Abstract: A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.

Abstract: A substrate processing system includes a substrate processing apparatus and a control device. The substrate processing apparatus includes a chamber, and a placing table provided inside the chamber. The placing table places a substrate thereon, and includes a base and an electrostatic chuck provided on an upper surface of the base. The electrostatic chuck has a plurality of division regions each provided with a heater therein. The substrate processing system also includes a control device that includes a measuring unit that measures a resistance value of the heater for each of the division regions, an estimating unit that estimates a temperature of each of the division regions based on the resistance value of the heater measured by the measuring unit, and a power controller that controls a power supplied to the heater for each of the division regions based on the temperature estimated by the estimating unit.

Abstract: A calibration method of an infrared camera includes setting a placing table on which a substrate is placed to different temperatures and acquiring a measurement value of radiation amount of infrared light emitted from each of multiple zones provided in a top surface of the placing table by an infrared camera at each of the temperatures; calculating, as a calibration value, a difference between a measurement value of a reference zone which is one of the zones provided with a temperature sensor and a measurement value of another one of the zones at each of the temperatures; specifying an interpolation curve indicating a variation tendency of the calibration value with respect to the measurement value of the reference zone for each of the zones; and storing parameters of the interpolation curve specified for each of the zones.

Abstract: A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.

Abstract: A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.

Abstract: A calibration method of an infrared camera includes setting a placing table on which a substrate is placed to different temperatures and acquiring a measurement value of radiation amount of infrared light emitted from each of multiple zones provided in a top surface of the placing table by an infrared camera at each of the temperatures; calculating, as a calibration value, a difference between a measurement value of a reference zone which is one of the zones provided with a temperature sensor and a measurement value of another one of the zones at each of the temperatures; specifying an interpolation curve indicating a variation tendency of the calibration value with respect to the measurement value of the reference zone for each of the zones; and storing parameters of the interpolation curve specified for each of the zones.

Abstract: A temperature measurement device includes a light emitting part including a first light source configured to output measurement light with a first wavelength and a second light source configured to output reference light with a second wavelength, a light receiving part configured to receive reflected light of the measurement light and reflected light of the reference light that have passed through a temperature sensing device that changes light transmission characteristics with changes in temperature, a control part configured to measure a temperature detected by the temperature sensing device based on an amount of light of the received reflected light of the measurement light and an amount of light of the received reflected light of the reference light, and a temperature adjustment part configured to separately adjust the temperature of the first light source and the temperature of the second light source.

Abstract: Provided is an optical temperature sensor including a temperature sensing element having light transmission characteristics that vary with temperature, a hollow holding member that holds the temperature sensing element, and an optical fiber that is arranged inside the holding member, the optical fiber including a tip face that is disposed to face the temperature sensing element at a position separated from the temperature sensing element by a predetermined distance. The temperature sensing element allows light emitted from the tip face of the optical fiber to be incident thereon, allows the incident light to be transmitted therethrough, and allows reflected light of the transmitted light that has been reflected by a measuring object to be transmitted therethrough.

Abstract: An optical temperature sensor includes an light-emitting-side measurement unit to measure a first light intensity of a measuring beam and a second light intensity of a reference beam, and a light-receiving-side measurement unit to measure a third light intensity of a first reflected beam of the measuring beam and a fourth light intensity of a second reflected beam of the reference beam. The optical temperature sensor further includes a control unit to adjust at least one of a first control target value of the first light intensity and a second control target value of the second light intensity based on at least one of the third light intensity and the fourth light intensity. The control unit controls at least one of the first light intensity and the second light intensity based on the adjusted at least one of the first and second control target values.

Abstract: Disclosed is a substrate processing system including a substrate processing apparatus; and a control device that controls the substrate processing apparatus. The substrate processing apparatus includes: a chamber; a placing table provided within the chamber; and heaters embedded in the placing table corresponding to division regions, respectively. The control device includes: a holding unit that holds a table for each of the division regions; a measuring unit that measures the resistance value of each of the heaters embedded in the placing table for each of the division regions; and a controller that estimates a temperature of each of the division regions corresponding to the resistance value of each of the heaters measured by the measuring unit with reference to the table for each of the division regions, and controls an electric power to be supplied to each of the heaters so that the estimated temperature becomes a target temperature.

Abstract: A temperature measurement device includes a light emitting part including a first light source configured to output measurement light with a first wavelength and a second light source configured to output reference light with a second wavelength, a light receiving part configured to receive reflected light of the measurement light and reflected light of the reference light that have passed through a temperature sensing device that changes light transmission characteristics with changes in temperature, a control part configured to measure a temperature detected by the temperature sensing device based on an amount of light of the received reflected light of the measurement light and an amount of light of the received reflected light of the reference light, and a temperature adjustment part configured to separately adjust the temperature of the first light source and the temperature of the second light source.

Abstract: A temperature sensor includes a sensing member, a retention member configured to secure the sensing member, an optical fiber configured to irradiate the sensing member with light and guide the light reflected from the sensing member, and a cylindrical sleeve configured to accommodate the optical fiber. The retention member is a plate-shaped component and has a cut-out portion formed on at least one of a peripheral portion of a non-retention surface of the retention member opposite to a retention surface to which the sensing member is secured and a side surface of the retention member. The retention member is secured to a tip of the sleeve so that the non-retention surface is exposed to the outside, and the tip of the sleeve is engaged with the cut-out portion.

Abstract: A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap between the semiconductor wafer and the mounting table; a measurement process of measuring a temperature variation of the mounting table due to heat exchange between the semiconductor wafer and the mounting table through the heat transfer gas; a calculation process of calculating a correction value based on the temperature variation of the mounting table; and a control process of starting the supply of the power and controlling the power such that the temperature of the mounting table reaches a target temperature corrected with the correction value.

Abstract: Provided is an optical temperature sensor including a temperature sensing element having light transmission characteristics that vary with temperature, a hollow holding member that holds the temperature sensing element, and an optical fiber that is arranged inside the holding member, the optical fiber including a tip face that is disposed to face the temperature sensing element at a position separated from the temperature sensing element by a predetermined distance. The temperature sensing element allows light emitted from the tip face of the optical fiber to be incident thereon, allows the incident light to be transmitted therethrough, and allows reflected light of the transmitted light that has been reflected by a measuring object to be transmitted therethrough.

Abstract: An optical temperature sensor includes an light-emitting-side measurement unit to measure a first light intensity of a measuring beam and a second light intensity of a reference beam, and a light-receiving-side measurement unit to measure a third light intensity of a first reflected beam of the measuring beam and a fourth light intensity of a second reflected beam of the reference beam. The optical temperature sensor further includes a control unit to adjust at least one of a first control target value of the first light intensity and a second control target value of the second light intensity based on at least one of the third light intensity and the fourth light intensity. The control unit controls at least one of the first light intensity and the second light intensity based on the adjusted at least one of the first and second control target values.