Patents by Inventor Takashi Hayasaka

Takashi Hayasaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250065638
    Abstract: Disclosed is a cartridge that includes a case including a storage portion for storing liquid and a flow path that communicates with the storage portion; an element substrate including an ejection port that communicates with the storage portion via the flow path and that ejects liquid contained in the storage portion; and an electric wiring substrate that is electrically connected to the element substrate. The case has a surface to which the element substrate and the electric wiring substrate are fixed. Viewed from a direction perpendicular to the surface, a slit is provided in at least one long side of an outer periphery of the surface.
    Type: Application
    Filed: August 5, 2024
    Publication date: February 27, 2025
    Inventors: TATSUO NANJO, KEISUKE IINUMA, WATARU TAKAHASHI, KEIICHIRO TSUKUDA, TAKASHI HAYASAKA
  • Patent number: 12205730
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: January 21, 2025
    Assignee: Proterial, Ltd.
    Inventors: Seigi Aoyama, Toru Sumi, Takashi Hayasaka, Ryohei Okada, Detian Huang, Tamotsu Sakurai, Satoshi Yajima, Minoru Takatsuto, Hiroshi Bando
  • Publication number: 20240300236
    Abstract: An object is to provide a liquid ejection head capable of efficiently dissipating heat generated at the time of liquid ejection. The liquid ejection head includes a storage portion storing liquid; an ejection portion provided with a nozzle to eject liquid and an element to generate energy to eject liquid from the nozzle; and a flow path portion having a flow path capable of supplying liquid from the storage portion to the ejection portion. In a second direction orthogonal to a first direction which is a direction of supply of liquid from the storage portion to the ejection portion, the flow path portion includes a narrow width portion smaller in width than the storage portion and the ejection portion.
    Type: Application
    Filed: March 7, 2024
    Publication date: September 12, 2024
    Inventors: HIROSHI KOSHIKAWA, KEISUKE IINUMA, KEIICHIRO TSUKUDA, TATSUO NANJO, TAKASHI HAYASAKA, MASATO NODA, WATARU TAKAHASHI
  • Publication number: 20240300245
    Abstract: A liquid storage container including a positioning configuration contributing to downsizing is provided. The container capable of storing liquid therein includes a fitting portion including a communication port establishing communication between an inside and an outside, wherein a supply member supplying liquid is fitted and can supply the inside with liquid via the communication port; a first positioning portion positioning the supply member at one point; and a second positioning portion including a guide provided in the fitting portion and capable of guiding the supply member to a position where the supply member is fitted into the fitting portion when the supply member is fitted into the fitting portion while being positioned by the first positioning portion and a restriction portion restricting movement of the supply member using the first positioning portion as a rotation axis in the position where the supply member is fitted into the fitting portion.
    Type: Application
    Filed: January 18, 2024
    Publication date: September 12, 2024
    Inventors: TAKASHI HAYASAKA, KEISUKE IINUMA, TATSUO NANJO, WATARU TAKAHASHI, HIROMASA TSUTSUMI, HIDEAKI MATSUMURA, YUSUKE NARATANI, TSUYOSHI SAEKI, TAIJI MARUYAMA, SHOTA ASADA, NORIO SAKURAI
  • Publication number: 20240286787
    Abstract: Provided is a storage container for a liquid cartridge, including: a main body having a storage portion in which to store the liquid cartridge, and an opening portion through which to put the liquid cartridge in and out; and at least one first rib being flexible and arranged in a gap space formed between the storage portion and the liquid cartridge in a state where the liquid cartridge is stored in the storage portion, the at least one first rib being arranged in the gap space so as to protrude in a direction along an inner surface of the storage portion and in an inward direction from the inner surface of the storage portion and extend from around a bottom of the storage portion facing the opening portion toward the opening portion.
    Type: Application
    Filed: December 28, 2023
    Publication date: August 29, 2024
    Inventors: MASATO NODA, SOJI KONDO, WATARU TAKAHASHI, TATSUO NANJO, KEISUKE IINUMA, HIROSHI KOSHIKAWA, TAKAYUKI NAKAJIMA, TAKASHI HAYASAKA
  • Publication number: 20240157700
    Abstract: A discharge unit includes an element substrate having a discharge port which discharges a liquid, an electric wiring substrate having an end surface opposed to the element substrate and a terminal electrically connected to the element substrate, a support member which supports the element substrate and the electric wiring substrate with a support surface, and an adhesive which bonds the electric wiring substrate and the support member, in which the electric wiring substrate further has a protruding portion which is provided having an interval with respect to the support surface and protrudes from the end surface of the electric wiring substrate toward the element substrate, and the protruding portion is provided at a position overlapping the terminal in a direction parallel to the support surface and orthogonal to a protruding direction of the protruding portion.
