Abstract: This invention is intended to identify a gene cluster involved in biosynthesis of a cyclic peptide compound produced by a filamentous fungus of the Curvularia species and to establish a system for synthesizing such cyclic peptide compound. The gene is composed of a first module to a tenth module and encodes a protein having activity of synthesizing a nonribosomal peptide constituting a basic peptide backbone of a cyclic peptide compound produced by a filamentous fungus of the Curvularia species.

Abstract: An object of the present invention is to identify an enzyme having activity of synthesizing dihydrotentoxin that is a tentoxin precursor and an enzyme having activity of synthesizing tentoxin using dihydrotentoxin as a substrate. The present invention concerns a tentoxin synthesis-related gene encoding a protein comprising the amino acid sequence of SEQ ID NO: 16 and having activity of nonribosomal peptide synthesis of dihydrotentoxin and a tentoxin synthesis-related gene encoding a protein comprising the amino acid sequence of SEQ ID NO: 18 and having activity of converting dihydrotentoxin to tentoxin.

Abstract: A fiber-reinforced resin substrate is described in which a plurality of resins having differing properties are strongly composited, wherein the fiber-reinforced resin substrate is obtained by impregnating a thermoplastic resin (A) and a thermoplastic resin (B) into continuous reinforcement fibers, wherein a thermoplastic resin (A) layer, which comprises the thermoplastic resin (A) and is exposed at one surface, and a thermoplastic resin (B) layer, which comprises the thermoplastic resin (B) and is exposed at the other surface, form a boundary region, where at least some of the continuous reinforcement fibers exist in a manner spanning across the boundary region and both the thermoplastic resin (A) and the thermoplastic resin (B) are crystalline resins having a melting point of not less than 200° C.

Abstract: The present invention aims to provide an electronic device housing that is able to maintain the antenna performance without deteriorating the radio communication performance, excellent in terms of the degree of warpage and dimensional accuracy, and mass productivity. The electronic device housing includes a fiber reinforcing member (a) and a fiber reinforcing member (b), wherein the fiber reinforcing member (a) contains a resin (a1) and a fiber (a2), the fiber (a2) being in the form of discontinuous fibers; the fiber reinforcing member (b) contains a resin (b1) and a fiber (b2), the fiber (b2) being in the form of continuous fibers; the projected area of the fiber reinforcing member (a) accounts for 60% or more of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face; and requirements (i) and/or (ii) given below are met: (i) the resin (a1) is a thermoplastic resin having a melting point of more than 265° C.

Abstract: The invention aims to provide an electronic device housing that can maintain the antenna performance without deteriorating the radio communication performance, ensures uniform characteristics as one molded electronic device housing in spite of consisting of a plurality of members, and show excellent features in terms of the degree of warpage and dimensional accuracy as well as small deformation in high temperature environments and high mass productivity.

Abstract: A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.

Abstract: A fiber-reinforced plastic substrate is described in which a plurality of resins having different properties are firmly compounded and that includes components [A], [B], and [C]: [A] reinforcing fibers; [B] thermoplastic resin (b); and [C] thermoplastic resin (c), wherein the component [A] is arranged in one direction, in the fiber-reinforced plastic substrate, a resin area including the component [B] and a resin area including the component [C] are present, the resin area including the component [B] is present on a surface of one side of the fiber-reinforced plastic substrate, and a distance Ra(bc) between Hansen solubility parameters of the component [B] and the component [C] satisfies formula (1): Ra(bc)={4(?DB??DC)2+(?PB??PC)2+(?HB??HC)2}1/2?8 wherein Ra(bc), ?DB, ?DC, ?PB, ?PC, ?HB and ?HC are as defined.

Abstract: Provided is a structure having excellent flexibility represented by elastic restoring from compression or tensile elongation at break, and excellent lightness. A structure according to the present invention includes reinforced fibers, first plastic, and second plastic that exhibits rubber elasticity at room temperature, the reinforced fibers being discontinuous fibers, and the first plastic and/or the second plastic coating a crossing point between the reinforced fibers in contact with each other.

Abstract: In order to provide a layered article in which shape deformation is suppressed while exhibiting compression properties that are an index of impact absorption, and further, a layered article that can control feeling when receiving impact on demand, provided is a layered article including a porous structure material containing discontinuous reinforcing fibers (A), resin (B) and voids (C), and a skin layer formed on a surface of the porous structure material, in which the porous structure material has an elastic resilience from 50% compression of 1 MPa or more, and the layered article has a plastic deformation amount of 20 ?m or less in a falling-weight impact test performed on the surface on which the skin layer is formed.

