Patents by Inventor Takashi FUKUMA

Takashi FUKUMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11557435
    Abstract: In a multilayer ceramic electronic component, a stacked body includes a first outer layer and a first outermost internal electrode layer. The first outer layer defines a first main surface. The first outermost internal electrode layer is adjacent to the first outer layer. The first outermost internal electrode layer is in contact with a first external electrode at a first end surface. The thickness of the first outer layer at the first end surface is greater than the thickness of the first outer layer at the center or approximate center in a length direction.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: January 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takashi Fukuma, Koji Moriyama
  • Publication number: 20210020378
    Abstract: In a multilayer ceramic electronic component, a stacked body includes a first outer layer and a first outermost internal electrode layer. The first outer layer defines a first main surface. The first outermost internal electrode layer is adjacent to the first outer layer. The first outermost internal electrode layer is in contact with a first external electrode at a first end surface. The thickness of the first outer layer at the first end surface is greater than the thickness of the first outer layer at the center or approximate center in a length direction.
    Type: Application
    Filed: July 13, 2020
    Publication date: January 21, 2021
    Inventors: Takashi FUKUMA, Koji MORIYAMA
  • Patent number: 10529488
    Abstract: An electronic component includes a multilayer capacitor and an interposer including a substrate main body with an electric insulation property, the multilayer capacitor being mounted on one main surface side of the substrate main body. The multilayer capacitor includes a multilayer body, a first outer electrode, and a second outer electrode. The multilayer body includes an effective region and a non-effective region surrounding the effective region. A width of the effective region is larger than a width of the substrate main body, when a width of the multilayer body is represented by W11, a thickness of the multilayer body is represented by T11, and a thickness of the substrate main body is represented by T21, a value of W11/(T11+T21) is not less than about 0.90 and not more than about 1.10.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: January 7, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yukihiro Fujita, Takashi Fukuma
  • Publication number: 20180158608
    Abstract: An electronic component includes a multilayer capacitor and an interposer including a substrate main body with an electric insulation property, the multilayer capacitor being mounted on one main surface side of the substrate main body. The multilayer capacitor includes a multilayer body, a first outer electrode, and a second outer electrode. The multilayer body includes an effective region and a non-effective region surrounding the effective region. A width of the effective region is larger than a width of the substrate main body, when a width of the multilayer body is represented by W11, a thickness of the multilayer body is represented by T11, and a thickness of the substrate main body is represented by T21, a value of W11/(T11+T21) is not less than about 0.90 and not more than about 1.10.
    Type: Application
    Filed: December 1, 2017
    Publication date: June 7, 2018
    Inventors: Yukihiro FUJITA, Takashi FUKUMA