Patents by Inventor Takashi Iga

Takashi Iga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220153881
    Abstract: The method for producing hollow resin particles includes: carrying out a suspension treatment of a mixture liquid including a polymerizable monomer including a non-crosslinkable monomer and a crosslinkable monomer, a hydrocarbon solvent and an aqueous medium to prepare a suspension, carrying out a polymerization reaction of the suspension to form precursor particles having a hollow portion and including the hydrocarbon solvent in the hollow portion, and removing the hydrocarbon solvent included in the precursor particles to produce hollow resin particles. A content of the crosslinkable monomer is from 35 parts by mass to 95 parts by mass when the total mass of the polymerizable monomer is regarded as 100 parts by mass; a solubility parameter (SP value) of the polymerizable monomer is from 8.70 to 9.42; and a difference between the SP value of the polymerizable monomer and a SP value of the hydrocarbon solvent is 0.60 or more.
    Type: Application
    Filed: January 30, 2020
    Publication date: May 19, 2022
    Applicant: ZEON CORPORATION
    Inventors: Takashi Iga, Nozomi Yabuki
  • Publication number: 20220066336
    Abstract: The preset invention provides a method for producing a toner for electrostatic-image development comprising: a dispersing step of performing a dispersing treatment in which a cavitation effect is obtained on a color resin particle containing a binder resin, a colorant, a charge control agent, and a release agent in an aqueous dispersion median so as to obtain a dispersion of the color resin particle; and a heating step of performing a heat treatment on the dispersion of the color resin particle at a temperature of equal to or more than a glass transition temperature of the color resin particle and 95° C. or less for a heating time of 5 minutes or more and 10 hours or less.
    Type: Application
    Filed: December 26, 2019
    Publication date: March 3, 2022
    Applicant: ZEON CORPORATION
    Inventors: Kojiro Akazaki, Takeru Chiba, Takashi Iga
  • Publication number: 20220041844
    Abstract: A polymer latex including a polymer and at least one polysaccharide selected from the group consisting of tamarind gum, xanthan gum, cationized xanthan gum, gellan gum, guar gum and cationized guar gum.
    Type: Application
    Filed: September 17, 2019
    Publication date: February 10, 2022
    Applicant: ZEON CORPORATION
    Inventors: Kentaro HAYASAKA, Takashi IGA
  • Publication number: 20220033628
    Abstract: Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product having a small variation in specific gravity. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic elastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.
    Type: Application
    Filed: September 13, 2019
    Publication date: February 3, 2022
    Applicant: ZEON CORPORATION
    Inventors: Takeshi Hirata, Takashi Iga
  • Publication number: 20220033652
    Abstract: Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic plastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.
    Type: Application
    Filed: September 13, 2019
    Publication date: February 3, 2022
    Applicant: ZEON CORPORATION
    Inventors: Takeshi Hirata, Takashi Iga
  • Patent number: 11118038
    Abstract: A latex composition containing a conjugated diene polymer latex and a medium-chain fatty acid glyceride, wherein a content proportion of the medium-chain fatty acid glyceride is 1 to 40 parts by weight with respect to 100 parts by weight of the conjugated diene polymer. In the present invention, a medium-chain fatty acid forming the medium-chain fatty acid glyceride is preferably a fatty acid having 6 to 18 carbon atoms. In the present invention, the medium-chain fatty acid glyceride is preferably a medium-chain fatty acid triglyceride. The latex composition preferably further contains a crosslinking agent.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: September 14, 2021
    Assignee: ZEON CORPORATION
    Inventors: Masatoshi Ishiba, Takashi Iga, Junji Kodemura
  • Publication number: 20210179801
    Abstract: A foam containing a nitrile group-containing conjugated diene copolymer and a urethane polymer, wherein relative to 100 wt % of the sum of the nitrile group-containing conjugated diene copolymer and the urethane polymer, the nitrile group-containing conjugated diene copolymer is present in an amount of less than 90 wt % and the urethane polymer is present in an amount of more than 10 wt %, the nitrile group-containing conjugated diene copolymer contains ethylenically unsaturated nitrile monomer units in an amount of more than 31 wt %, the foam has a density of 0.08 to 0.30 g/cm3, and in observation of an arbitrary cross section of the foam, air bubble cross sections present in the cross section have an average diameter of 350 ?m or less, and the number of air bubble cross sections with a diameter of 0.6 mm or more present in the cross section is 0.062 per mm2 or less.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 17, 2021
    Applicant: ZEON CORPORATION
    Inventors: Tomoya TANIYAMA, Takashi IGA
  • Publication number: 20210087349
    Abstract: Provided is a method for producing a latex comprising hollow resin particles each with a high void ratio and a method for producing hollow resin particles each with a higher void ratio. In the method for producing the latex: a suspension treatment of the mixture liquid which comprises a monomer, a crosslinkable monomer, an oil-soluble polymerization initiator, a fat/fatty oil, a hydrocarbon solvent, a suspension stabilizer and an aqueous medium is carried out to prepare a suspension comprising monomer drops; a polymerization reaction of the suspension is carried out to prepare a precursor composition which comprises precursor particles each having a hollow portion including the hydrocarbon solvent.
