Abstract: This invention relates to a method of forming a plating layer on ceramic chip surfaces by electroless plating, and to electronic parts manufactured by this method. Such electronic parts include a metal film fixed resistor, a capacitor, a resistor for sensing purposes and a patterned substrate, for example. Ceramic chips are immersed in a plating solution containing chromium chloride, nickel sulfide, sodium hypophosphite, a chelating agent and thiourea. Then each ceramic chip is coated with a plating layer by electroless nickel plating while adjusting pH value of the plating solution with a pH regulating liquid. The resulting electronic parts have an initial resistance of 0.02 to 100 ohm or more and a temperature coefficient of resistance of a two-digit figure or less in ppm.

Abstract: A barrel plating apparatus for forming, by electroplating or electroless plating, a layer on surfaces of articles formed of ceramics such as zirconia for use as resistors, condensors or other electrical parts or elements mounted on printed circuit boards, for example. The apparatus comprises a hollow barrel rotatably supported by a pair of vertical plates spaced apart from each other, and unrotatable agitators housed in the barrel and including a plurality of agitating balls for agitating the articles under plating treatment. The barrel in rotation and the agitating balls produce a combined effect for agitating the articles to the full. The articles are thus plated with coatings of uniform thickness and reliable adhesion.