Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]?400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.

Abstract: The present invention relates to a copper alloy sheet for terminal and connector materials, which is excellent in terms of tensile strength, proof stress, Young's modulus, electric conductivity, bending workability, stress corrosion crack resistance, stress relaxation characteristics and solderability.

Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]<400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.

Abstract: Provided is a copper alloy containing 18% by mass to 30% by mass of Zn, 1% by mass to 1.5% by mass of Ni, 0.2% by mass to 1% by mass of Sn, and 0.003% by mass to 0.06% by mass of P, the remainder including Cu and unavoidable impurities. Relationships of 17?f1=[Zn]+5×[Sn]?2×[Ni]?30, 14?f2=[Zn]?0.5×[Sn]?3×[Ni]?26, 8?f3={f1×(32?f1)}1/2×[Ni]?23, 1.3?[Ni]+[Sn]?2.4, 1.5?[Ni]/[Sn]?5.5, and 20?[Ni]/[P]?400 are satisfied. The copper alloy has a metallographic structure of an ? single phase.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11?[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]?19 is satisfied, a relationship of 7?[Ni]/[P]?40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 ?m to 8.0 ?m, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t?0.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44?[Zn]+20×[Sn]?37 and 32?[Zn]+9×([Sn]?0.25)1/2?37 are satisfied. The copper alloy sheet according to the aspect is manufactured by a manufacturing process including a finish cold-rolling process of cold-rolling a copper alloy material, an average grain size of the copper alloy material is 2.0 ?m to 7.0 ?m, and a sum of an area ratio of a ? phase and an area ratio of a ? phase in a metallographic structure of the copper alloy material is 0% to 0.9%.

Abstract: An artificially patinated copper plate in which a copper sulfide layer 2 is formed on the surface of a copper base plate 1 by sulfiding for coating the same, and the copper sulfide layer 2 having an artificially patinated layer 3 is formed distributed and bonded thereon by spraying a resin solution mixed with basic copper carbonate constituting the main component of natural patina. The percentage of the area occupied by the artificially patinated layer 3 on the copper sulfide layer 2 is most preferably 25% to 80% and the thickness of the copper sulfide layer 2 is most preferably 0.1 to 0.5 .mu.m.