Abstract: According to an embodiment, a battery includes an outer container, a lid member, an electrode group, a current collecting tab, an electrode terminal, a clip plate, and a lead. The lead is joined with the current collecting tab with the clip plate attached to the current collecting tab intervening therebetween, and electrically connects the current collecting tab and the electrode terminal. The clip plate includes a pair of plate parts clipping the current collecting tab therebetween and a folded part. The folded part is adjacent to the current collecting tab from one side in a lateral direction intersecting a height direction, and folds the pair of plate parts with respect to each other.

Abstract: According to an embodiment, a battery includes an exterior container, a lid member, a plurality of electrode groups, a first lead, a second lead, and an electrode terminal. The lid member closes an opening of an inner cavity of the exterior container, and the plurality of electrode groups are stored in the inner cavity. A first current collecting tab protruding toward the lid member in a first electrode is joined with the first lead, and a second current collecting tab protruding toward the lid member in the second electrode different from the first electrode is joined with the second lead separate from the first lead. The first and second leads are together connected to the electrode terminal exposed on an outer surface of the lid member.

Abstract: A sound signal processor and a control method therefor that enable appropriate processing to be applied to each sound signal and the sound signals to be outputted to an appropriate output destination, while avoiding equipment connection complexity. A first processing unit performs first processing on a first sound signal to generate a second sound signal, and outputs the second sound signal to a mix bus, a second processing unit performs second processing on a third sound signal to generate a fourth sound signal, and outputs the fourth sound signal to the mix bus and a first output destination, and the mix bus mixes the second sound signal with the fourth sound signal to generate a fifth sound signal, and outputs the fifth sound signal to a second output destination.

Abstract: Provided is a dusting flour composition which is useful for improving the adhesion between a food ingredient and batter and maintaining the texture of the coating of fried food products after cooking. The dusting flour composition contains 5 mass % or more of a modified wheat flour, in which a viscosity of a 10 mass % aqueous suspension of the modified wheat flour is 1,000 mPa·s or less when the aqueous suspension is warmed to 85° C. and then cooled to 25° C., and the dispersibility of the aqueous suspension is 90% or less when the aqueous suspension is warmed to 85° C., then cooled to 25° C., and subsequently allowed to stand for 24 hours.

Abstract: A water electrolysis catalyst containing a solid solution complex oxide of Ir and Ru, in which the solid solution complex oxide is represented by a chemical formula IrxRuyO2 (where x and y satisfy x+y=1.0); and the solid solution complex oxide has one diffraction maximum peak in a range of 2?=66.10° or more and 67.00° or less in powder X-ray diffraction (Cu K?).

Abstract: The food coating composition of the invention contains a cocoa powder having an L* of 35 or less and a powdery dispersion medium, wherein the cocoa powder is dispersed in the powdery dispersion medium. The content of the cocoa powder is preferably 0.1 to 10 mass %. The processed food of the present invention has a cocoa powder having an L* of 35 or less attached to its surface. The method for producing a processed food of the invention includes applying the food coating composition to a food substrate to form a coated food substrate and allowing the coated food substrate to cook. Allowing the coated food substrate to cook may be by at least one of frying, oven cooking, and steaming.

Abstract: An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.

Abstract: A thermal transfer printer includes a first supply unit configured to supply an intermediate transfer medium in which, on one surface of a first base, a transfer layer including a receiving layer is disposed, a second supply unit configured to supply a thermal transfer sheet in which, on one of surfaces of a second base, a colorant layer and a particle layer are disposed, a printing unit configured to heat the thermal transfer sheet, to transfer a colorant from the colorant layer to the receiving layer to form an image, and to transfer the particle layer onto the receiving layer, a third supply unit configured to supply a transfer-receiving body, and a transfer unit configured to place the intermediate transfer medium and the transfer-receiving body on top of each other such that the transfer-receiving body faces the particle layer on the receiving layer, and to heat the intermediate transfer medium.

