Abstract: A bonding structure to be formed in bonding of a Si semiconductor or the like and a substrate, as materials to be bonded, with transient liquid phase diffusion bonding. The bonding structure includes a bonding portion presenting a specific material texture. A metal composition of the bonding portion includes 78.0% by mass or more and 80.0% by mass or less of Ag, 20.0% by mass or more and 22.0% by mass or less of Sn, and an inevitable impurity element. A characteristic material texture configured from an island-like Ag phase including 95% by mass or more of Ag and a Ag3Sn phase including a Ag3Sn intermetallic compound and surrounding the island-like Ag phase is presented in observation of any cross section of the bonding portion.

Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

Abstract: A silver brazing material containing silver, copper, zinc, manganese, nickel, and tin as indispensable constituent elements. The silver brazing material includes 35 mass % or more and 45 mass % or less silver, 18 mass % or more and 28 mass % or less zinc, 2 mass % or more and 6 mass % or less manganese, 1.5 mass % or more and 6 mass % or less nickel, and 0.5 mass % or more and 5 mass % or less tin, with the balance being copper impurities. Within these compositional ranges, a predetermined relation is set between the manganese content and the nickel content, whereby the silver brazing material can be provided with excellent characteristics also in terms of processability or wettability. In the silver brazing material of the present invention, the silver content is reduced, and also melting point reduction and the narrowing of the temperature difference between solidus temperature and liquidus temperature are attempted.

Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

Abstract: A silver brazing material containing silver, copper, zinc, manganese, nickel, and tin as indispensable constituent elements. The silver brazing material includes 35 mass % or more and 45 mass % or less silver, 18 mass % or more and 28 mass % or less zinc, 2 mass % or more and 6 mass % or less manganese, 1.5 mass % or more and 6 mass % or less nickel, and 0.5 mass % or more and 5 mass % or less tin, with the balance being copper impurities. Within these compositional ranges, a predetermined relation is set between the manganese content and the nickel content, whereby the silver brazing material can be provided with excellent characteristics also in terms of processability or wettability. In the silver brazing material of the present invention, the silver content is reduced, and also melting point reduction and the narrowing of the temperature difference between solidus temperature and liquidus temperature are attempted.

Abstract: A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.

Abstract: A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.

Abstract: Proposed is a contact material constituting a slider for a fuel sender, the slider moving on a conductor in conjunction with a float moving in accordance with a liquid level, wherein the contact material includes 10 to 25 mass % of nickel and a balance of palladium. The present contact material is useful in the light of material cost in addition to corrosion resistance and durability. The fuel sender is useful for vehicles, such as FFV, using composite fuel of alcohol and the like. The present invention allows for producing a slider for a fuel sender having excellent corrosion resistance and abrasion resistance.

Abstract: The present invention provides an active metal brazing material composed of a Ag—Cu—Ti—Sn alloy containing by weight 20 to 40% of Cu, 1.0 to 3.0% of Ti, 1.2 to 6.0% of Sn and the balance being Ag, and having a metallographic structure including a Sn—Ti or Cu—Ti intermetallic compound dispersed in a Ag—Cu alloy matrix, wherein the weight ratio Sn/Ti between Ti and Sn is 1.2 or more, and additionally the particle size of the intermetallic compound is 20 ?m or less. The foregoing active metal brazing material improves the workability of the hitherto known Ag—Cu—Ti alloy active metal brazing material and enables a critical dimension processing with a high processing rate, and can be produced by melting and casting the foregoing Ag—Cu—Ti—Sn alloy, and by subsequently plastically working the cast at a working rate of 90% or more to make finer the intermetallic compound involved.

Abstract: Proposed is a contact material constituting a slider for a fuel sender, the slider moving on a conductor in conjunction with a float moving in accordance with a liquid level, wherein the contact material includes 10 to 25 mass % of nickel and a balance of palladium. The present contact material is useful in the light of material cost in addition to corrosion resistance and durability. The fuel sender is useful for vehicles, such as FFV, using composite fuel of alcohol and the like. The present invention allows for producing a slider for a fuel sender having excellent corrosion resistance and abrasion resistance.

Abstract: The present invention provides an active metal brazing material composed of a Ag—Cu—Ti—Sn alloy containing by weight 20 to 40% of Cu, 1.0 to 3.0% of Ti, 1.2 to 6.0% of Sn and the balance being Ag, and having a metallographic structure including a Sn—Ti or Cu—Ti intermetallic compound dispersed in a Ag—Cu alloy matrix, wherein the weight ratio Sn/Ti between Ti and Sn is 1.2 or more, and additionally the particle size of the intermetallic compound is 20 ?m or less. The foregoing active metal brazing material improves the workability of the hitherto known Ag—Cu—Ti alloy active metal brazing material and enables a critical dimension processing with a high processing rate, and can be produced by melting and casting the foregoing Ag—Cu—Ti—Sn alloy, and by subsequently plastically working the cast at a working rate of 90% or more to make finer the intermetallic compound involved.