Patents by Inventor Takashi Hinooka

Takashi Hinooka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10014132
    Abstract: An electronic device includes a casing having an opening; a circuit board having a plurality of electrodes, which is provided inside the casing; a contact member having a plurality of contact points corresponding to the electrodes, which is provided so as to seal the opening; and a key unit (press-key unit) having a key operation unit corresponding to the contact points, which is provided to the opening. The key unit (press-key unit) is attached to the opening detachably.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: July 3, 2018
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Takashi Hinooka, Chihaya Sakata, Shinichi Tamamoto, Atsushi Tsuchiya
  • Publication number: 20160225550
    Abstract: An electronic device includes a casing having an opening; a circuit board having a plurality of electrodes, which is provided inside the casing; a contact member having a plurality of contact points corresponding to the electrodes, which is provided so as to seal the opening; and a key unit (press-key unit) having a key operation unit corresponding to the contact points, which is provided to the opening. The key unit (press-key unit) is attached to the opening detachably.
    Type: Application
    Filed: January 8, 2016
    Publication date: August 4, 2016
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Takashi HINOOKA, Chihaya SAKATA, Shinichi TAMAMOTO, Atsushi TSUCHIYA
  • Patent number: 5038251
    Abstract: A thin electronic calculator having a circuit board unit in which an IC pellet is directly mounted on a film board and allowing easy mass-production is provided. Metal foil leads each having one end and the other end radially extending from the one end and having a larger width than the one end are formed on the film board. The IC pellet is bonded to one end portions of the metal foil leads through bump electrodes. The circuit board unit is fixed to a wiring board by an anisotropically electrical conductive adhesive. The other end of each metal foil lead is electrically connected to a corresponding connecting terminal formed on the wiring board. An electronic component assembly constituted by the circuit board unit and the wiring board is received in upper and lower covers, and is adhered by adhesive islands deposited on the covers.
    Type: Grant
    Filed: April 6, 1988
    Date of Patent: August 6, 1991
    Assignee: Casio Computer Co., Ltd.
    Inventors: Yoshinobu Sugiyama, Shohei Sawada, Takashi Hinooka, Kaoru Yoshida