Abstract: A processing apparatus configured to process a substrate under a vacuum environment includes a holding unit configured to hold the substrate, a dust collection part having a surface opposite to the substrate held by the holding unit, a vacuum chamber configured to accommodate the holding unit and to have an internal space that can be decompressed, a temperature controlling unit configured to control a temperature of the surface of the dust collection part opposite to the substrate to a temperature lower than a temperature of the substrate, and a driving unit configured to bring one of the holding unit and the dust collection part close to the other after the temperature controlling unit controls the temperature of the surface of the dust collection part opposite to the substrate.

Abstract: An exposure apparatus includes a projection optical system configured to project light from an original, wherein the apparatus exposes a substrate to light through liquid filled in a gap between the last surface of the projection optical system and the substrate; and a detecting device configured to detect a droplet adhering to the exposed substrate. The detecting device includes a storage unit configured to prestore first image data corresponding to a surface of the substrate without the liquid and an image-capturing unit configured to capture an image of a surface of the exposed substrate. The detecting device detects the droplet based on a comparison between the first image data and second image data obtained by the image-capturing unit.

Abstract: A method of holding an object with an electrostatic chuck and conveying the held object includes steps of measuring a property of the object concerning an electrostatic attraction force generated between the object and the electrostatic chuck; and controlling a characteristic of conveyance of the object based on a measurement result in the measuring step.

Abstract: An exposure apparatus includes an illumination optical system configured to illuminate a reticle using extreme ultraviolet light, a projection optical system configured to project a pattern of the reticle onto a substrate, a diaphragm that defines a first space that accommodates the projection optical system, a first gas supplier configured to supply a first gas to the first space, and a first cooling unit configured to cool the first gas before the first gas supplier supplies the first gas to the first space.

Abstract: A processing apparatus configured to process a substrate under a vacuum environment includes a holding unit configured to hold the substrate, a dust collection part having a surface opposite to the substrate held by the holding unit, a vacuum chamber configured to accommodate the holding unit and to have an internal space that can be decompressed, a temperature controlling unit configured to control a temperature of the surface of the dust collection part opposite to the substrate to a temperature lower than a temperature of the substrate, and a driving unit configured to bring one of the holding unit and the dust collection part close to the other after the temperature controlling unit controls the temperature of the surface of the dust collection part opposite to the substrate.

Abstract: An exposure apparatus to expose a substrate to light with a space between a projection optical system and the substrate filled with liquid. The apparatus has a stage to hold the substrate and to move, a supply unit to supply the liquid to the space, a recovery unit to recover the liquid from the space, a detector to detect a droplet of the liquid on at least one of the substrate and the stage, a removing unit configured to remove the droplet on the substrate detected by the detector, the removing unit including a slit-shaped nozzle arranged so as to vertically sandwich the substrate and blowing a gas on the substrate from the nozzle, a calculation unit to calculate at least one of a position and size of the droplet detected by the detector, and a controller to control a relative velocity between the nozzle and the substrate based on the calculation result of the calculation unit.

Abstract: An exposure apparatus includes a projection optical system configured to project light from an original, wherein the apparatus exposes a substrate to light through liquid filled in a gap between the last surface of the projection optical system and the substrate; and a detecting device configured to detect a droplet adhering to the exposed substrate. The detecting device includes a storage unit configured to prestore first image data corresponding to a surface of the substrate without the liquid and an image-capturing unit configured to capture an image of a surface of the exposed substrate. The detecting device detects the droplet based on a comparison between the first image data and second image data obtained by the image-capturing unit.

Abstract: An exposure apparatus includes an illumination optical system configured to illuminate a reticle using extreme ultraviolet light, a projection optical system configured to project a pattern of the reticle onto a substrate, a diaphragm that defines a first space that accommodates the projection optical system, a first gas supplier configured to supply a first gas to the first space, and a first cooling unit configured to cool the first gas before the first gas supplier supplies the first gas to the first space.

Abstract: An exposure apparatus includes a vacuum chamber, a load-lock chamber disposed between the vacuum chamber and outside the exposure apparatus, a reticle cassette configured to hold a reticle, a conveying unit configured to convey the reticle cassette between the vacuum chamber and the load-lock chamber, and an opening and closing unit configured to open and close the reticle cassette. The opening and closing unit is disposed within the vacuum chamber.

Abstract: An exposure apparatus includes a vacuum chamber, a load-lock chamber disposed between the vacuum chamber and outside the exposure apparatus, a reticle cassette configured to hold a reticle, a conveying unit configured to convey the reticle cassette between the vacuum chamber and the load-lock chamber, and an opening and closing unit configured to open and close the reticle cassette. The opening and closing unit is disposed within the vacuum chamber.

