Abstract: To provide a semiconductor light emitting device which is capable of accomplishing a broad color reproducibility for an entire image without losing brightness of the entire image. A light source provided on a backlight for a color image display device has a semiconductor light emitting device comprising a solid light emitting device to emit light in a blue or deep blue region or in an ultraviolet region and phosphors, in combination. The phosphors comprise a green emitting phosphor and a red emitting phosphor. The green emitting phosphor and the red emitting phosphor are ones, of which the rate of change of the emission peak intensity at 100° C. to the emission intensity at 25° C., when the wavelength of the excitation light is 400 nm or 455 nm, is at most 40%.

Abstract: A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.

Abstract: A disc-shaped polishing pad (1) is used for a polishing method of the present invention. The polishing pad (1) has a peripheral surface (111) on a polishing surface (10) side in an axial direction of the disc of a tapered surface whose diameter is reduced to the polishing surface (10). An angle formed by the peripheral surface (111) and the polishing surface (10) is 125° or more and less than 180°. The polishing pad (1) has a hardness immediately after a pressing surface is in close contact of 40 or more by a testing method specified in an appendix 2 of JIS K7312: 1996, “Spring Hardness Test Type C Testing Method”. A slurry containing abrasives is supplied to a polished surface larger than the polishing surface (10). The polishing surface (10) is pressed against the polished surface and the polishing pad (1) is moved to polish the polished surface.

Abstract: The object of the present invention is to promote warming-up operation in a cooling water flow control system of an internal combustion engine. A flow control valve is provided at a junction of a radiator passage and a bypass passage. Radiator flow rate and bypass flow rate of the flow control vale are controlled by detecting engine outlet water temperature, radiator outlet water temperature, number of revolutions of engine, and suction pipe negative pressure. The cooling water in the bypass passage passes through a throttle body, and flow rate is controlled to a totally closed flow rate or a micro-flow rate in the warming-up operation, and this contributes to the promotion of the warming-up operation.

Abstract: Only important portions in all of messages are extracted in the halfway or after the end of a discussion and are allowed to be referred to the user. The time for discussion is reduced, thereby smoothly proceeding a conference. An electronic conference system is constructed in an electronic conference system server in a manner such that a plurality of user clients are connected to the electronic conference system server through a network (not shown). The electronic conference system is made up of a message database, a message relation extracting unit, a message type setting unit, a message input and display unit, and an electronic conference summarizing system. The electronic conference summarizing system is constructed by a discussion path specifying unit, a message merging unit, a duplication message deleting unit, and a message summary file.

Abstract: A gallium alloy for dental restorations which is hardenable at mouth temperature or around 37.degree. C. or more after triturating multicomponent liquid gallium alloy with alloy powder, is disclosed. The mixture has a heterogeneous structure after hardening, and contains as the overall composition, 9-47% gallium, 1-35% indium, 0.2-38% tin and 1-68% silver as indispensable components and one or more elements selected from 0.4-35% palladium, 0.5-25% copper and 0.4-12% zinc as arbitrary components. The multicomponent liquid gallium alloy contains 45-85% gallium, 5-40% indium and 1-30% tin as fundamental components and small amounts one or more elements selected from silver, palladium, gold, platinium, copper, zinc and germanium as arbitrary components. The alloy powder contains 1-85% silver and two or more elements selected from 1-40% tin, 1-40% palladium, 1-30% copper, 1-15% zinc and 1-25% indium.