Patents by Inventor Takashi Fujioka

Takashi Fujioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240286539
    Abstract: In a seat drive device that is built in a seat including a central portion and a side support located outside the central portion in a width direction, and drives the side support, the seat drive device includes a base fixed to the seat, a paddle that is rotatably supported with respect to the base and rotates in a unfolding direction to displace the side support toward a seating region of a user, and an air bag that is disposed between the base and the paddle and rotates the paddle in the unfolding direction by expansion accompanying air supply, wherein the paddle includes a pressing portion that presses the side support from inside, and an arm that is rotatably supported with respect to the base and extends toward the pressing portion, wherein a rotation axis of the paddle is located at the central portion of the seat, and wherein the arm is curved toward a retraction direction that is a direction opposite to the unfolding direction.
    Type: Application
    Filed: February 13, 2024
    Publication date: August 29, 2024
    Applicant: AISIN CORPORATION
    Inventors: Takashi OGISO, Hidehiko FUJIOKA, Guyue SUN
  • Publication number: 20240271689
    Abstract: A gear includes an annular sleeve and a tooth portion provided by injection molding to cover a part of the sleeve. The sleeve is a stacked body including a plurality of annular steel plates stacked in an axial direction of the sleeve.
    Type: Application
    Filed: March 10, 2022
    Publication date: August 15, 2024
    Applicants: JTEKT CORPORATION, JTEKT COLUMN SYSTEMS CORPORATION
    Inventors: Naofumi KAWAMURA, Hiroaki SUZUKI, Tetsuya EBISU, Yuki FUJIOKA, Tomonori SUGIURA, Kosuke ITO, Yasuhiro TANIOKA, Masayoshi SAKUDA, Takahiro BAITO, Takao NAKAAKI, Yoshiaki MURAKAMI, Takashi YAMAGUCHI, Kazuhisa ASAKAWA
  • Patent number: 11993687
    Abstract: Provided is a method for producing a molded article having a thin film layer (B) formed on a surface of a porous body (A). The method includes a process (I) and a process (II) described below in this order: process (I): forming the thin film layer (B) on a surface of a precursor (a) of the porous body (A) to obtain a preform, and process (II): expanding and molding the precursor (a) to the porous body (A).
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: May 28, 2024
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takashi Fujioka, Kotaro Shinohara, Masato Honma
  • Publication number: 20240170000
    Abstract: To satisfactorily perform processing of increasing the sound quality of a recorded sound source obtained by picking up vocal sound and musical instrument sound in a room. An output audio signal is obtained by a sound converter performing sound conversion processing on a recorded sound source (an input audio signal) obtained by picking up vocal sound or musical instrument sound by using any microphone in any room. The sound conversion processing includes processing of removing room reverberation from the recorded sound source, processing of remove picked-up sound noise from the recorded sound source, processing of including target microphone characteristics into the recorded sound source, and processing of including the target studio characteristics into the recorded sound source.
    Type: Application
    Filed: January 19, 2022
    Publication date: May 23, 2024
    Inventors: TAKASHI FUJIOKA, TAKESHI MATSUI, TOMOHARU KASAHARA, KEIICHI OSAKO, TAKAO FUKUI
  • Publication number: 20230405967
    Abstract: A fiber-reinforced resin substrate is described in which a plurality of resins having differing properties are strongly composited, wherein the fiber-reinforced resin substrate is obtained by impregnating a thermoplastic resin (A) and a thermoplastic resin (B) into continuous reinforcement fibers, wherein a thermoplastic resin (A) layer, which comprises the thermoplastic resin (A) and is exposed at one surface, and a thermoplastic resin (B) layer, which comprises the thermoplastic resin (B) and is exposed at the other surface, form a boundary region, where at least some of the continuous reinforcement fibers exist in a manner spanning across the boundary region and both the thermoplastic resin (A) and the thermoplastic resin (B) are crystalline resins having a melting point of not less than 200° C.
    Type: Application
    Filed: November 15, 2021
    Publication date: December 21, 2023
    Applicant: Toray Industries, Inc.