Abstract: An exposure apparatus, comprises a projection optical system configured to project light from a reticle onto a substrate, wherein the apparatus is configured to expose the substrate to light with a space between the projection optical system and the substrate filled with liquid; a stage configured to hold the substrate and to move; a supply unit configured to supply the liquid to the space; a recovery unit configured to recover the liquid from the space; and a detector configured to detect the liquid on at least one of the substrate and the stage, wherein the detector is configured to detect the liquid conveyed along a conveyance path along which the substrate is conveyed from a position below the projection optical system to a position from which the substrate is conveyed out from the exposure apparatus.

Abstract: A method of holding an object with an electrostatic chuck and conveying the held object includes steps of measuring a property of the object concerning an electrostatic attraction force generated between the object and the electrostatic chuck; and controlling a characteristic of conveyance of the object based on a measurement result in the measuring step.

Abstract: The object of this invention is to provide a technique of effectively purging a space almost closed with a master and pellicle film with inert gas in an exposure apparatus which uses ultraviolet rays as exposure light, purges the interior of the apparatus with inert gas, and projects the pattern of a master onto a photosensitive substrate via a projection optical system. To achieve this object, a plurality of vent holes are formed in a structure obtained by surrounding by a surrounding member a gas purge space to be purged with inert gas. A vessel which forms a space around the structure is filled with inert gas to cause inert gas to enter the gas purge space, purging the gas purge space with inert gas.

Abstract: A reticle (23) with a pellicle is movably set on a reticle support table (28). An inert gas supply portion (29) and inert gas exhaust portion (37) are so driven as to sandwich a pellicle frame (25), and align the pellicle frame (25). The inert gas supply portion (29) and inert gas exhaust portion (37) are brought into tight contact with the pellicle frame (25). In this state, inert gas is supplied from the inert gas supply portion (29) into the pellicle space via a vent hole (27) of the pellicle frame (25). Inert gas is exhausted to the inert gas exhaust portion (37) via a vent hole (27) formed on the opposite side.

Abstract: An exposure apparatus includes a pellicle support frame which has a freely openable/closable lid and forms a pellicle space by using a pellicle film, and a pattern of a master facing the pellicle space is transferred onto a photosensitive substrate via a projection optical system. The apparatus includes a mechanism which opens/closes the lid, a nozzle arranged by selecting at least either one of a gas supply nozzle and a discharge nozzle, wherein at least either one of a gas supply and discharge is performed for the pellicle space via the selected nozzle, a device for measuring flexure of the pellicle film, a pressure detection device for detecting either one of a gas supply pressure and a discharge pressure, and a pressure control device for controlling the pressure detected by the pressure detection device.

Abstract: The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.

Abstract: The object of this invention is to provide a technique of effectively purging a space almost closed with a master and pellicle film with inert gas in an exposure apparatus which uses ultraviolet rays as exposure light, purges the interior of the apparatus with inert gas, and projects the pattern of a master onto a photosensitive substrate via a projection optical system. To achieve this object, a plurality of vent holes are formed in a structure obtained by surrounding by a surrounding member a gas purge space to be purged with inert gas. A vessel which forms a space around the structure is filled with inert gas to cause inert gas to enter the gas purge space, purging the gas purge space with inert gas.

Abstract: A reticle (23) with a pellicle is movably set on a reticle support table (28). An inert gas supply portion (29) and inert gas exhaust portion (37) are so driven as to sandwich a pellicle frame (25), and align the pellicle frame (25). The inert gas supply portion (29) and inert gas exhaust portion (37) are brought into tight contact with the pellicle frame (25). In this state, inert gas is supplied from the inert gas supply portion (29) into the pellicle space via a vent hole (27) of the pellicle frame (25). Inert gas is exhausted to the inert gas exhaust portion (37) via a vent hole (27) formed on the opposite side.

Abstract: Gas purge is performed in a pellicle space surrounded by a reticle and pellicle film. First and second openable/closable lids are attached to a pellicle support frame. Lid suction nozzle proximity mechanisms and lid suction nozzles for opening/closing the first and second lids of the pellicle support frame, inert gas supply and discharge nozzles, a pellicle flexure measurement unit for measuring the flexure of the pellicle film, and an impurity detection device for measuring an impurity concentration in the pellicle space are inserted in a reticle transfer path. Gas for gas purge is supplied into the pellicle space.

Abstract: The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.