Abstract: In a solid-state image pickup device including a light receiving sensor portion in a surface layer portion of a substrate, an in-layer lens disposed above the light receiving sensor portion, a color filter disposed on the in-layer lens, and an interlayer film disposed below the in-layer lens, an antireflection film is formed between the in-layer lens and the color filter, the antireflection film being formed of material having a refractive index which is an intermediate value between the refractive index of the in-layer lens and the refractive index of the color filter. Further, another antireflection film is formed between the in-layer lens and the interlayer film, the other antireflection film being formed of material having a refractive index which is an intermediate value between the refractive index of the in-layer lens and the refractive index of the interlayer film.

Abstract: In a solid-state image pickup device including a light receiving sensor portion in a surface layer portion of a substrate, an in-layer lens disposed above the light receiving sensor portion, a color filter disposed on the in-layer lens, and an interlayer film disposed below the in-layer lens, an antireflection film is formed between the in-layer lens and the color filter, the antireflection film being formed of material having a refractive index which is an intermediate value between the refractive index of the in-layer lens and the refractive index of the color filter. Further, another antireflection film is formed between the in-layer lens and the interlayer film, the other antireflection film being formed of material having a refractive index which is an intermediate value between the refractive index of the in-layer lens and the refractive index of the interlayer film.

Abstract: In a solid-state image pickup device including a light receiving sensor portion in a surface layer portion of a substrate, an in-layer lens disposed above the light receiving sensor portion, a color filter disposed on the in-layer lens, and an interlayer film disposed below the in-layer lens, an antireflection film is formed between the in-layer lens and the color filter, the antireflection film being formed of material having a refractive index which is an intermediate value between the refractive index of the in-layer lens and the refractive index of the color filter. Further, another antireflection film is formed between the in-layer lens and the interlayer film, the other antireflection film being formed of material having a refractive index which is an intermediate value between the refractive index of the in-layer lens and the refractive index of the interlayer film.

Abstract: A method of manufacturing a solid-state image sensing device in which a light-sensitive sensor part for photoelectric transfer is formed on the surface of a substrate and a light shielding film for preventing light from being incident on the substrate except the light-sensitive sensor part is formed is provided. First, a transfer electrode is formed on the substrate via an insulating film and after an interlayer insulating film for covering the transfer electrode is further formed, a planarized film for covering the interlayer insulating film is formed. Next, only the location of the planarized film to be a light shielding area for forming a light shielding film is selectively etched, a concave portion is formed and a groove deep enough to reach the vicinity of the surface of the substrate is formed by etching the planarized film over the periphery of the light-sensitive sensor part and near the side of the transfer electrode.

Abstract: A method for fabricating a solid-state image sensing device wherein a plurality of sensor regions are arranged in two-dimensions. A plurality of vertical transfer lines are associated with respective vertical rows of the plurality of sensor regions to transfer signal charges read from the sensor regions. A gate electrode is formed on an insulating layer over a signal charge transfer layer formed at the surface of the substrate. A buffer layer is formed containing hydrogen on an interlayer insulating layer over the gate electrode and the sensor regions. The light shielding layer is formed only over the buffer layer.

Abstract: A solid-state image sensing device, such as a charge-coupled image sensor, has a plurality of sensor regions arranged in two-dimensions with vertical transfer lines associated with respective vertical rows of the sensor regions for transfer of signal charges read from the sensor regions. Each vertical transfer line comprises a charge transfer region for transferring the signal charges read from the sensor regions. A gate electrode is formed on an insulating layer over the signal charge transfer regions, a light shielding layer is formed on an interlayer insulating layer over the gate electrode, and a buffer film containing hydrogen underlies the light shielding layer. The buffer layer, such as a buffer layer containing hydrogen, prevents damage attributable to film forming processes and the diffusion of impurities from the light shielding layer, and supplies hydrogen into the interface between the substrate and an oxide film to improve the condition of the interface. Thus, dark current can be reduced.

Abstract: To manufacture a charge transfer device, a first insulating film is deposited on a surface of a semiconductor substrate as a charge transfer region for transferring charge packets therein in one direction. Then, a plurality of first transfer electrodes are deposited on the first insulating film, the first transfer electrodes being spaced from each other, and a portion of each of the first transfer electrodes is removed to shape each of the first transfer electrodes into a staircase configuration. Thereafter, a first impurity is ion-implanted into the surface of the semiconductor substrate to create an impurity-diffused region therein which includes first and second different-potential subregions underneath each of the first transfer electrodes and a different-potential subregion underneath each of areas of the first insulating film between the first transfer electrodes.

Abstract: A solid state imager device comprises a plurality of pixels arranged in rows and columns, each of the pixels consisting of a light sensing element and a vertical transfer portion adjacent to the light sensing element, the vertical transfer portion having three gate portions such as a first, a second and a third gate portions insulated each other, the third gate portion located in the center of the three gate portions, a plurality of rows of base portions disposed in the horizontal direction and connecting the respective gate portions, a vertical wiring device disposed over the gate portions through an insulating layer, the vertical wiring device including, a first wiring film connecting the first gate portions, a second wiring film connecting the second gate portions, a third wiring film connecting the third gate portions which is connected to the odd row of the base portions, a fourth wiring film connecting the third gate portions which is connected to the even rows of the base portions, a read out pulse dev

Abstract: A fabrication process includes at least a step of low pressure CVD for depositing an upper silicon oxide layer on a silicon nitride layer which is formed through a lower silicon oxide layer on a silicon substrate, a next step of forming a gate electrode on the second oxide layer, and a further step of selectively removing the second oxide layer and instead forming a similar silicon oxide layer anew. This process can meet the demand for device miniaturization, improve the C-V characteristic of a MOS capacitor and provide uniform insulating layers.