Patents by Inventor Takashi Kajino
Takashi Kajino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8339237Abstract: A multilayer PTC thermistor 100 includes a ceramic body 10 having a plurality of ceramic layers 12 and internal electrodes 14 between adjacent ceramic layers 12, external electrodes 30 on the end faces 10a, 10b of the ceramic body 10, and a glass layer 20 on the surfaces 10c, 10d of the ceramic body 10, the glass layer 20 containing an oxide of at least one element selected from the group consisting of zinc and bismuth as the major component, wherein the alkali oxide content of the glass layer is no greater than 0.8 mass %.Type: GrantFiled: August 30, 2011Date of Patent: December 25, 2012Assignee: TDK CorporationInventors: Takashi Kajino, Kazuhiko Itoh, Teiichi Tanaka, Atsushi Hitomi, Takashi Ota
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Publication number: 20120056709Abstract: A multilayer PTC thermistor 100 includes a ceramic body 10 having a plurality of ceramic layers 12 and internal electrodes 14 between adjacent ceramic layers 12, external electrodes 30 on the end faces 10a, 10b of the ceramic body 10, and a glass layer 20 on the surfaces 10c, 10d of the ceramic body 10, the glass layer 20 containing an oxide of at least one element selected from the group consisting of zinc and bismuth as the major component, wherein the alkali oxide content of the glass layer is no greater than 0.8 mass %.Type: ApplicationFiled: August 30, 2011Publication date: March 8, 2012Applicant: TDK CORPORATIONInventors: Takashi KAJINO, Kazuhiko ITOH, Teiichi TANAKA, Atsushi HITOMI, Takashi OTA
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Patent number: 8009012Abstract: Provided are a stacked electronic part that can sufficiently suppress plating deposition on the surface of a porous green body when a terminal electrode is formed on an external electrode, thereby enabling a decrease in the reliability of products to be prevented, and a method of manufacturing the stacked electronic part. The stacked electronic part 1 is a PTC thermistor having a stacked body 4 containing a porous green body 2 made of ceramics and having a plurality of vacancies and a plurality of internal electrodes 3 formed within the porous green body 2, and is provided with at least one unit structure 10 in which the porous green body 2 and the internal electrode 3 are stacked. External electrodes 5, 5 are connected to the internal electrode 2, and upon the external electrodes 5, 5 are formed terminal electrodes 7, 7 by plating. Resin is filled in the plurality of vacancies of the porous green body 2 at a filling ratio of not less than 60%.Type: GrantFiled: July 23, 2008Date of Patent: August 30, 2011Assignee: TDK CorporationInventors: Takashi Kajino, Hisayuki Abe, Akira Kakinuma, Kazuhiko Itoh
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Publication number: 20090027158Abstract: Provided are a stacked electronic part that can sufficiently suppress plating deposition on the surface of a porous green body when a terminal electrode is formed on an external electrode, thereby enabling a decrease in the reliability of products to be prevented, and a method of manufacturing the stacked electronic part. The stacked electronic part 1 is a PTC thermistor having a stacked body 4 containing a porous green body 2 made of ceramics and having a plurality of vacancies and a plurality of internal electrodes 3 formed within the porous green body 2, and is provided with at least one unit structure 10 in which the porous green body 2 and the internal electrode 3 are stacked. External electrodes 5, 5 are connected to the internal electrode 2, and upon the external electrodes 5, 5 are formed terminal electrodes 7, 7 by plating. Resin is filled in the plurality of vacancies of the porous green body 2 at a filling ratio of not less than 60%.Type: ApplicationFiled: July 23, 2008Publication date: January 29, 2009Applicant: TDK CORPORATIONInventors: Takashi Kajino, Hisayuki Abe, Akira Kakinuma, Kazuhiko Itoh
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Patent number: 7289010Abstract: There is provided a Mn—Zn based ferrite member excellent in mass productivity, high in withstand voltage, low in loss and excellent in direct current superposition property. The Mn—Zn based ferrite member is provided with a surface layer portion having the properties that ?5 defined in the specification satisfies the relation that ?5?103 ?m and ?50 defined in the specification satisfies the relation that ?50?102 ?m.Type: GrantFiled: April 21, 2005Date of Patent: October 30, 2007Assignee: TDK CorporationInventors: Takashi Kajino, Kenya Takagawa, Taku Murase, Takuya Aoki
