Patents by Inventor Takao Takita

Takao Takita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190115119
    Abstract: A coil for a rotating electrical machine, the coil comprising a coil conductor and an insulating layer that is disposed around an outer periphery of the coil conductor, the insulating layer comprising a mica tape, the mica tape comprising a mica layer including mica and a backing layer including a backing material, the mica comprising mica pieces having a particle size of 2.8 mm or more, as measured by a JIS standard sieve, at a proportion of less than 45% by mass of a total of the mica pieces that are obtained from the mica layer being separated from the backing layer.
    Type: Application
    Filed: April 10, 2017
    Publication date: April 18, 2019
    Inventors: Takaya Yamamoto, Miyuki Muromachi, Takao Takita, Keiji Fukushima, Yoshitaka Takezawa
  • Publication number: 20180137956
    Abstract: A coil for a rotary electrical machine comprising a coil conductor and an insulation layer disposed around an outer periphery of the coil conductor, the insulation layer comprising a cured product of a mica tape, the mica tape comprising mica, a reinforcing member and a thermosetting resin, and having a reaction heat generated by a curing reaction of the thermosetting resin, as measured by differential scanning calorimetry (DSC), of ?270 J/g or less.
    Type: Application
    Filed: July 15, 2016
    Publication date: May 17, 2018
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Takaya YAMAMOTO, Miyuki MUROMACHI, Takao TAKITA, Keiji FUKUSHIMA, Yoshitaka TAKEZAWA
  • Patent number: 5569321
    Abstract: A pretreating solution for electroless plating comprising sulfuric acid, a halide, an organic acid and water as a diluent functions as an adhesion accelerating agent without generating etching corrosion, has a long life and provides excellent adhesiveness of plated copper to both glass cloth and substrate resins.
    Type: Grant
    Filed: April 8, 1994
    Date of Patent: October 29, 1996
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Takao Takita, Takeshi Sakai, Takeshi Shimazaki
  • Patent number: 5076840
    Abstract: An electroless copper plating solution comprising a cupric salt, a copper complexing agent, a reducing agent, a pH adjustor, L-arginine and at least one of .alpha.,.alpha.'-dipyridyl and a cyano complex compound can give plated films high in ductility and adhesive strength and excellent in mechanical properties.
    Type: Grant
    Filed: January 4, 1990
    Date of Patent: December 31, 1991
    Assignees: Hitachi Chemical Co. Ltd., Hitachi Borden Chemical Products, Inc.
    Inventors: Takao Takita, Takeshi Shimazaki, Satoshi Akazawa, Kazuichi Kuramoti, Hiroyuki Toyoda