 1982
    Assignee: National Research Institute for Metals
    Inventors: Kyoji Tachikawa, Kazumasa Togano, Takao Takeuchi