    Type: Application
    Filed: July 31, 2018
    Publication date: March 25, 2021
    Applicant: ZEON CORPORATION
    Inventors: Takashi Iga, Takeshi Hirata, Nozomi Yabuki
  • Publication number: 20210002497
    Abstract: Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 ?m to 9.0 ?m, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less.
    Type: Application
    Filed: March 25, 2019
    Publication date: January 7, 2021
    Applicant: ZEON CORPORATION
    Inventors: Takashi Iga, Takeshi Hirata, Nozomi Yabuki
  • Patent number: 10568212
    Abstract: The present invention enables the manufacture of a small-sized high-density multi-layer printed circuit board. The manufacturing method for a multi-layer printed circuit board, according to the present invention, comprises: a step in which an electrical insulation layer is formed by heating a laminate comprising a substrate, a heat-curable resin composition layer provided on the substrate, and a release substrate provided on the heat-curable resin composition layer, thereby curing the heat-curable resin composition layer, and a step in which a via hole is formed in the electrical insulation layer by irradiating a laser from above the release substrate. In addition, in the present invention, the release substrate has a thickness of at least 80 ?m and is formed using a material having a glass transition temperature, the heat-curable resin composition layer has a volatile component-content of 7.
    Type: Grant
    Filed: November 26, 2015
    Date of Patent: February 18, 2020
    Assignee: Intel Corporation
    Inventors: Makoto Fujimura, Takashi Iga, Akihiro Tanabe
  • Publication number: 20190300685
    Abstract: A latex composition containing a conjugated diene polymer latex and a medium-chain fatty acid glyceride, wherein a content proportion of the medium-chain fatty acid glyceride is 1 to 40 parts by weight with respect to 100 parts by weight of the conjugated diene polymer. In the present invention, a medium-chain fatty acid forming the medium-chain fatty acid glyceride is preferably a fatty acid having 6 to 18 carbon atoms. In the present invention, the medium-chain fatty acid glyceride is preferably a medium-chain fatty acid triglyceride. The latex composition preferably further contains a crosslinking agent.
    Type: Application
    Filed: September 19, 2017
    Publication date: October 3, 2019
    Applicant: ZEON CORPORATION
    Inventors: Masatoshi ISHIBA, Takashi IGA, Junji KODEMURA
  • Publication number: 20180355184
    Abstract: [Problem] To provide a curable resin composition which has a low linear expansion coefficient and high heat resistance, which can form a cured product in which the occurrence of void defects and the like is suppressed, and with which the toughness or a molded article can be maintained. [Solution] A curable resin composition comprising an epoxy compound (A), an epoxy curing agent (B), an inorganic filter (C), and a compound (D) including at least three ethylenically unsaturated bonds, wherein the ratio of the inorganic filler (C) in a non-volatile component exceeds 50 mass %.
    Type: Application
    Filed: October 22, 2015
    Publication date: December 13, 2018
    Inventors: Makoto FUJIMURA, Takashi IGA
  • Publication number: 20180184525
    Abstract: The present invention enables the manufacture of a small-sized high-density multi-layer printed circuit board. The manufacturing method for a multi-layer printed circuit board, according to the present invention, comprises: a step in which an electrical insulation layer is formed by heating a laminate comprising a substrate, a heat-curable resin composition layer provided on the substrate, and a release substrate provided on the heat-curable resin composition layer, thereby curing the heat-curable resin composition layer, and a step in which a via hole is formed in the electrical insulation layer by irradiating a laser from above the release substrate. In addition, in the present invention, the release substrate has a thickness of at least 80 ?m and is formed using a material having a glass transition temperature, the heat-curable resin composition layer has a volatile component-content of 7.
    Type: Application
    Filed: November 26, 2015
    Publication date: June 28, 2018
    Inventors: Makoto FUJIMURA, Takashi IGA, Akihiro TANABE
  • Publication number: 20180117891
    Abstract: The purpose of the present invention is to provide a curable resin composition capable of forming a cured object having excellent adhesiveness to conductor layers. The curable resin composition according to the present invention composes an epoxy compound (A), a triazole compound (B), and a tertiary amine compound (C) represented by the following formula (I). In formula (I), R1 and R 2 each independently represent —(R3O)nH (wherein, R3 represents a C2-3 alkylene group and n is an integer of 1-3).
