Patents by Inventor Takashi Ikari

Takashi Ikari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of soldering lead-free solder, and joined object soldered by the soldering method
    Publication number: 20040144829
    Abstract: There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.
    Type: Application
    Filed: January 20, 2004
    Publication date: July 29, 2004
    Inventors: Kazumi Matsushige, Toshihisa Horiuchi, Takashi Ikari, Kenichiro Suetsugu, Masato Hirano, Shunji Hibino, Atsushi Yamaguchi
  • Method of soldering using lead-free solder and bonded article prepared through soldering by the method
    Patent number: 6702175
    Abstract: There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: March 9, 2004
    Assignees: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazumi Matsushige, Toshihisa Horiuchi, Takashi Ikari, Kenichiro Suetsugu, Masato Hirano, Shunji Hibino, Atsushi Yamaguchi
  • Ophthalmic preparations
    Patent number: 6232343
    Abstract: An ophthalmic preparation which exhibits excellent pharmacological effects for various ophthalmic diseases is disclosed. The ophthalmic preparation according to the present invention contains a 4,8-inter-m-phenylene prostaglandin I2 derivative represented by the formula (I): or a pharmaceutically acceptable salt thereof as an effective ingredient.
    Type: Grant
    Filed: March 9, 1998
    Date of Patent: May 15, 2001
    Assignee: Toray Industries, Inc.
    Inventors: Takashi Ikari, Yuzuru Matsumura, Tsutomu Nakamura, Motoyuki Yajima, Hajimu Kurumatani, Ayako Kawashima, Masafumi Isogaya, Hisanori Wakita
  • Anti-inflammatory ophthalmic solution and process for preparing the same
    Patent number: 4474811
    Abstract: An anti-inflammatory ophthalmic solution containing (A) 2-(2-fluoro-4-biphenylyl)propionic acid or its ophthalmologically acceptable salt and (B) .beta.-cyclodextrin or .gamma.-cyclodextrin. The ophthalmic solution makes easy operations conducted for diseases in ophthalmic region, and is useful for early recovery or reduction of inflammation by pre- and post-operative topical instillation thereof or by intraocular perfusion with a perfusate to which the ophthalmic solution is added, or for treatment of inflammatory eye diseases.
    Type: Grant
    Filed: August 24, 1982
    Date of Patent: October 2, 1984
    Assignee: Kakenyaku Kako Co., Ltd.
    Inventors: Kiyoshi Masuda, Takashi Ikari, Takashi Matsuyama, Akio Terashima, Takao Goto