Abstract: A method for manufacturing a composite structure in which a first member and a structure material as a second member are integrated, the method including: an arrangement step of arranging a structure precursor including a resin and reinforced fibers in a mold made of the first member; a heating step of heating the structure precursor to equal to or higher than a temperature at which a storage elastic modulus (G?) of the structure precursor is less than 1.2×108 Pa; a shaping step of expanding the structure precursor by heating to form a structure material as a second member, and bringing the structure material into close contact with the first member to obtain a composite structure; and a cooling step of cooling the composite structure.

Abstract: Provided is a mountain-shaped structure material being excellent in stiffness and lightness. The present invention is a structure material including a resin, reinforced fibers and voids. The structure material has a specific bending stiffness represented as Ec1/3·??1 being 2.5 or more where a bending modulus is Ec and a density is ?. The structure material has a mountain shape.

Abstract: An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.

Abstract: A molded article includes a continuous porous body provided with a thin film layer, the continuous porous body having a void that is continuous in a thickness direction of the continuous porous body, the thin film layer including a solid additive and a resin. A permeation rate of water from a surface of the molded article on a side of the thin film layer is 10% or less.

Abstract: Provided is a method for producing a molded article having a thin film layer (B) formed on a surface of a porous body (A). The method includes a process (I) and a process (II) described below in this order: process (I): forming the thin film layer (B) on a surface of a precursor (a) of the porous body (A) to obtain a preform, and process (II): expanding and molding the precursor (a) to the porous body (A).

Abstract: Provided is a method for producing a molded article obtained by integrating a decoration layer onto a surface of a porous body including a reinforcing fiber. The method includes: a preheating process at which the decoration layer is preheated; and a shaping and integrating process at which the porous body is pressed to the decoration layer or the decoration layer is pressed to the porous body to shape the decoration layer, and the porous body and the decoration layer are integrated to each other.

Abstract: A method for manufacturing a structure material is a method for manufacturing a structure material that includes a thermoplastic resin, reinforced fibers, and voids. The method includes: a first process for arranging a structure precursor comprising the thermoplastic resin and the reinforced fibers in a mold with a surface temperature of 80° C. or less; a second process for raising the surface temperature of the mold up to a temperature at which a storage elastic modulus (G?) of the structure precursor is less than 1.2×108 Pa; a third process for lowering the surface temperature of the mold down to a temperature at which the storage elastic modulus (G?) of the structure precursor is 1.2×108 Pa or more; and a fourth process for removing a structure material obtained after end of the third process from the mold.

Abstract: A resin supply material is used for molding a fiber-reinforced resin and includes a continuous porous material and a resin. The continuous porous material has a bending resistance Grt of 10 mN·cm or more at 23° C., and a bending resistance ratio Gr of 0.7 or less, the bending resistance ratio Gr being expressed by the formula: Gr=Gmt/Grt Gmt: bending resistance of continuous porous material at 70° C.

Abstract: A laminate includes reinforcing fibers, thermosetting resin (B) or thermoplastic resin (D), wherein adhesion with other members, particularly in high-temperature atmospheres, is outstanding. The laminate includes: a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermoplastic resin (D); wherein the porous substrate (C) has a gap part continuous in the thickness direction of the laminate, and the melting point or softening point is higher than 180° C., and at least 10% of the surface area of one surface of the porous substrate (C) is exposed on one side of the laminate.

Abstract: A method for manufacturing a composite structure in which a first member and a structure material as a second member are integrated, the method including: an arrangement step of arranging a structure precursor including a resin and reinforced fibers in a mold made of the first member; a heating step of heating the structure precursor to equal to or higher than a temperature at which a storage elastic modulus (G?) of the structure precursor is less than 1.2×108 Pa; a shaping step of expanding the structure precursor by heating to form a structure material as a second member, and bringing the structure material into close contact with the first member to obtain a composite structure; and a cooling step of cooling the composite structure.

Abstract: Provided is a structure having excellent flexibility represented by elastic restoring from compression or tensile elongation at break, and excellent lightness. A structure according to the present invention includes reinforced fibers, first plastic, and second plastic that exhibits rubber elasticity at room temperature, the reinforced fibers being discontinuous fibers, and the first plastic and/or the second plastic coating a crossing point between the reinforced fibers in contact with each other.