    Type: Application
    Filed: November 30, 2015
    Publication date: May 3, 2018
    Inventors: Makoto FUJIMURA, Takashi IGA
  • Publication number: 20180020551
    Abstract: The purpose of the present invention is to provide a desmear processing method capable of sufficiently removing a smear while preventing the surface of a substrate from being rough. The desmear processing method according to the present invention is a desmear processing method for removing smear from a substrate in which a hole is formed, the desmear processing method comprising a first desmear processing step for dissolving and decomposing a part of the smear, and a second desmear processing step for performing ultrasonic treatment on the substrate after the first desmear processing step. Further, in the second desmear processing step, at least one of: changing the frequency of the ultrasonic waves; and moving an oscillation source of the ultrasonic waves and the substrate in two or more directions relatively to each other, is performed during the ultrasonic treating.
    Type: Application
    Filed: November 26, 2015
    Publication date: January 18, 2018
    Inventors: Makoto FUJIMURA, Takashi IGA
  • Publication number: 20170181294
    Abstract: A prepreg provided with a first resin layer and a second resin layer which is formed on this first resin layer, wherein the first resin layer is formed by a first resin composition, the second resin layer is a layer which comprises a resin layer which is formed by a second resin composition which is different from the first resin composition and in which a fiber base material is contained, the second resin layer is provided with a fiber base material-containing layer which contains the fiber base material, an A layer which is positioned at an opposite side of the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and a B layer which is positioned at the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and said B layer has a thickness which is smaller than the thickness of the first resin layer, is provided.
    Type: Application
    Filed: March 8, 2017
    Publication date: June 22, 2017
    Applicant: ZEON CORPORATION
    Inventors: Yuuki HAYASHI, Takashi IGA
  • Patent number: 9629240
    Abstract: A prepreg with a first resin layer and a second resin layer which is formed on this first resin layer, wherein the first resin layer is formed by a first resin composition, the second resin layer includes a resin layer which is formed by a second resin composition which is different from the first resin composition and in which a fiber base material is contained, the second resin layer is provided with a fiber base material-containing layer, an A layer which is positioned at an opposite side of the first resin layer side of the fiber base material-containing layer and does not contain fiber base material, and a B layer which is positioned at the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and said B layer has a thickness smaller than the thickness of the first resin layer.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: April 18, 2017
    Assignee: ZEON CORPORATION
    Inventors: Yuuki Hayashi, Takashi Iga
  • Patent number: 9615465
    Abstract: A method of production of a multilayer circuit board comprising using a curable composition which contains a heat curable resin and curing agent (I) to form an uncured or semicured resin layer on a board (step A), then bringing a curing agent (II) able to substantially to cure the heat curable resin at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin into contact with the surface of the resin layer, then heating the resin layer at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin and the curing agent (II) can substantially cure the heat curable resin (step B), next heating and curing the resin layer at a temperature at which the curing agent (I) can substantially cure the heat curable resin to form an electrical insulating layer (step C).
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: April 4, 2017
    Assignee: ZEON CORPORATION
    Inventors: Yohei Tateishi, Takashi Iga
  • Patent number: 9596746
    Abstract: Provided are a charged particle beam generation apparatus, a charged particle beam irradiation apparatus, a particle beam therapy system, and a charged particle beam generation apparatus operating method capable of implementing injection of a charged particle beam into a circular accelerator at an arbitrary timing by setting a normal operation period of a linear accelerator to be larger than a shortest period and securing a stability of the beam. In timing control of controlling injecting, accelerating, emitting, and decelerating processes of a synchrotron (200), after an end of the emitting process, a linear accelerator (111) is allowed to stop repetition of an operation based on an after-end-of-emitting-process timing signal to be in a stand-by state and is allowed to be start the repetition of the operation in a constant period based on a master signal.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: March 14, 2017
    Assignee: Hitachi, Ltd.
    Inventors: Kazunori Tsubuku, Masumi Umezawa, Takashi Iga, Kouji Tobinaga
  • Publication number: 20160150630
    Abstract: Provided are a charged particle beam generation apparatus, a charged particle beam irradiation apparatus, a particle beam therapy system, and a charged particle beam generation apparatus operating method capable of implementing injection of a charged particle beam into a circular accelerator at an arbitrary timing by setting a normal operation period of a linear accelerator to be larger than a shortest period and securing a stability of the beam. In timing control of controlling injecting, accelerating, emitting, and decelerating processes of a synchrotron 200, after an end of the emitting process, a linear accelerator 111 is allowed to stop repetition of an operation based on an after-end-of-emitting-process timing signal to be in a stand-by state and is allowed to be start the repetition of the operation in a constant period based on a master signal.
    Type: Application
    Filed: October 29, 2015
    Publication date: May 26, 2016
    Inventors: Kazunori TSUBUKU, Masumi UMEZAWA, Takashi IGA, Kouji TOBINAGA