Patents by Inventor Takara Fujii

Takara Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Production of laminate for receiving chemical plating
    Patent number: 4389268
    Abstract: The method of producing a laminate for receiving a chemical plating comprises the step of forming a thermosetting adhesive layer containing a butadiene-based rubber on at least one surface of a peel-resistant insulating sheet. After the adhesive layer has been cured substantially completely, the adhesive-bearing sheet is bonded to a base material so as to obtain an integral laminate, followed by coarsening the outermost surface of the laminate on the side of the insulating sheet. A laminate with a metalized surface is obtained, if a chemical plating is applied to the coarsened surface of the laminate.
    Type: Grant
    Filed: July 23, 1981
    Date of Patent: June 21, 1983
    Assignees: Tokyo Shibaura Denki Kabushiki Kaisha, Toshiba Chemical Products Company
    Inventors: Renzo Oshima, Yoshiyuki Kyojima, Takara Fujii, Shoji Kato
  • Heat-resistant thermosetting polyimide resin
    Patent number: 4107153
    Abstract: A heat-resistant thermosetting resin composition is obtained by reaction with each other of an N,N'-bis-imide of unsaturated dicarboxylic acid (A), a cyanuric or isocyanuric acid or derivatives thereof (B), and at least one compound (C) selected from the group consisting of tetracarboxylic acid diimide, hydantoin and derivatives thereof, and barbituric acid and derivatives thereof. This resin composition has excellent heat-resistance and workability, and is employed for the use of a molding, laminated sheet, adhesive, etc.
    Type: Grant
    Filed: September 23, 1975
    Date of Patent: August 15, 1978
    Assignee: Toshiba Chemical Products Co., Ltd.
    Inventors: Keiichi Akiyama, Junichi Kamiuchi, Itsuo Matsuda, Takara Fujii
  • Heat-resistant thermosetting polyimide resin with bis-phenol-epichlorohydrin reaction product
    Patent number: 4097545
    Abstract: A heat-resistant thermosetting resin composition is obtained by reaction with each other of an N,N'-bis-imide of unsaturated dicarboxylic acid (A), a cyanuric or isocyanuric acid or derivatives thereof (B), and at least one compound (C) selected from the group consisting of tetracarboxylic acid diimide, hydantoin and derivatives thereof, and barbituric acid and derivatives thereof. This resin composition has excellent heat-resistance and workability, and is employed for the use of a molding, laminated sheet, adhesive, etc.
    Type: Grant
    Filed: August 30, 1976
    Date of Patent: June 27, 1978
    Assignee: Toshiba Chemical Products Co. Ltd.
    Inventors: Keiichi Akiyama, Junichi Kamiuchi, Itsuo Matsuda, Takara Fujii