Patents by Inventor Takashi AKAGAWA

Takashi AKAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240044368
    Abstract: A sliding member includes a metal substrate and a sliding layer formed on one surface of the metal substrate. The sliding layer has a matrix phase containing Cu and Sn and hard particles dispersed in the matrix phase and containing a Laves phase constituted of a composition of Co, Mo and Si.
    Type: Application
    Filed: November 1, 2021
    Publication date: February 8, 2024
    Inventors: Naoki SATO, Toshio HAKUTO, Takashi AKAGAWA, Yuji KAWAMATA, Ryoichi SUZUKI, Takashi SAITO, Tadashi OSHIMA, Hajime KATO
  • Publication number: 20230364721
    Abstract: A brazing paste contain a brazing material in an amount of 80% by mass or more and 95% by mass or less; and a binder in an amount of 5% by mass or more and 20% by mass or less. The brazing material contains a flux in an amount of 2% by mass or more and 5% by mass or less. The binder contains a solid solvent containing two or more hydroxyl groups and having 8 to 10 carbon atoms, and a liquid solvent. When the binder does not contain a thixotropic agent, the liquid solvent is contained in an amount of 68% by mass or more with respect to a total of the binder, and when the binder contains a thixotropic agent, the thixotropic agent is contained in an amount of 11% by mass or less with respect to a total of the binder.
    Type: Application
    Filed: April 24, 2023
    Publication date: November 16, 2023
    Inventors: Yoshie TACHIBANA, Hiroshi KAWANAGO, Takashi AKAGAWA, Satoshi MASUDA, Masaki SUGIYAMA, Yosuke KAZUMOTO, Hisaya SUGIMOTO, Hiroaki HATSUYAMA
  • Publication number: 20230364720
    Abstract: A brazing paste contain 80% by mass or more and 95% by mass or less of a brazing material; and 5% by mass or more and 20% by mass or less of a binder. The binder contains a solid solvent containing two or more hydroxyl groups and having 5 to 7 carbon atoms, and a liquid solvent.
    Type: Application
    Filed: May 3, 2023
    Publication date: November 16, 2023
    Applicants: SENJU METAL INDUSTRY CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yoshie TACHIBANA, Hiroshi KAWANAGO, Takashi AKAGAWA, Satoshi MASUDA, Masaki SUGIYAMA, Yosuke KAZUMOTO, Hisaya SUGIMOTO, Hiroaki HATSUYAMA
  • Patent number: 11344976
    Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: May 31, 2022
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa, Hiroshi Takahashi, Hiroshi Kawanago, Satoshi Yokota, Osamu Munekata
  • Publication number: 20200376607
    Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.
    Type: Application
    Filed: November 21, 2018
    Publication date: December 3, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.,
    Inventors: Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa, Hiroshi Takahashi, Hiroshi Kawanago, Satoshi Yokota, Osamu Munekata
  • Patent number: 10658107
    Abstract: In a method of manufacturing a permanent magnet having a curved surface, a permeating material including metal particles and a flux is applied to the curved surface of a magnet. The magnet to which the permeating material is applied is then positioned within a furnace and the furnace is placed in a vacuum or filled with inert gas to volatilize a solvent and the like of the flux contained in the permeating material. The furnace is set to be a temperature within a range of 300 through 500 degrees C. to heat the permeating material. This enables the flux to be carbonized to form reticulated carbon. The furnace is then set to be a temperature within a range of 500 through 800 degrees C. to melt the metal particles in the permeating material, thereby permeating the melted metal particles into the magnet through the reticulated carbon uniformly.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: May 19, 2020
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Daisuke Sakuma, Kazuaki Haga, Takaaki Takahashi, Minoru Ueshima, Takashi Akagawa, Yoshie Tachibana
  • Patent number: 10443653
    Abstract: A sliding member having a supporting layer composed of an iron-based metallic material and a sliding layer formed on a surface of the supporting layer and composed of a copper-based metallic material. The surface of the supporting layer and the sliding layer have non-flat surfaces. A sliding surface having a non-flat surface is formed on the surface of the sliding layer. The sliding layer is formed on the roughened surface of the supporting layer by thermal spraying. The surface of the sliding layer is then subjected to a shot blasting treatment to form the sliding surface which has an uneven surface having an arithmetic average roughness (Ra) of more than 0 ?m and 2.0 ?m or less, a ten-point average roughness (Rz) of more than 0 ?m and 7.5 ?m or less and a surface hardness (Hv) of 150-250, and which slidably supports an object to be slid.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: October 15, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Satoshi Masuda, Takashi Akagawa, Naoki Sato, Ryoichi Kurata
  • Patent number: 10036088
    Abstract: A sliding member which has joined strength that is suitable for the circumstance, to which heavy load is applied, and which is excellent in abrasion resistance property. The sliding member contains a supporting layer composed of ferrous metallic material, and a sliding layer composed of copper metallic material, which is formed on a surface of the supporting layer. The surface of the supporting layer and the sliding layer are configured not to be a plane and a sliding surface formed on a surface of the sliding layer is configured not to be a plane. The sliding layer is formed on the roughened surface of the supporting layer by thermal spraying.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: July 31, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Satoshi Masuda, Takashi Akagawa, Naoki Sato, Ryoichi Kurata
  • Publication number: 20180102214
    Abstract: In a method of manufacturing a permanent magnet having a curved surface, a permeating material including metal particles and a flux is applied to the curved surface of a magnet. The magnet to which the permeating material is applied is then positioned within a furnace and the furnace is placed in a vacuum or filled with inert gas to volatilize a solvent and the like of the flux contained in the permeating material. The furnace is set to be a temperature within a range of 300 through 500 degrees C. to heat the permeating material. This enables the flux to be carbonized to form reticulated carbon. The furnace is then set to be a temperature within a range of 500 through 800 degrees C. to melt the metal particles in the permeating material, thereby permeating the melted metal particles into the magnet through the reticulated carbon uniformly.
