Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.This wire bonder is able to compare and evaluate at least one set of image data of either a first bonding point or second bonding point in the form of bonded sites, or a wire spread between said first and second bonding points, with the positional data into which said image data has been incorporated in advance, and automatically perform inspection and make corrections.

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a bonded indentation is present within a specified range at a location specified in advance and/or centering on said location.

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a ball that has been bonded is present within a specified range at a location specified in advance and/or centering on said location.

Abstract: The present invention provides a wire bonder and its method that is able to automatically inspect whether an initial ball set with a keyboard has been formed.Ball formed on the end of a wire fed from capillary is placed on lead by driving of a bonding head, and the diameter of that ball is measured by photographing that ball by a camera after bonding a portion of the wire to which ball is connected.

Abstract: A semiconductor device inspection system capable of objectively accomplishing visual image inspection of a semiconductor device and minimizing error in the inspection, to thereby effectively carry out the inspection with high accuracy and at high speed. The system includes a low magnification image pickup mechanism which consists of a plurality of low magnification image pickup units each carrying out low magnification image pickup of a semiconductor device to generate an image signal. The system also includes a signal processing system for processing the image signal to judge the correctness of the semiconductor device. In the image pickup units, their light receptors are each arranged in parallel to an inspected surface of the semiconductor device and their central axes intersect together on the inspected surface.