Patents by Inventor Takashi Ishide

Takashi Ishide has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10792759
    Abstract: Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: October 6, 2020
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki Goya, Masato Kinouchi, Atsushi Takita, Minoru Danno, Toshiya Watanabe, Takashi Ishide
  • Patent number: 10442032
    Abstract: Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: October 15, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki Goya, Kenji Muta, Toshiya Watanabe, Takashi Ishide
  • Patent number: 9862055
    Abstract: A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: January 9, 2018
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki Goya, Masato Kinouchi, Minoru Danno, Toshiya Watanabe, Takashi Ishide, Tsugumaru Yamashita, Yoshihito Fujita, Makoto Yamasaki, Ryu Suzuki, Kohei Kanaoka
  • Patent number: 9757816
    Abstract: Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head (16) and a controller; and the irradiation head (16) can be divided into a collimate optical system, a laser revolving unit (35), and a light collection optical system (37). The laser revolving unit (35) has a first prism (51), a second prism (52), a first rotation mechanism (53), and a second rotation mechanism (54). The controller controls the rotational speeds and the difference in phase angles of the first prism (51) and the second prism (52), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: September 12, 2017
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Yoshihito Fujita, Tsugumaru Yamashita, Saneyuki Goya, Makoto Yamasaki, Ryu Suzuki, Kohei Kanaoka, Takashi Ishide, Toshiya Watanabe
  • Publication number: 20170182590
    Abstract: Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.
    Type: Application
    Filed: January 26, 2015
    Publication date: June 29, 2017
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki GOYA, Kenji MUTA, Toshiya WATANABE, Takashi ISHIDE
  • Publication number: 20160193693
    Abstract: Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.
    Type: Application
    Filed: January 26, 2015
    Publication date: July 7, 2016
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki GOYA, Masato KINOUCHI, Atsushi TAKITA, Minoru DANNO, Toshiya WATANABE, Takashi ISHIDE
  • Publication number: 20160008920
    Abstract: A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.
    Type: Application
    Filed: November 22, 2013
    Publication date: January 14, 2016
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki GOYA, Masato KINOUCHI, Minoru DANNO, Toshiya WATANABE, Takashi ISHIDE, Tsugumaru YAMASHITA, Yoshihito FUJITA, Makoto YAMASAKI, Ryu SUZUKI, Kohei KANAOKA
  • Publication number: 20150352666
    Abstract: Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head (16) and a controller; and the irradiation head (16) can be divided into a collimate optical system, a laser revolving unit (35), and a light collection optical system (37). The laser revolving unit (35) has a first prism (51), a second prism (52), a first rotation mechanism (53), and a second rotation mechanism (54). The controller controls the rotational speeds and the difference in phase angles of the first prism (51) and the second prism (52), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.
    Type: Application
    Filed: November 22, 2013
    Publication date: December 10, 2015
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Yoshihito FUJITA, Tsugumaru YAMASHITA, Saneyuki GOYA, Makoto YAMASAKI, Ryu SUZUKI, Kohei KANAOKA, Takashi ISHIDE, Toshiya WATANABE
  • Patent number: 8835253
    Abstract: Provided is a photoelectric conversion device fabrication method in which current leakage from an intermediate contact layer via an intermediate-contact-layer separating groove is prevented as much as possible. Included are a step of film-forming a top layer having amorphous silicon as a main component; a step of film-forming, on the top layer, an intermediate contact layer electrically and optically connected thereto; a step of separating the intermediate contact layer by removing the intermediate contact layer by irradiating it with a pulsed laser, forming an intermediate-contact-layer separating groove that reaches the top layer; and a step of film-forming, on the intermediate contact layer and inside the intermediate-contact-layer separating groove, a bottom layer electrically and optically connected thereto and having microcrystalline silicon as a main component. A pulsed laser having a pulse width of 10 ps to 750 ps, inclusive, is used as the pulsed laser for separating the intermediate contact layer.