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Patent number: 7167071Abstract: A core material-including organic core board or inorganic sintered board 1 having a plurality of band-shaped conductor patterns 2 formed on its front and rear surfaces is sliced in a direction crossing the band-shaped conductor patterns 2. End portions of the band-shaped conductor patterns 2 exposed on each of cut surfaces of the core board 1 are connected to one another by bridging conductor patterns formed on the cut surfaces. In this manner, at least one helical coil is provided. The inner diameter of the helical coil can be kept constant while coil pitch accuracy can be kept good.Type: GrantFiled: March 15, 2004Date of Patent: January 23, 2007Assignee: TDK CorporationInventors: Minoru Takaya, Takashi Kajino, Hisashi Kobuke, Masami Sasaki, Kazuhiko Itoh, Toshikazu Endo
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Publication number: 20060180342Abstract: In a multilayered substrate obtained by laminating a plurality of substrates and including plural kinds of functional elements therein, a first functional material film and a second functional material film are provided on the same plane and first and second functional elements are formed by the first and second functional material films, respectively. The functional material film may be formed on a transferring substrate by a thin film method and may be transferred to the substrate.Type: ApplicationFiled: March 26, 2004Publication date: August 17, 2006Inventors: Minoru Takaya, Toshikazu Endo, Hisashi Kobuke, Masami Sasaki, Takashi Kajino, Katsuyoshi Goto
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Publication number: 20050238904Abstract: There is provided a Mn—Zn based ferrite member excellent in mass productivity, high in withstand voltage, low in loss and excellent in direct current superposition property. The Mn—Zn based ferrite member is provided with a surface layer portion having the properties that ?5 defined in the specification satisfies the relation that ?5?103 ?m and ?50 defined in the specification satisfies the relation that ?50?102 ?m.Type: ApplicationFiled: April 21, 2005Publication date: October 27, 2005Inventors: Takashi Kajino, Kenya Takagawa, Taku Murase, Takuya Aoki
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Publication number: 20050151613Abstract: A core material-including organic core board or inorganic sintered board 1 having a plurality of band-shaped conductor patterns 2 formed on its front and rear surfaces is sliced in a direction crossing the band-shaped conductor patterns 2. End portions of the band-shaped conductor patterns 2 exposed on each of cut surfaces of the core board 1 are connected to one another by bridging conductor patterns formed on the cut surfaces. In this manner, at least one helical coil is provided. The inner diameter of the helical coil can be kept constant while coil pitch accuracy can be kept good.Type: ApplicationFiled: March 15, 2004Publication date: July 14, 2005Applicant: TDK CORPORATIONInventors: Minoru Takaya, Takashi Kajino, Hisashi Kobuke, Masami Sasaki, Kazuhiko Itoh, Toshikazu Endo
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Patent number: 6600404Abstract: A planar coil including and insulating substrate, and a coil conductive filament having a thickness of 20 to 400 &mgr;m and formed on at least one surface of the insulating substrate, the coil conductive filament having a gap whose aspect ratio (H/G) is at least 1. The coil conductive filament has a cross-section in a substantially mushroom shape having a head and a neck, the head has a width (L) which is a least twice as large as a width (l) of the neck thereof, at most 1.5 times as large as a height of the head, and at least twice as large as a minimum spacing (G) between adjacent coil conductive filaments.Type: GrantFiled: January 12, 1999Date of Patent: July 29, 2003Assignee: TDK CorporationInventor: Takashi Kajino
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Patent number: 4908685Abstract: A magnetoelectric transducer comprising a group III-V compound semiconductor thin film 14 of 0.1 .mu.m to 10 .mu.m thickness formed as a magnetic field sensing portion on a substrate 12 overlaying an organic insulating layer 13, and a multilayer wire bonding electrode including an ohmic electrode 16 formed on a required area of the thin film and a hard metal layer 17 and a bonding layer 18 which are laminated on the ohmic electrode.Type: GrantFiled: March 15, 1989Date of Patent: March 13, 1990Assignee: Asahi Kasei Kogyo Kabushiki KaishaInventors: Ichiro Shibasaki, Takashi Kajino