Abstract: A semiconductor device includes a substrate, an adhesive layer formed on a lower surface of the substrate, a semiconductor element adhered to a lower surface of the adhesive layer, a through hole extending through the substrate and the adhesive layer and exposing a first electrode arranged on an upper surface of the semiconductor element, a via wiring formed in the through hole, a wiring layer formed on an upper surface of the substrate and electrically connected to the first electrode through the via wiring, and a protective insulation layer formed on the lower surface of the adhesive layer. The protective insulation layer covers an entirety of all side surfaces of the semiconductor element and a peripheral part of a lower surface of the semiconductor element and exposes a central part of the lower surface of the semiconductor element.

Abstract: A modified wheat flour may have good handlability in cooking and provide high-quality food products containing wheat flour. A viscosity of a 10 mass % aqueous suspension of such modified wheat flour is 1,000 mPa·s or less when the aqueous suspension is warmed to 85° C. and then cooled to 25° C., and the dispersibility of the aqueous suspension is 90% or less when the aqueous suspension is warmed to 85° C., then cooled to 25° C., and subsequently allowed to stand for 24 hours.

Abstract: A batter for fried food products which can produce fried food products which have a coating having a crispy texture with good meltability in the mouth. The batter for fried food products includes 1 mass % or more of a modified wheat flour and a viscosity of a 10 mass % aqueous suspension of the modified wheat flour is 1,000 mPa·s or less when the aqueous suspension is warmed to 85° C. and then cooled to 25° C., and the dispersibility of the aqueous suspension is 90% or less when the aqueous suspension is warmed to 85° C., then cooled to 25° C., and subsequently allowed to stand for 24 hours.

Abstract: A concentration device for concentrating a liquid containing a target object, the concentration device including: a container configured to store the liquid containing the target object; a filter in the container; and a position control portion configured to change a position of the filter in the container.

Abstract: Water-absorbent resin particles 10a, in which a gel flow rate measured by the following procedures having (1) to (3) is 10 to 70 g/min: (1) mixing 1 part by mass of the water-absorbent resin particles and 199 parts by mass of water to obtain a gel, (2) accommodating the gel in a funnel in a state where a circular lower end opening with a diameter of 8 mm in the funnel is closed, and (3) measuring an outflow amount of the gel per unit time after a lapse of 3 minutes from opening of the lower end opening as the gel flow rate.

Abstract: Water-absorbent resin particles 10a, in which a rate of an amount of change in a water retention amount of physiological saline when irradiation with an ultraviolet ray is performed for 3 hours with respect to a water retention amount of physiological saline before irradiation with an ultraviolet ray is more than 0% and 30% or less.

Abstract: An absorber 10 containing water-absorbent resin particles 10a, in which a rate of an amount of change in a water retention amount of physiological saline of the water-absorbent resin particles 10a when the water-absorbent resin particles 10a are irradiated with an ultraviolet ray for 3 hours with respect to a water retention amount of the water-absorbent resin particles 10a of physiological saline before irradiation with an ultraviolet ray is more than 0% and 30% or less.

Abstract: An audio processing apparatus includes a first input port, a second input port, a first processor that processes an audio signal input to the first input port and that includes a first adjuster which adjusts acoustic characteristics of the audio signal, a second processor that processes an audio signal input to the second input port, and output ports having a first particular output port. In a first operation mode, the first adjuster is set in an effective state and each of an audio signal as processed by the first processor and an audio signal as processed by the second processor is output from one or more of the output ports. In a second operation mode, the first adjuster is set in an ineffective state and an audio signal as processed by the first processor is output from the first particular output port.

Abstract: An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.

Abstract: An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.

Abstract: An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.

Abstract: Provided are a fried food having a favorable appearance and an improved coating texture, and a batter for producing the same. The batter for fried foods contains a flaky starch lump. The starch lump contains a pregelatinized starch, and the flaky starch lump has a thickness of 100 ?m to 1000 ?m.