Abstract: A solid electrolytic capacitor using a conductive polymeric compound as a solid electrolyte is disclosed, wherein a powder is dispersed in the conductive polymer to provide unevenness on the surface of the solid electrolyte, thereby increasing the surface area, whereby a mechanical adhesion between the solid electrolyte and a cathode conductor layer is increased. The conductive polymer comprises a first conductive polymer layer which contacts a dielectric layer at an anode body side, and a second conductive polymer layer which contacts the cathode conductor layer side, and the powder is dispersed in the second conductive polymer layer. By this constitution, tan .delta. and an equivalent series resistance (ESR) of the solid electrolytic capacitor are decreased.

Abstract: A solid electrolytic capacitor includes an anode, a dielectric layer, two conductive polymer compound layers, and a cathode electrode. The anode consists of a valve metal and has a lead extending therefrom. The dielectric layer is formed by oxidizing a surface of the anode. The two conductive polymer compound layers are formed on the dielectric layer and respectively consist of solid electrolytes, at least one of the two conductive polymer compound layers consisting of a conductive polymer compound chemically oxidized and polymerized using an oxidant. The cathode electrode is formed on the two conductive polymer compound layers. A method of manufacturing this capacitor is also disclosed.

Abstract: A solid-state electrolytic capacitor reduces the possibility of failure due to increasing of a leakage current during application of voltage for a long period and thus improves reliability. The solid-state electrolytic capacitor has a conductive high polymeric compound deposited on a dielectric oxidation layer covering the surface of pore in a tantalum plate while maintaining voids. The void surface acts as an oxygen supply source.

Abstract: The invention provides a method of manufacturing a solid electrolytic capacitor, including the steps of forming an oxide film serving as dielectric substance around a porous compact composed of valve action metal having an anode lead projecting therefrom, forming a resist layer around the anode lead and on a portion of the porous compact disposed in the vicinity of the anode lead, forming a conducting polymer compound layer on both the resist layer and the oxide film, and removing concurrently the resist layer and a part of the conducting polymer compound layer disposed on the resist layer. For instance, when the resist layer is composed of glass, the resist layer is removed by applying mechanical impact thereto.

Abstract: A solid electrolytic capacitor includes an anode, a dielectric layer, a solid electrolyte layer, and a cathode electrode. The solid electrolyte layer consists of a conductive polymer compound obtained by doping a dopant in one of a copolymer and a mixture of polypyrrole or a derivative thereof, the polypyrrole having a repetition unit represented by a formula ##STR1## wherein each of R.sub.1 to R.sub.3 represents an alkyl group or a hydrogen atom, and polyaniline or a derivative thereof, the polyaniline having a repetition unit represented by a formula ##STR2## wherein each of R.sub.4 to R.sub.7 represents an alkyl group or a hydrogen atom.

Abstract: A stacked type solid electrolytic capacitor has a plurality of single plate capacitors each constituted by a dielectric oxide film, a solid electrolytic film and a negative electrode layer sequentially laminated on a surface of a positive electrode member having a positive electrode section. A metal spacer which has a thickness corresponding to each of spaces between the positive electrode sections is placed in each of the spaces. The metal spacers and the positive electrode sections are mechanically and electrically interconnected by welding. The invention may be embodied in a stacked electrolytic capacitor of a lead type or that of a chip type. The invention provides capacitor in which the size is reduced and the capacity is increased, the possibility of deterioration in electrical characteristics during the fabrication process is eliminated, and the process of fabrication is made easy.