Patents by Inventor Takashi AKAGAWA
Takashi AKAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240337291Abstract: A sliding member comprises a metal substrate, a porous layer formed on one surface of the metal substrate, and a sliding layer covering the porous layer. The sliding layer is formed of a resin composition, and the porous layer has a matrix phase comprising Cu and Sn, and hard particles dispersed in the matrix phase and comprising a Laves phase constituted of a composition of Co, Mo and Si.Type: ApplicationFiled: November 21, 2022Publication date: October 10, 2024Inventors: Naoki SATO, Takumi YASHIRO, Takashi AKAGAWA, Yuji KAWAMATA, Ryoichi SUZUKI
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Publication number: 20240309913Abstract: A sliding member includes a metal substrate and a sliding layer formed on one surface of the metal substrate. The sliding layer has a matrix phase containing Cu and Sn and hard particles dispersed in the matrix phase and containing a Laves phase constituted of a composition of Co, Mo and Si.Type: ApplicationFiled: May 22, 2024Publication date: September 19, 2024Inventors: Naoki Sato, Toshio HAKUTO, Takashi AKAGAWA, Yuji KAWAMATA, Ryoichi SUZUKI, Takashi SAITO, Tadashi OSHIMA, Hajime KATO
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Patent number: 12031579Abstract: A sliding member includes a metal substrate and a sliding layer formed on one surface of the metal substrate. The sliding layer has a matrix phase containing Cu and Sn and hard particles dispersed in the matrix phase and containing a Laves phase constituted of a composition of Co, Mo and Si.Type: GrantFiled: November 1, 2021Date of Patent: July 9, 2024Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Naoki Sato, Toshio Hakuto, Takashi Akagawa, Yuji Kawamata, Ryoichi Suzuki, Takashi Saito, Tadashi Oshima, Hajime Kato
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Publication number: 20240044368Abstract: A sliding member includes a metal substrate and a sliding layer formed on one surface of the metal substrate. The sliding layer has a matrix phase containing Cu and Sn and hard particles dispersed in the matrix phase and containing a Laves phase constituted of a composition of Co, Mo and Si.Type: ApplicationFiled: November 1, 2021Publication date: February 8, 2024Inventors: Naoki SATO, Toshio HAKUTO, Takashi AKAGAWA, Yuji KAWAMATA, Ryoichi SUZUKI, Takashi SAITO, Tadashi OSHIMA, Hajime KATO
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Publication number: 20230364721Abstract: A brazing paste contain a brazing material in an amount of 80% by mass or more and 95% by mass or less; and a binder in an amount of 5% by mass or more and 20% by mass or less. The brazing material contains a flux in an amount of 2% by mass or more and 5% by mass or less. The binder contains a solid solvent containing two or more hydroxyl groups and having 8 to 10 carbon atoms, and a liquid solvent. When the binder does not contain a thixotropic agent, the liquid solvent is contained in an amount of 68% by mass or more with respect to a total of the binder, and when the binder contains a thixotropic agent, the thixotropic agent is contained in an amount of 11% by mass or less with respect to a total of the binder.Type: ApplicationFiled: April 24, 2023Publication date: November 16, 2023Inventors: Yoshie TACHIBANA, Hiroshi KAWANAGO, Takashi AKAGAWA, Satoshi MASUDA, Masaki SUGIYAMA, Yosuke KAZUMOTO, Hisaya SUGIMOTO, Hiroaki HATSUYAMA
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Publication number: 20230364720Abstract: A brazing paste contain 80% by mass or more and 95% by mass or less of a brazing material; and 5% by mass or more and 20% by mass or less of a binder. The binder contains a solid solvent containing two or more hydroxyl groups and having 5 to 7 carbon atoms, and a liquid solvent.Type: ApplicationFiled: May 3, 2023Publication date: November 16, 2023Applicants: SENJU METAL INDUSTRY CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yoshie TACHIBANA, Hiroshi KAWANAGO, Takashi AKAGAWA, Satoshi MASUDA, Masaki SUGIYAMA, Yosuke KAZUMOTO, Hisaya SUGIMOTO, Hiroaki HATSUYAMA
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Patent number: 11344976Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.Type: GrantFiled: November 21, 2018Date of Patent: May 31, 2022Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa, Hiroshi Takahashi, Hiroshi Kawanago, Satoshi Yokota, Osamu Munekata
