Patents by Inventor Takashi Fukutani

Takashi Fukutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing sputtering target
    Patent number: 10844475
    Abstract: (1) The present invention provides a method for manufacturing a sputtering target in which the controllability of crystal orientation is improved. Specifically, the present invention provides a method for manufacturing a sputtering target, comprising a step of shaping at least one raw material powder selected from a metal and a metal oxide into a desired target shape using an additive manufacturing method. (2) The present invention provides a method for manufacturing a sputtering target capable of improving production efficiency. Specifically, the present invention provides a method for manufacturing a sputtering target in which a backing plate and a sputter part are bonded, comprising a shaping step of shaping at least one raw material powder selected from a metal and a metal oxide into a desired sputter part shape on a backing plate or on an intermediate material provided on a backing plate using an additive manufacturing method.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 24, 2020
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Shuichi Irumata, Takashi Fukutani, Ryo Suzuki
  • Method for Manufacturing Sputtering Target
    Publication number: 20180127866
    Abstract: (1) The present invention provides a method for manufacturing a sputtering target in which the controllability of crystal orientation is improved. Specifically, the present invention provides a method for manufacturing a sputtering target, comprising a step of shaping at least one raw material powder selected from a metal and a metal oxide into a desired target shape using an additive manufacturing method. (2) The present invention provides a method for manufacturing a sputtering target capable of improving production efficiency. Specifically, the present invention provides a method for manufacturing a sputtering target in which a backing plate and a sputter part are bonded, comprising a shaping step of shaping at least one raw material powder selected from a metal and a metal oxide into a desired sputter part shape on a backing plate or on an intermediate material provided on a backing plate using an additive manufacturing method.
    Type: Application
    Filed: December 13, 2016
    Publication date: May 10, 2018
    Inventors: Shuichi Irumata, Takashi Fukutani, Ryo Suzuki