    Inventors: Takashi Fujioka, Masato Honma, Yoshifumi Nakayama
  • Patent number: 11800656
    Abstract: The invention aims to provide an electronic device housing that can maintain the antenna performance without deteriorating the radio communication performance, ensures uniform characteristics as one molded electronic device housing in spite of consisting of a plurality of members, and show excellent features in terms of the degree of warpage and dimensional accuracy as well as small deformation in high temperature environments and high mass productivity.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: October 24, 2023
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Mitsushige Hamaguchi, Takashi Fujioka, Masato Honma
  • Patent number: 11799199
    Abstract: The present invention aims to provide an electronic device housing that is able to maintain the antenna performance without deteriorating the radio communication performance, excellent in terms of the degree of warpage and dimensional accuracy, and mass productivity. The electronic device housing includes a fiber reinforcing member (a) and a fiber reinforcing member (b), wherein the fiber reinforcing member (a) contains a resin (a1) and a fiber (a2), the fiber (a2) being in the form of discontinuous fibers; the fiber reinforcing member (b) contains a resin (b1) and a fiber (b2), the fiber (b2) being in the form of continuous fibers; the projected area of the fiber reinforcing member (a) accounts for 60% or more of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face; and requirements (i) and/or (ii) given below are met: (i) the resin (a1) is a thermoplastic resin having a melting point of more than 265° C.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: October 24, 2023
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Mitsushige Hamaguchi, Takashi Fujioka, Masato Honma
  • Patent number: 11589472
    Abstract: A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: February 21, 2023
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takashi Fujioka, Masato Honma
  • Publication number: 20220212426
    Abstract: A fiber-reinforced plastic substrate is described in which a plurality of resins having different properties are firmly compounded and that includes components [A], [B], and [C]: [A] reinforcing fibers; [B] thermoplastic resin (b); and [C] thermoplastic resin (c), wherein the component [A] is arranged in one direction, in the fiber-reinforced plastic substrate, a resin area including the component [B] and a resin area including the component [C] are present, the resin area including the component [B] is present on a surface of one side of the fiber-reinforced plastic substrate, and a distance Ra(bc) between Hansen solubility parameters of the component [B] and the component [C] satisfies formula (1): Ra(bc)={4(?DB??DC)2+(?PB??PC)2+(?HB??HC)2}1/2?8 wherein Ra(bc), ?DB, ?DC, ?PB, ?PC, ?HB and ?HC are as defined.
    Type: Application
    Filed: May 15, 2020
    Publication date: July 7, 2022
    Applicant: Toray Industries, Inc.
    Inventors: Takashi Fujioka, Naokichi Imai, Masato Honma, Yoshiki Takebe, Kotaro Shinohara
  • Patent number: 11312825
    Abstract: Provided is a structure having excellent flexibility represented by elastic restoring from compression or tensile elongation at break, and excellent lightness. A structure according to the present invention includes reinforced fibers, first plastic, and second plastic that exhibits rubber elasticity at room temperature, the reinforced fibers being discontinuous fibers, and the first plastic and/or the second plastic coating a crossing point between the reinforced fibers in contact with each other.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: April 26, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yoshiki Takebe, Takashi Fujioka, Masato Honma
  • Publication number: 20210244118
    Abstract: In order to provide a layered article in which shape deformation is suppressed while exhibiting compression properties that are an index of impact absorption, and further, a layered article that can control feeling when receiving impact on demand, provided is a layered article including a porous structure material containing discontinuous reinforcing fibers (A), resin (B) and voids (C), and a skin layer formed on a surface of the porous structure material, in which the porous structure material has an elastic resilience from 50% compression of 1 MPa or more, and the layered article has a plastic deformation amount of 20 ?m or less in a falling-weight impact test performed on the surface on which the skin layer is formed.
