Abstract: A thermosetting resin composition contains a solid epoxy resin that is solid at 25° C. a non-solid epoxy resin that is non-solid at 25° C., particulate rubber dispersed in the non-solid epoxy resin, a curing agent, an inorganic filler, and polycarbonate diol-derived polyurethane. The content of the particulate rubber is from 3 to 15 parts by mass with respect to the total parts by mass of the solid epoxy resin and the non-solid epoxy resin, the acid value of the polycarbonate diol-derived polyurethane is from 10 to 30 mgKOH/g, and the weight average molecular weight of the polycarbonate diol-derived polyurethane is from 15,000 to 50,000.

Abstract: A thermosetting resin composition contains a solid epoxy resin that is solid at 25° C., a non-solid epoxy resin that is non-solid at 25° C., particulate rubber dispersed in the non-solid epoxy resin, a curing agent, an inorganic filler, and polycarbonate diol-derived polyurethane. The content of the particulate rubber is from 3 to 15 parts by mass with respect to the total parts by mass of the solid epoxy resin and the non-solid epoxy resin, the acid value of the polycarbonate diol-derived polyurethane is from 10 to 30 mgKOH/g, and the weight average molecular weight of the polycarbonate diol-derived polyurethane is from 15,000 to 50,000.

Abstract: This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; a thermosetting agent; and a pigment. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80? or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. When formed into a film having a dry film thickness of 10-40 ?m, the maximum value of the transmittance of the photosensitive resin composition is at least 7% for the transmission spectrum of at least some of the wavelength from 350-430 nm. (In formula (1), R1, R2, X1, X2, and n are as defined in the description.

Abstract: The present invention provides a photosensitive resin composition from which a dry resist film having excellent resilience, storage stability and heat resistance can be produced. The photosensitive resin composition according to the present invention includes a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator and a thermal curing agent, wherein the thermal curing agent is a polycarbodiimide compound having a carbodiimide group, the carbodiimide group in the polycarbodiimide compound is protected by an amino group that can be dissociated at a temperature equal to or higher than 80° C. and the polycarbodiimide compound has a weight average molecular weight of 400 to 5000 and a carbodiimide equivalent of 180 to 2500.

Abstract: The present invention provides a resin composition for resists that is for obtaining a resist which has the characteristics conventionally required of a resist and which also does not generate warping. This resin composition for resists includes a (meth)acrylic photocurable polymer, a thermosetting agent, and a photopolymerization initiator. The (meth)acrylic photocurable polymer includes a carboxyl group, an open-chain aliphatic hydrocarbon group having 12 or more carbon atoms, and an unsaturated double bond, and the glass transition temperature (Tg) of the (meth)acrylic photocurable polymer is 20° C. or less.

Abstract: A photocurable resin composition according to the present invention contains an anionic-group-containing photosensitive resin comprising a photosensitive urethane resin, a photopolymerization initiator and a thermal curing agent, wherein the photosensitive urethane resin is produced by reacting a raw material mixture containing (A) a polyol having at least an ester bond and also having an unsaturated bond at least in the main chain thereof, (B) a compound having at least one active-hydrogen-containing group and at least one anionic group in the molecule thereof, (C) a polyisocyanate and (D) a compound having at least one active-hydrogen-containing group and an unsaturated bond group in the molecule thereof, and the photosensitive urethane resin has an ester bond and an unsaturated bond in the main chain in the same molecule, wherein at least one of a side chain and a terminal has an anionic group and a side chain has an unsaturated bond group.

Abstract: The present invention provides a photosensitive resin composition with which a dry resist film can be obtained, the dry resist film exhibiting excellent storage stability and migration resistance in thickness direction thereof. This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; and a thermosetting agent. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80° C. or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. In formula (1), R1, R2, X1, X2, and n are as defined in the description.

Abstract: The present invention provides a photosensitive resin composition with which a dry resist film can be obtained, the dry resist film exhibiting excellent storage stability and migration resistance in thickness direction thereof. This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; and a thermosetting agent. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80° C. or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. In formula (1), R1, R2, X1, X2, and n are as defined in the description.

Abstract: This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; a thermosetting agent; and a pigment. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80? or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. When formed into a film having a dry film thickness of 10-40 ?m, the maximum value of the transmittance of the photosensitive resin composition is at least 7% for the transmission spectrum of at least some of the wavelength from 350-430 nm. (In formula (1), R1, R2, X1, X2, and n are as defined in the description.

Abstract: The present invention provides a photosensitive resin composition from which a dry resist film having excellent resilience, storage stability and heat resistance can be produced. The photosensitive resin composition according to the present invention includes a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator and a thermal curing agent, wherein the thermal curing agent is a polycarbodiimide compound having a carbodiimide group, the carbodiimide group in the polycarbodiimide compound is protected by an amino group that can be dissociated at a temperature equal to or higher than 80° C. and the polycarbodiimide compound has a weight average molecular weight of 400 to 5000 and a carbodiimide equivalent of 180 to 2500.