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Publication number: 20200376607Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.Type: ApplicationFiled: November 21, 2018Publication date: December 3, 2020Applicant: SENJU METAL INDUSTRY CO., LTD.,Inventors: Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa, Hiroshi Takahashi, Hiroshi Kawanago, Satoshi Yokota, Osamu Munekata
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Patent number: 10658107Abstract: In a method of manufacturing a permanent magnet having a curved surface, a permeating material including metal particles and a flux is applied to the curved surface of a magnet. The magnet to which the permeating material is applied is then positioned within a furnace and the furnace is placed in a vacuum or filled with inert gas to volatilize a solvent and the like of the flux contained in the permeating material. The furnace is set to be a temperature within a range of 300 through 500 degrees C. to heat the permeating material. This enables the flux to be carbonized to form reticulated carbon. The furnace is then set to be a temperature within a range of 500 through 800 degrees C. to melt the metal particles in the permeating material, thereby permeating the melted metal particles into the magnet through the reticulated carbon uniformly.Type: GrantFiled: October 11, 2017Date of Patent: May 19, 2020Assignee: Senju Metal Industry Co., Ltd.Inventors: Daisuke Sakuma, Kazuaki Haga, Takaaki Takahashi, Minoru Ueshima, Takashi Akagawa, Yoshie Tachibana
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Patent number: 10443653Abstract: A sliding member having a supporting layer composed of an iron-based metallic material and a sliding layer formed on a surface of the supporting layer and composed of a copper-based metallic material. The surface of the supporting layer and the sliding layer have non-flat surfaces. A sliding surface having a non-flat surface is formed on the surface of the sliding layer. The sliding layer is formed on the roughened surface of the supporting layer by thermal spraying. The surface of the sliding layer is then subjected to a shot blasting treatment to form the sliding surface which has an uneven surface having an arithmetic average roughness (Ra) of more than 0 ?m and 2.0 ?m or less, a ten-point average roughness (Rz) of more than 0 ?m and 7.5 ?m or less and a surface hardness (Hv) of 150-250, and which slidably supports an object to be slid.Type: GrantFiled: September 25, 2014Date of Patent: October 15, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Satoshi Masuda, Takashi Akagawa, Naoki Sato, Ryoichi Kurata
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Patent number: 10036088Abstract: A sliding member which has joined strength that is suitable for the circumstance, to which heavy load is applied, and which is excellent in abrasion resistance property. The sliding member contains a supporting layer composed of ferrous metallic material, and a sliding layer composed of copper metallic material, which is formed on a surface of the supporting layer. The surface of the supporting layer and the sliding layer are configured not to be a plane and a sliding surface formed on a surface of the sliding layer is configured not to be a plane. The sliding layer is formed on the roughened surface of the supporting layer by thermal spraying.Type: GrantFiled: February 15, 2013Date of Patent: July 31, 2018Assignee: Senju Metal Industry Co., Ltd.Inventors: Satoshi Masuda, Takashi Akagawa, Naoki Sato, Ryoichi Kurata
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Publication number: 20180102214Abstract: In a method of manufacturing a permanent magnet having a curved surface, a permeating material including metal particles and a flux is applied to the curved surface of a magnet. The magnet to which the permeating material is applied is then positioned within a furnace and the furnace is placed in a vacuum or filled with inert gas to volatilize a solvent and the like of the flux contained in the permeating material. The furnace is set to be a temperature within a range of 300 through 500 degrees C. to heat the permeating material. This enables the flux to be carbonized to form reticulated carbon. The furnace is then set to be a temperature within a range of 500 through 800 degrees C. to melt the metal particles in the permeating material, thereby permeating the melted metal particles into the magnet through the reticulated carbon uniformly.Type: ApplicationFiled: October 11, 2017Publication date: April 12, 2018Inventors: Daisuke Sakuma, Kazuaki Haga, Takaaki Takahashi, Minoru Ueshima, Takashi Akagawa, Yoshie Tachibana
