Abstract: The invention provides a gold-supporting catalyst comprising gold nanoparticles and a carrier consisting of porous ceramic obtained by firing a mixture comprising an aluminum compound, a lime component, and a plastic clay containing 1% by mass or less of feldspars and quartz, wherein the gold nanoparticles are supported in an amount of 0.01 to 10 parts by mass on the carrier based on 100 parts by mass of the carrier.

Abstract: The invention provides a process for forging a titanium-based material comprises the steps of: preparing a titanium-based sintered workpiece including at least one of ceramics particles and pores in a total amount of 1% or more by volume, the ceramics particles being thermodynamically stable in a titanium alloy; and heating the workpiece to a forging temperature and forging the same. In the production process, the pores or the ceramics particles inhibit the grain growth during forging. Accordingly, it is possible to carry out the forging at a relatively high temperature at which the titanium-based material exhibits a small resistance to deformation. Moreover, the titanium-based material can maintain an appropriate microstructure even after the forging. Consequently, the impact value and the fatigue strength are inhibited from decreasing.

Abstract: A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.

Abstract: A microetching composition for copper or copper alloys comprising, (a) a cupric ion source, (b) an organic acid with an acid dissociation constant (pKa) of 5 or less, (c) a halide ion source, and (d) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition can be very adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.

Abstract: A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.

Abstract: Disclosed is a method for removing a layer of tin or tin-lead alloy from a copper substrate of a printed circuit board employing the two different reagents in a two-step procedure without damaging the substrate, and at the same time, preventing formation of whitish precipitates in the treating solution.In the first step, the layer of tin or tin-lead alloy is selectively removed with the first reagent having a comparatively mild oxidation capability, then in the second step the intermetallic layer consisting of tin and copper is removed with the second reagent having a comparatively strong oxidation capability.This process ensures a smooth and effective operation in the production of high quality printed circuit boards.