    Type: Grant
    Filed: October 2, 2009
    Date of Patent: September 16, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Tatsuyuki Nishimiya, Kazutaka Uda, Kohei Kawazoe, Tomoyoshi Baba, Takashi Ishide
  • Patent number: 8692153
    Abstract: Provided is a method for manufacturing a photoelectric-conversion-device capable of controlling the groove depth of a processed groove to a desired value. The method for manufacturing a photoelectric conversion device (10) includes a groove forming step of irradiating an intermediate-contact-layer separating groove (15) constituting a photoelectric conversion device (10) with a picosecond laser and of moving the picosecond laser relative to the intermediate-contact-layer separating groove (93), thereby forming a processed groove (15) in a predetermined scanning direction. In the groove forming step, interference fringes arranged in parallel in one direction are formed in an irradiated area corresponding to a beam diameter of the picosecond laser, and the picosecond laser is relatively moved such that the interference fringes are joined in the scanning direction.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: April 8, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Kohei Kawazoe, Kazutaka Uda, Tomoyoshi Baba, Takashi Ishide, Sachiko Nakao
  • Patent number: 8362389
    Abstract: Aims are to provide a tubular-body residual-stress improving apparatus and an adjustment method thereof capable of adjusting irradiation position with favorable reproducibility, even when an optical fiber is eccentric. In the tubular-body residual-stress improving apparatus, an optical control unit (5) includes a rotational hold mechanism (9) for holding an optical fiber (6) in a manner that the optical fiber (6) is rotatable in a circumferential direction of the optical fiber (6), and, if a position of an intensity peak of the laser beam from the optical fiber (6) in an axial direction of the tubular body (2) is offset from the center of an irradiation profile, a position at which the optical fiber (6) is held in the circumferential direction is adjusted by the rotational hold mechanism (9) so as to eliminate the offset or to minimize an influence of the offset.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: January 29, 2013
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Shuho Tsubota, Takashi Ishide, Takashi Akaba, Hironori Onitsuka, Kenichi Kawanishi
  • Patent number: 8362393
    Abstract: An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When an outer-circumferential surface of a welded portion of a cylindrical tubular body (2) is irradiated with a laser beam that circles around an outer circumference of the tubular body (2), a heating width W in a circumferential direction heated by the laser-beam irradiation and a laser-beam moving speed V in the circumferential direction are set so that a stress in the circumferential direction in an inner surface of the tubular body (2) produced by the heating with the laser beam is at least larger than a yielding stress of a material that the tubular body (2) is made of.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: January 29, 2013
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takahiro Ota, Shuho Tsubota, Takashi Ishide, Kazuhiko Kamo, Noriaki Sugimoto, Yoshiyuki Hemmi, Hironori Onitsuka, Takashi Akaba
  • Patent number: 8044323
    Abstract: A weld zone of T-piping and its neighborhood are efficiently laser-heated to remove residual stress. For this purpose, the weld zone of a T-piping (50) is irradiated and heated with a laser beam emitted from a laser head (10) to remove residual stress. At this time, a rotating travel cart (3) travels along a ring rail (2) to adjust the position of the laser head (10) in a ?-direction, a vertical slide (4) slides to adjust the position of the laser head (10) in a Z-direction, a radial slide (5) slides to adjust the position of the laser head (10) in an L-direction, an arcuate piece slide (7) slides along an arcuate piece to adjust the ?-direction of the laser head (10), a laser head support portion (9) turns to adjust the ?-direction of the laser head (10), and oscillation adjusts the position of the laser head (10) in a ?-direction.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: October 25, 2011
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takashi Akaba, Shuho Tsubota, Kenji Nishikawa, Noriaki Sugimoto, Shoji Kushimoto, Takashi Ishide, Takahiro Ohta
  • Publication number: 20110226748
    Abstract: Provided is a method for manufacturing a photoelectric-conversion-device capable of controlling the groove depth of a processed groove to a desired value. The method for manufacturing a photoelectric conversion device (10) includes a groove forming step of irradiating an intermediate-contact-layer separating groove (15) constituting a photoelectric conversion device (10) with a picosecond laser and of moving the picosecond laser relative to the intermediate-contact-layer separating groove (93), thereby forming a processed groove (15) in a predetermined scanning direction. In the groove forming step, interference fringes arranged in parallel in one direction are formed in an irradiated area corresponding to a beam diameter of the picosecond laser, and the picosecond laser is relatively moved such that the interference fringes are joined in the scanning direction.
    Type: Application
    Filed: August 25, 2009
    Publication date: September 22, 2011
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Kohei Kawazoe, Kazutaka Uda, Tomoyoshi Baba, Takashi Ishide, Sachiko Nakao
  • Publication number: 20110126895
    Abstract: Provided is a method for fabricating a photoelectric conversion device in which current is prevented as much as possible from leaking via an intermediate contact layer separating groove. The method includes: a process of forming a top layer mainly containing amorphous silicon; a process of forming on the top layer an intermediate contact layer electrically and optically connected to the top layer; a process of removing the intermediate contact layer through irradiation with a pulsed laser and forming an intermediate contact layer separating groove that reaches the top layer to separate the intermediate contact layer; and a process of forming, on the intermediate contact layer and in the intermediate contact layer separating groove, a bottom layer that mainly contains microcrystalline silicon and that is electrically and optically connected to the intermediate contact layer. The intermediate contact layer separating groove is terminated in an i-layer of the top layer.