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Patent number: 9816160Abstract: To provide a Ni ball having a low ? dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an ? dose thereof is 0.0200 cph/cm2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.Type: GrantFiled: September 19, 2013Date of Patent: November 14, 2017Assignee: Senju Metal Industry Co., Ltd.Inventors: Ryoichi Kurata, Takashi Akagawa, Hiroyoshi Kawasaki
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Patent number: 9802251Abstract: Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Ni ball 20. The Ni ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20HV and equal to or less than 90HV.Type: GrantFiled: February 4, 2014Date of Patent: October 31, 2017Assignee: Senju Metal Industry Co., Ltd.Inventors: Hiroyoshi Kawasaki, Takashi Akagawa, Yuichi Koikeda, Atsushi Ikeda, Masaru Sasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
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Publication number: 20170080491Abstract: Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Ni ball 20. The Ni ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 90 HV.Type: ApplicationFiled: February 4, 2014Publication date: March 23, 2017Inventors: Hiroyoshi Kawasaki, Takashi Akagawa, Yuichi Koikeda, Atsushi Ikeda, Masaru Sasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
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Publication number: 20160304992Abstract: To provide a Ni ball having a low ? dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an ? dose thereof is 0.0200 cph/cm2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.Type: ApplicationFiled: September 19, 2013Publication date: October 20, 2016Applicant: Senju Metal Industry Co., Ltd.Inventors: Ryoichi KURATA, Takashi AKAGAWA, Hiroyoshi KAWASAKI
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Publication number: 20160215819Abstract: A sliding member having a supporting layer composed of an iron-based metallic material and a sliding layer formed on a surface of the supporting layer and composed of a copper-based metallic material. The surface of the supporting layer and the sliding layer have non-flat surfaces. A sliding surface having a non-flat surface is formed on the surface of the sliding layer. The sliding layer is formed on the roughened surface of the supporting layer by thermal spraying. The surface of the sliding layer is then subjected to a shot blasting treatment to form the sliding surface which has an uneven surface having an arithmetic average roughness (Ra) of more than 0 ?m and 2.0 ?m or less, a ten-point average roughness (Rz) of more than 0 ?m and 7.5 ?m or less and a surface hardness (Hv) of 150-250, and which slidably supports an object to be slid.Type: ApplicationFiled: September 25, 2014Publication date: July 28, 2016Inventors: Satoshi Masuda, Takashi Akagawa, Naoki Sato, Ryoichi Kurata
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Patent number: 9266196Abstract: Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm2, a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.Type: GrantFiled: February 3, 2015Date of Patent: February 23, 2016Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi Akagawa, Hiroyoshi Kawasaki, Kazuhiko Matsui, Yuichi Koikeda, Masaru Sasaki, Hiroyuki Yamasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
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Publication number: 20160010198Abstract: To provide a sliding member which has joined strength that is suitable for the circumstance, to which heavy load is applied, and which is excellent in abrasion resistance property. The sliding member 1 contains a supporting layer 2 composed of ferrous metallic material, and a sliding layer 3 composed of copper metallic material, which is formed on a surface 2a of the supporting layer 2. The surface 2a of the supporting layer 2 and the sliding layer 3 are configured to be not a plane and a sliding surface 3a formed on a surface of the sliding layer 3 is configured to be not a plane. The sliding layer is formed on the roughed surface 2a of the supporting layer 2 by thermal spaying.Type: ApplicationFiled: February 15, 2013Publication date: January 14, 2016Applicant: SENJU METAL LNDUSTRY CO., LTD.Inventors: Satoshi MASUDA, Takashi AKAGAWA, Naoki SATO, Ryoichi KURATA
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Publication number: 20150217409Abstract: Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm2, a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.Type: ApplicationFiled: February 3, 2015Publication date: August 6, 2015Applicant: Senju Metal lndustry Co., Ltd.Inventors: Takashi AKAGAWA, Hiroyoshi KAWASAKI, Kazuhiko MATSUI, Yuichi KOIKEDA, Masaru SASAKI, Hiroyuki YAMASAKI, Takahiro ROPPONGI, Daisuke SOMA, Isamu SATO