    Type: Application
    Filed: October 11, 2017
    Publication date: April 12, 2018
    Inventors: Daisuke Sakuma, Kazuaki Haga, Takaaki Takahashi, Minoru Ueshima, Takashi Akagawa, Yoshie Tachibana
  • Patent number: 9816160
    Abstract: To provide a Ni ball having a low ? dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an ? dose thereof is 0.0200 cph/cm2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: November 14, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Ryoichi Kurata, Takashi Akagawa, Hiroyoshi Kawasaki
  • Patent number: 9802251
    Abstract: Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Ni ball 20. The Ni ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20HV and equal to or less than 90HV.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: October 31, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyoshi Kawasaki, Takashi Akagawa, Yuichi Koikeda, Atsushi Ikeda, Masaru Sasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Publication number: 20170080491
    Abstract: Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Ni ball 20. The Ni ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 90 HV.
    Type: Application
    Filed: February 4, 2014
    Publication date: March 23, 2017
    Inventors: Hiroyoshi Kawasaki, Takashi Akagawa, Yuichi Koikeda, Atsushi Ikeda, Masaru Sasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Publication number: 20160304992
    Abstract: To provide a Ni ball having a low ? dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an ? dose thereof is 0.0200 cph/cm2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.
    Type: Application
    Filed: September 19, 2013
    Publication date: October 20, 2016
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Ryoichi KURATA, Takashi AKAGAWA, Hiroyoshi KAWASAKI
  • Publication number: 20160215819
    Abstract: A sliding member having a supporting layer composed of an iron-based metallic material and a sliding layer formed on a surface of the supporting layer and composed of a copper-based metallic material. The surface of the supporting layer and the sliding layer have non-flat surfaces. A sliding surface having a non-flat surface is formed on the surface of the sliding layer. The sliding layer is formed on the roughened surface of the supporting layer by thermal spraying. The surface of the sliding layer is then subjected to a shot blasting treatment to form the sliding surface which has an uneven surface having an arithmetic average roughness (Ra) of more than 0 ?m and 2.0 ?m or less, a ten-point average roughness (Rz) of more than 0 ?m and 7.5 ?m or less and a surface hardness (Hv) of 150-250, and which slidably supports an object to be slid.
    Type: Application
    Filed: September 25, 2014
    Publication date: July 28, 2016
    Inventors: Satoshi Masuda, Takashi Akagawa, Naoki Sato, Ryoichi Kurata
  • Patent number: 9266196
    Abstract: Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm2, a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: February 23, 2016
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takashi Akagawa, Hiroyoshi Kawasaki, Kazuhiko Matsui, Yuichi Koikeda, Masaru Sasaki, Hiroyuki Yamasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Publication number: 20160010198
    Abstract: To provide a sliding member which has joined strength that is suitable for the circumstance, to which heavy load is applied, and which is excellent in abrasion resistance property. The sliding member 1 contains a supporting layer 2 composed of ferrous metallic material, and a sliding layer 3 composed of copper metallic material, which is formed on a surface 2a of the supporting layer 2. The surface 2a of the supporting layer 2 and the sliding layer 3 are configured to be not a plane and a sliding surface 3a formed on a surface of the sliding layer 3 is configured to be not a plane. The sliding layer is formed on the roughed surface 2a of the supporting layer 2 by thermal spaying.
    Type: Application
    Filed: February 15, 2013
    Publication date: January 14, 2016
    Applicant: SENJU METAL LNDUSTRY CO., LTD.
    Inventors: Satoshi MASUDA, Takashi AKAGAWA, Naoki SATO, Ryoichi KURATA
  • Publication number: 20150217409
    Abstract: Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm2, a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.
    Type: Application
    Filed: February 3, 2015
    Publication date: August 6, 2015
    Applicant: Senju Metal lndustry Co., Ltd.
    Inventors: Takashi AKAGAWA, Hiroyoshi KAWASAKI, Kazuhiko MATSUI, Yuichi KOIKEDA, Masaru SASAKI, Hiroyuki YAMASAKI, Takahiro ROPPONGI, Daisuke SOMA, Isamu SATO