Abstract: A nonreciprocal circuit device includes a ferrite-magnet element having ferrite provided with first and second central electrodes intersecting each other in an insulated manner and two permanent magnets arranged to sandwich the ferrite to apply a DC magnetic field thereto, a substrate on which the ferrite-magnet element and matching circuit elements are mounted, and a flat plate yoke. A first resin layer made of a cured liquid resin is provided at bonding portions of the ferrite-magnet element to the substrate, and a second resin layer made of a cured soft sheet-shaped resin adhered to a rear surface of the flat plate yoke is provided around the ferrite-magnet element and the matching circuit elements.

Abstract: A nonreciprocal circuit device includes a ferrite-magnet element having ferrite provided with first and second central electrodes intersecting each other in an insulated manner and two permanent magnets arranged to sandwich the ferrite to apply a DC magnetic field thereto, a substrate on which the ferrite-magnet element and matching circuit elements are mounted, and a flat plate yoke. A first resin layer made of a cured liquid resin is provided at bonding portions of the ferrite-magnet element to the substrate, and a second resin layer made of a cured soft sheet-shaped resin adhered to a rear surface of the flat plate yoke is provided around the ferrite-magnet element and the matching circuit elements.

Abstract: A nonreciprocal circuit device, in which metal members which form a metal case can be resistance-welded stably and reliably, having high reliability and satisfactory characteristics, a communication device using the nonreciprocal circuit device, and a method of manufacturing the nonreciprocal circuit device. Protruding portions are formed at two places on each side wall of an upper metal case. The upper metal case and a lower metal case are bonded together by resistance welding the two side walls of the lower metal case to the two side walls of the upper metal case at the protruding portions.

Abstract: A nonreciprocal circuit device, in which metal members which form a metal case can be resistance-welded stably and reliably, having high reliability and satisfactory characteristics, a communication device using the nonreciprocal circuit device, and a method of manufacturing the nonreciprocal circuit device. Protruding portions are formed at two places on each side wall of an upper metal case. The upper metal case and a lower metal case are bonded together by resistance welding the two side walls of the lower metal case to the two side walls of the upper metal case at the protruding portions.

Abstract: A nonreciprocal circuit device, in which metal members which form a metal case can be resistance-welded stably and reliably, having high reliability and satisfactory characteristics, a communication device using the nonreciprocal circuit device, and a method of manufacturing the nonreciprocal circuit device. Protruding portions are formed at two places on each side wall of an upper metal case. The upper metal case and a lower metal case are bonded together by resistance welding the two side walls of the lower metal case to the two side walls of the upper metal case at the protruding portions.

Abstract: The method of making a semiconductor body from a semiconductor polymeric compound containing about 20% by weight lampblack having a porous structure, about 60% by weight of low density polyethylene, about 8.5% by weight ethylene vinyl acetate copolymer, about 4.0% by weight calcium stearate, about 3.0% by weight antioxidant and about 0.5% by weight calcium titanate includes the steps of extruding the semiconductor polymeric compound to form an extruded product and subsequently calendering the extruded product to produce a semiconductor body having an electrical conductivity which is as uniform as possible throughout the entire bulk of the semiconductor body.