    Type: Application
    Filed: October 25, 2023
    Publication date: May 16, 2024
    Inventors: TAKASHI HAYASAKA, SHUHEI OYA, NAOKI NAKAJO
  • Publication number: 20240109320
    Abstract: A liquid ejection head includes an element substrate, an electric wiring board, a cover member, and a support member having a first through hole, a second through hole, and a support surface. The element substrate includes an ejection port and a pressure chamber to supply liquid to the ejection port. The cover member is joined to the support surface with a first adhesive. The support member supports the element substrate and the electric wiring board on the support surface. The first through hole serves as a flow passage through which the liquid is supplied to the pressure chamber and the second through hole opens in the support surface. The first adhesive is disposed in an outer peripheral region of the support surface of the support member. A space surrounded by the cover member, the support member, and the first adhesive communicates with the second through hole.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 4, 2024
    Inventors: SHUHEI OYA, TOMOAKI KAMAGATA, TAKASHI HAYASAKA, SATOSHI IDETA
  • Patent number: 11404181
    Abstract: A copper alloy wire is made of a copper alloy, and the copper alloy contains indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.45 mass %. A tensile strength of the copper alloy wire is equal to or higher than 800 MPa, and an electrical conductivity of the same is equal to or higher than 80% IACS.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: August 2, 2022
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hiromitsu Kuroda, Takashi Hayasaka, Detian Huang, Ryohei Okada, Tamotsu Sakurai
  • Publication number: 20220223313
    Abstract: A copper alloy wire is composed of a copper alloy including indium. of 0.3 mass % or more and 0.65 mass % or less, and has 0.2% proof stress of 300 MPa or more, electrical conductivity of 80% IACS or more, and elongation of 7% or more.
    Type: Application
    Filed: December 28, 2021
    Publication date: July 14, 2022
    Inventors: Hiromitsu Kuroda, Takashi HAYASAKA, Detian HUANG, Ryohei OKADA, Tamotsu SAKURAI
  • Patent number: 11355258
    Abstract: A wire rod made of an aluminum alloy. The aluminum alloy includes Al crystal grains, an Al—Zr compound, and an Al—Co—Fe or Al—Ni—Fe compound. The aluminum alloy includes high-angle tilt crystal grain boundaries, each of which has a difference between crystal orientations in both its sides of 15 degrees or more, and low-angle tilt crystal grain boundaries, each of which has a difference between crystal orientations in both its sides of 2 degrees or more and less than 15 degrees. An average grain diameter of ones of the Al crystal grains surrounded by the high-angle boundaries is 12 ?m or more. An average grain diameter of the ones of the Al crystal grains surrounded by the high-angle boundaries, ones of the Al crystal grains surrounded by the high-angle boundaries and the low-angle boundaries, and ones of the Al crystal grains surrounded by the low-angle boundaries, is 10 ?m or less.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: June 7, 2022
    Assignee: HITACHI METALS, LTD.
    Inventors: Toru Sumi, Kazuya Nishi, Shohei Hata, Takashi Hayasaka, Takeshi Usami
  • Publication number: 20210249149
    Abstract: Improvement of a strength of a copper alloy wire and improvement of an electrical conductivity of the same are both achieved. A copper alloy wire is made of a copper alloy, and the copper alloy contains indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.45 mass %. A tensile strength of the copper alloy wire is equal to or higher than 800 MPa, and an electrical conductivity of the same is equal to or higher than 80% IACS.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 12, 2021
    Inventors: Hiromitsu Kuroda, Takashi Hayasaka, Detian Huang, Ryohei Okada, Tamotsu Sakurai
  • Patent number: 11053569
    Abstract: An alloying-element additive for adding an alloy element to a copper melt formed by melting a base material including a copper in manufacturing a copper alloy. The alloying-element additive includes a wire-shaped or plate-shaped core including an alloy element, and an outer layer material including a copper and covering the core. A weight ratio of the copper in the outer layer material and the alloy element in the core is in a range of weight ratio where the alloying-element additive has a liquid phase in a temperature range of not more than a melting point of the copper in a copper-alloy element phase diagram.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: July 6, 2021
    Assignee: HITACHI METALS, LTD.
    Inventors: Keisuke Fujito, Takashi Hayasaka, Takeshi Usami, Toru Sumi
  • Patent number: 10920306
    Abstract: An aluminum alloy wire rod has a chemical composition consisting of 0.1 to 1.0 mass % of Co, 0.2 to 0.5 mass % of Zr, 0.02 to 0.09 mass % of Fe, 0.02 to 0.09 mass % of Si, 0 to 0.2 mass % of Mg, 0 to 0.10 mass % of Ti, 0 to 0.03 mass % of B, 0 to 1.00 mass % of Cu, 0 to 0.50 mass % of Ag, 0 to 0.50 mass % of Au, 0 to 1.00 mass % of Mn, 0 to 1.00 mass % of Cr, 0 to 0.50 mass % of Hf, 0 to 0.50 mass % of V, 0 to 0.50 mass % of Sc, 0 to 0.50 mass % of Ni, the balance being Al and inevitable impurities, and a metal structure including Al crystal grains, an Al—Co—Fe compound and an Al—Zr compound. The Al crystal grains having a crystal grain diameter of 10 ?m or less have an area ratio of 90% or more. The wire rod has a tensile strength of 150 MPa or more, an electrical conductivity of 55% IACS or more and when heated at 200 deg C. for 10 years, a strength of 90% or more of its initial state strength.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: February 16, 2021
    Assignee: HITACHI METALS, LTD.
