Abstract: A novel blood collection instrument with which it is possible to prevent blood from coming into contact with air during collection of blood, and a blood collection plate that is suitably used therefor. A blood collection instrument including: a blood holding member having a structure in which a plurality of plate-shaped members, are overlapped with each other and including a collected blood holding passage formed between overlapped surfaces of the plate-shaped members; a connection part provided at an inflow port of the collected blood holding passage in the blood holding member; and a puncture member including a puncturing hollow needle while being connected to the connection part. An inner hole of the hollow needle of the puncture member is allowed to communicate with the collected blood holding passage in the blood holding member.

Abstract: A protector-attached puncture needle 10 in which a protector 14 is tiltably supported by a needle hub 18 of a puncture needle 12, and the protector 14 includes an accommodating groove 40 which opens toward the puncture needle 12 in a tilting direction and accommodates the puncture needle 12. Inner surfaces of both side walls 44, 44 of the accommodating groove 12 of the protector 14 include respective reinforcing ribs 52, 52 extending from a groove bottom portion toward a groove opening side. The reinforcing rib 52, 52 include respective recesses 54, 54 each opening to the inner surface of each of the side walls 44, 44. Diametrically both sides of an outer peripheral portion of a cap 30 enter and are locked in the respective recesses 54, 54 of the reinforcing ribs 52, 52 such that a tilt position of the protector 14 in an unused state before removal of the cap 30 is held.

Abstract: Cells with the same logic and similar driving capability among cells arranged on a substrate of a semiconductor integrated circuit are made into a format comprising terminals at the same position in the same-sized cell frame, and within cells in such a format, by arranging other cells in a redundant region of cell frame in a cell with low driving capability, wiring modification operation is reduced in layout of a semiconductor integrated circuit and efficiency of circuit design is improved, preventing chip size from being redundantly large.

Abstract: A shield wiring is provided on a boundary of a target region to be shielded of macros, an inner side of the boundary, an outer side of the boundary, or an inner side and an outer side of the boundary, each being as a black box, so as to surround the target region. This shield wiring is electrically connected to a power supply terminal or a power supply wiring of the macros or the like, or to a power supply wiring on another wiring layer through a contact section, thereby fixing a potential of the shield wiring. An accurate delay value is then obtained by estimating an influence of crosstalk between a wiring in a region where the physical wiring pattern is clear and the shield wiring and also estimating a capacitance produced between the wirings.

Abstract: Cells with the same logic and similar driving capability among cells arranged on a substrate of a semiconductor integrated circuit are made into a format comprising terminals at the same position in the same-sized cell frame, and within cells in such a format, by arranging other cells in a redundant region of cell frame in a cell with low driving capability, wiring modification operation is reduced in layout of a semiconductor integrated circuit and efficiency of circuit design is improved, preventing chip size from being redundantly large.

Abstract: A shield wiring is provided on a boundary of a target region to be shielded of macros, an inner side of the boundary, an outer side of the boundary, or an inner side and an outer side of the boundary, each being as a black box, so as to surround the target region. This shield wiring is electrically connected to a power supply terminal or a power supply wiring of the macros or the like, or to a power supply wiring on another wiring layer through a contact section, thereby fixing a potential of the shield wiring. An accurate delay value is then obtained by estimating an influence of crosstalk between a wiring in a region where the physical wiring pattern is clear and the shield wiring and also estimating a capacitance produced between the wirings.