    Type: Application
    Filed: June 4, 2019
    Publication date: August 12, 2021
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Takashi FUJIOKA, Kentaro ADACHI, Masato HONMA
  • Patent number: 11072098
    Abstract: A method for manufacturing a composite structure in which a first member and a structure material as a second member are integrated, the method including: an arrangement step of arranging a structure precursor including a resin and reinforced fibers in a mold made of the first member; a heating step of heating the structure precursor to equal to or higher than a temperature at which a storage elastic modulus (G?) of the structure precursor is less than 1.2×108 Pa; a shaping step of expanding the structure precursor by heating to form a structure material as a second member, and bringing the structure material into close contact with the first member to obtain a composite structure; and a cooling step of cooling the composite structure.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: July 27, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takashi Fujioka, Yoshiki Takebe, Masato Honma
  • Patent number: 10947352
    Abstract: Provided is a mountain-shaped structure material being excellent in stiffness and lightness. The present invention is a structure material including a resin, reinforced fibers and voids. The structure material has a specific bending stiffness represented as Ec1/3·??1 being 2.5 or more where a bending modulus is Ec and a density is ?. The structure material has a mountain shape.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: March 16, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takashi Fujioka, Yoshiki Takebe, Masato Honma
  • Patent number: 10908651
    Abstract: An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: February 2, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Masato Honma, Yoshiki Takebe, Naokichi Imai, Takashi Fujioka
  • Publication number: 20210016549
    Abstract: A molded article includes a continuous porous body provided with a thin film layer, the continuous porous body having a void that is continuous in a thickness direction of the continuous porous body, the thin film layer including a solid additive and a resin. A permeation rate of water from a surface of the molded article on a side of the thin film layer is 10% or less.
    Type: Application
    Filed: March 28, 2019
    Publication date: January 21, 2021
    Applicant: Toray Industries, Inc.
    Inventors: Takashi Fujioka, Kotaro Shinohara, Masato Honma
  • Publication number: 20210009783
    Abstract: Provided is a method for producing a molded article having a thin film layer (B) formed on a surface of a porous body (A). The method includes a process (I) and a process (II) described below in this order: process (I): forming the thin film layer (B) on a surface of a precursor (a) of the porous body (A) to obtain a preform, and process (II): expanding and molding the precursor (a) to the porous body (A).
    Type: Application
    Filed: March 28, 2019
    Publication date: January 14, 2021
    Applicant: Toray Industries, Inc.
    Inventors: Takashi Fujioka, Kotaro Shinohara, Masato Honma
  • Publication number: 20210001536
    Abstract: Provided is a method for producing a molded article obtained by integrating a decoration layer onto a surface of a porous body including a reinforcing fiber. The method includes: a preheating process at which the decoration layer is preheated; and a shaping and integrating process at which the porous body is pressed to the decoration layer or the decoration layer is pressed to the porous body to shape the decoration layer, and the porous body and the decoration layer are integrated to each other.
    Type: Application
    Filed: March 28, 2019
    Publication date: January 7, 2021
    Applicant: Toray Industries, Inc.
    Inventors: Takashi Fujioka, Kotaro Shinohara, Masato Honma
  • Patent number: 10882224
    Abstract: A method for manufacturing a structure material is a method for manufacturing a structure material that includes a thermoplastic resin, reinforced fibers, and voids. The method includes: a first process for arranging a structure precursor comprising the thermoplastic resin and the reinforced fibers in a mold with a surface temperature of 80° C. or less; a second process for raising the surface temperature of the mold up to a temperature at which a storage elastic modulus (G?) of the structure precursor is less than 1.2×108 Pa; a third process for lowering the surface temperature of the mold down to a temperature at which the storage elastic modulus (G?) of the structure precursor is 1.2×108 Pa or more; and a fourth process for removing a structure material obtained after end of the third process from the mold.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: January 5, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takashi Fujioka, Yoshiki Takebe, Masato Honma
  • Patent number: 10822463
    Abstract: A resin supply material is used for molding a fiber-reinforced resin and includes a continuous porous material and a resin. The continuous porous material has a bending resistance Grt of 10 mN·cm or more at 23° C., and a bending resistance ratio Gr of 0.7 or less, the bending resistance ratio Gr being expressed by the formula: Gr=Gmt/Grt Gmt: bending resistance of continuous porous material at 70° C.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: November 3, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Tomohiro Takehara, Satoshi Seike, Masato Honma, Takashi Fujioka, Satomi Hiasa
  • Patent number: 10751957
    Abstract: A laminate includes reinforcing fibers, thermosetting resin (B) or thermoplastic resin (D), wherein adhesion with other members, particularly in high-temperature atmospheres, is outstanding. The laminate includes: a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermoplastic resin (D); wherein the porous substrate (C) has a gap part continuous in the thickness direction of the laminate, and the melting point or softening point is higher than 180° C., and at least 10% of the surface area of one surface of the porous substrate (C) is exposed on one side of the laminate.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: August 25, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Takashi Fujioka, Masato Honma