    Type: Application
    Filed: October 2, 2009
    Publication date: June 2, 2011
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Kazutaka Uda, Tomoyoshi Baba, Takashi Ishide, Kohei Kawazoe, Tatsuyuki Nishimiya
  • Publication number: 20110126894
    Abstract: Provided is a photoelectric conversion device fabrication method in which current leakage from an intermediate contact layer via an intermediate-contact-layer separating groove is prevented as much as possible. Included are a step of film-forming a top layer having amorphous silicon as a main component; a step of film-forming, on the top layer, an intermediate contact layer electrically and optically connected thereto; a step of separating the intermediate contact layer by removing the intermediate contact layer by irradiating it with a pulsed laser, forming an intermediate-contact-layer separating groove that reaches the top layer; and a step of film-forming, on the intermediate contact layer and inside the intermediate-contact-layer separating groove, a bottom layer electrically and optically connected thereto and having microcrystalline silicon as a main component. A pulsed laser having a pulse width of 10 ps to 750 ps, inclusive, is used as the pulsed laser for separating the intermediate contact layer.
    Type: Application
    Filed: October 2, 2009
    Publication date: June 2, 2011
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Tatsuyuki Nishimiya, Kazutaka Uda, Kohei Kawazoe, Tomoyoshi Baba, Takashi Ishide
  • Publication number: 20100122972
    Abstract: Aims are to provide a tubular-body residual-stress improving apparatus and an adjustment method thereof capable of adjusting irradiation position with favorable reproducibility, even when an optical fiber is eccentric. In the tubular-body residual-stress improving apparatus, an optical control unit (5) includes a rotational hold mechanism (9) for holding an optical fiber (6) in a manner that the optical fiber (6) is rotatable in a circumferential direction of the optical fiber (6), and, if a position of an intensity peak of the laser beam from the optical fiber (6) in an axial direction of the tubular body (2) is offset from the center of an irradiation profile, a position at which the optical fiber (6) is held in the circumferential direction is adjusted by the rotational hold mechanism (9) so as to eliminate the offset or to minimize an influence of the offset.
    Type: Application
    Filed: May 30, 2008
    Publication date: May 20, 2010
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Shuho Tsubota, Takashi Ishide, Takashi Akaba, Hironori Onitsuka, Kenichi Kawanishi
  • Publication number: 20100108653
    Abstract: An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When an outer-circumferential surface of a welded portion of a cylindrical tubular body (2) is irradiated with a laser beam that circles around an outer circumference of the tubular body (2), a heating width W in a circumferential direction heated by the laser-beam irradiation and a laser-beam moving speed V in the circumferential direction are set so that a stress in the circumferential direction in an inner surface of the tubular body (2) produced by the heating with the laser beam is at least larger than a yielding stress of a material that the tubular body (2) is made of.
    Type: Application
    Filed: April 20, 2008
    Publication date: May 6, 2010
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Takahiro Ota, Shuho Tsubota, Takashi Ishide, Kazuhiko Kamo, Noriaki Sugimoto, Yoshiyuki Hemmi, Hironori Onitsuka, Takashi Akaba
  • Publication number: 20100059491
    Abstract: An aim is to provide a tubular-body residual-stress improving apparatus capable of reducing irradiation on unnecessary areas by controlling the optical paths of laser beams. In the tubular-body residual-stress improving apparatus, an optical control unit (5C) includes one pair of mirrors (21, 22) being disposed at a final stage of an optical system for a plurality of laser beams (P1-Pn) to be sharable and disposed in such a way that the mirrors are placed respectively at both sides, in the circumferential direction of the tubular body (2), of a final optical path of the laser beams to the tubular body (2), and another pair of mirrors (23, 24) being disposed at final stage of the optical system for the laser beams at both ends and disposed in such a way that the mirrors are placed respectively at both sides, in an axial direction of the tubular body (2), of final optical paths of the laser beams at both ends to the tubular body (2).
    Type: Application
    Filed: March 26, 2008
    Publication date: March 11, 2010
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Shuho Tsubota, Takashi Ishide, Takashi Akaba, Hironori Onitsuka
  • Patent number: 7485828
    Abstract: A residual stress improving apparatus for piping, which can heat an outer peripheral surface of piping to reduce (including eliminate) the residual stress of the piping is provided. The apparatus has a laser head portion, and circumferential direction moving mechanism composed of a ring rail and a rotational travel bogie. Further, the apparatus may adjust the reflection direction of laser light so that the laser light reflected by the outer peripheral surface of the piping does not return to the laser head, and adjust the delivery direction of the laser light so that the outer peripheral surface of the bending pipe portion located forwardly, in the pipe axis direction, of the laser head is irradiated with the laser light.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: February 3, 2009
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takashi Akaba, Shuho Tsubota, Kenji Nishikawa, Noriaki Sugimoto, Shoji Kushimoto, Takashi Ishide, Takahiro Ohta