    Inventors: Toru Sumi, Kazuya Nishi, Shohei Hata, Takashi Hayasaka, Takeshi Usami
  • Publication number: 20210005342
    Abstract: A wire rod made of an aluminum alloy. The aluminum alloy includes Al crystal grains, an Al—Zr compound, and an Al—Co—Fe or Al—Ni—Fe compound. The aluminum alloy includes high-angle tilt crystal grain boundaries, each of which has a difference between crystal orientations in both its sides of 15 degrees or more, and low-angle tilt crystal grain boundaries, each of which has a difference between crystal orientations in both its sides of 2 degrees or more and less than 15 degrees. An average grain diameter of ones of the Al crystal grains surrounded by the high-angle boundaries is 12 ?m or more. An average grain diameter of the ones of the Al crystal grains surrounded by the high-angle boundaries, ones of the Al crystal grains surrounded by the high-angle boundaries and the low-angle boundaries, and ones of the Al crystal grains surrounded by the low-angle boundaries, is 10 ?m or less.
    Type: Application
    Filed: November 12, 2019
    Publication date: January 7, 2021
    Inventors: Toru SUMI, Kazuya Nishi, Shohei Hata, Takashi Hayasaka, Takeshi Usami
  • Patent number: 10720258
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: July 21, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Seigi Aoyama, Toru Sumi, Takashi Hayasaka, Ryohei Okada, Detian Huang, Tamotsu Sakurai, Satoshi Yajima, Minoru Takatsuto, Hiroshi Bando
  • Publication number: 20200168355
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Application
    Filed: January 29, 2020
    Publication date: May 28, 2020
    Inventors: Seigi AOYAMA, Toru SUMI, Takashi HAYASAKA, Ryohei OKADA, Detian HUANG, Tamotsu SAKURAI, Satoshi YAJIMA, Minoru TAKATSUTO, Hiroshi BANDO
  • Publication number: 20190345594
    Abstract: An aluminum alloy wire rod has a chemical composition consisting of 0.1 to 1.0 mass % of Co, 0.2 to 0.5 mass % of Zr, 0.02 to 0.09 mass % of Fe, 0.02 to 0.09 mass % of Si, 0 to 0.2 mass % of Mg, 0 to 0.10 mass % of Ti, 0 to 0.03 mass % of B, 0 to 1.00 mass % of Cu, 0 to 0.50 mass % of Ag, 0 to 0.50 mass % of Au, 0 to 1.00 mass % of Mn, 0 to 1.00 mass % of Cr, 0 to 0.50 mass % of Hf, 0 to 0.50 mass % of V, 0 to 0.50 mass % of Sc, 0 to 0.50 mass % of Ni, the balance being Al and inevitable impurities, and a metal structure including Al crystal grains, an Al—Co—Fe compound and an Al-Zr compound. The Al crystal grains having a crystal grain diameter of 10 ?m or less have an area ratio of 90% or more. The wire rod has a tensile strength of 150 MPa or more, an electrical conductivity of 55% IACS or more and when heated at 200 deg C. for 10 years, a strength of 90% or more of its initial state strength.
    Type: Application
    Filed: November 15, 2018
    Publication date: November 14, 2019
    Applicant: HITACHI METALS, LTD.
    Inventors: Toru Sumi, Kazuya Nishi, Shohei Hata, Takashi Hayasaka, Takeshi Usami
  • Publication number: 20180197652
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Application
    Filed: October 3, 2017
    Publication date: July 12, 2018
    Inventors: Seigi AOYAMA, Toru SUMI, Takashi HAYASAKA, Ryohei OKADA, Detian HUANG, Tamotsu SAKURAI, Satoshi YAJIMA, Minoru TAKATSUTO, Hiroshi BANDO
  • Patent number: 9787627
    Abstract: An information processing apparatus according to embodiments includes: a comment acquisition unit for acquiring a comment of a viewer for a program from an external posting site to which a comment, which is feedback on the content of a program, is instantly posted; and a comment displaying unit for displaying the comment acquired by the comment acquisition unit in a live information display area located below an image display screen for displaying an image of the program. The comment displaying unit scroll-displays, in a horizontal direction, a comment acquired by the comment acquisition unit in either a first lane or a second lane of the live information display area.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: October 10, 2017
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Manabu Nishizawa, Takashi Hayasaka, Kensaku Ishizuka, Hiroyuki Yamamoto
  • Publication number: 20160298212
    Abstract: An alloying-element additive for adding an alloy element to a copper melt formed by melting a base material including a copper in manufacturing a copper alloy. The alloying-element additive includes a wire-shaped or plate-shaped core including an alloy element, and an outer layer material including a copper and covering the core. A weight ratio of the copper in the outer layer material and the alloy element in the core is in a range of weight ratio where the alloying-element additive has a liquid phase in a temperature range of not more than a melting point of the copper in a copper-alloy element phase diagram.
    Type: Application
    Filed: January 29, 2016
    Publication date: October 13, 2016
    Inventors: Keisuke FUJITO, Takashi HAYASAKA, Takeshi USAMI, Toru SUMI